JPH0492800U - - Google Patents
Info
- Publication number
- JPH0492800U JPH0492800U JP40255790U JP40255790U JPH0492800U JP H0492800 U JPH0492800 U JP H0492800U JP 40255790 U JP40255790 U JP 40255790U JP 40255790 U JP40255790 U JP 40255790U JP H0492800 U JPH0492800 U JP H0492800U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP40255790U JPH0647678Y2 (ja) | 1990-12-28 | 1990-12-28 | 穿孔装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP40255790U JPH0647678Y2 (ja) | 1990-12-28 | 1990-12-28 | 穿孔装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0492800U true JPH0492800U (enrdf_load_stackoverflow) | 1992-08-12 |
JPH0647678Y2 JPH0647678Y2 (ja) | 1994-12-07 |
Family
ID=31880454
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP40255790U Expired - Lifetime JPH0647678Y2 (ja) | 1990-12-28 | 1990-12-28 | 穿孔装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0647678Y2 (enrdf_load_stackoverflow) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20010020807A (ko) | 1999-05-03 | 2001-03-15 | 조셉 제이. 스위니 | 고정 연마재 제품을 사전-조절하는 방법 |
US7303662B2 (en) | 2000-02-17 | 2007-12-04 | Applied Materials, Inc. | Contacts for electrochemical processing |
US7077721B2 (en) | 2000-02-17 | 2006-07-18 | Applied Materials, Inc. | Pad assembly for electrochemical mechanical processing |
US7374644B2 (en) | 2000-02-17 | 2008-05-20 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
US6979248B2 (en) | 2002-05-07 | 2005-12-27 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
US7059948B2 (en) | 2000-12-22 | 2006-06-13 | Applied Materials | Articles for polishing semiconductor substrates |
US6991528B2 (en) | 2000-02-17 | 2006-01-31 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
US7303462B2 (en) | 2000-02-17 | 2007-12-04 | Applied Materials, Inc. | Edge bead removal by an electro polishing process |
US7029365B2 (en) | 2000-02-17 | 2006-04-18 | Applied Materials Inc. | Pad assembly for electrochemical mechanical processing |
US7125477B2 (en) | 2000-02-17 | 2006-10-24 | Applied Materials, Inc. | Contacts for electrochemical processing |
-
1990
- 1990-12-28 JP JP40255790U patent/JPH0647678Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0647678Y2 (ja) | 1994-12-07 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |