JPH0494648U - - Google Patents
Info
- Publication number
- JPH0494648U JPH0494648U JP1990406069U JP40606990U JPH0494648U JP H0494648 U JPH0494648 U JP H0494648U JP 1990406069 U JP1990406069 U JP 1990406069U JP 40606990 U JP40606990 U JP 40606990U JP H0494648 U JPH0494648 U JP H0494648U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/10155—Shape being other than a cuboid
- H01L2924/10156—Shape being other than a cuboid at the periphery
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dot-Matrix Printers And Others (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990406069U JP2504538Y2 (ja) | 1990-12-29 | 1990-12-29 | Ｌｅｄアレイ装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990406069U JP2504538Y2 (ja) | 1990-12-29 | 1990-12-29 | Ｌｅｄアレイ装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0494648U true JPH0494648U (enrdf_load_stackoverflow) | 1992-08-17 |
| JP2504538Y2 JP2504538Y2 (ja) | 1996-07-10 |
Family
ID=31883387
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990406069U Expired - Lifetime JP2504538Y2 (ja) | 1990-12-29 | 1990-12-29 | Ｌｅｄアレイ装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2504538Y2 (enrdf_load_stackoverflow) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63177478A (ja) * | 1987-01-16 | 1988-07-21 | Fuji Xerox Co Ltd | 光プリンタ用発光ダイオ−ドアレイ |
| JPS63278285A (ja) * | 1987-01-16 | 1988-11-15 | Fuji Xerox Co Ltd | 光プリンタ用発光ダイオ−ドアレイとその製造方法 |
| JPH03192779A (ja) * | 1989-12-21 | 1991-08-22 | Kyocera Corp | 発光ダイオード |
-
1990
- 1990-12-29 JP JP1990406069U patent/JP2504538Y2/ja not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63177478A (ja) * | 1987-01-16 | 1988-07-21 | Fuji Xerox Co Ltd | 光プリンタ用発光ダイオ−ドアレイ |
| JPS63278285A (ja) * | 1987-01-16 | 1988-11-15 | Fuji Xerox Co Ltd | 光プリンタ用発光ダイオ−ドアレイとその製造方法 |
| JPH03192779A (ja) * | 1989-12-21 | 1991-08-22 | Kyocera Corp | 発光ダイオード |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2504538Y2 (ja) | 1996-07-10 |