JPH0492659U - - Google Patents

Info

Publication number
JPH0492659U
JPH0492659U JP1990402358U JP40235890U JPH0492659U JP H0492659 U JPH0492659 U JP H0492659U JP 1990402358 U JP1990402358 U JP 1990402358U JP 40235890 U JP40235890 U JP 40235890U JP H0492659 U JPH0492659 U JP H0492659U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990402358U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990402358U priority Critical patent/JPH0492659U/ja
Publication of JPH0492659U publication Critical patent/JPH0492659U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
JP1990402358U 1990-12-27 1990-12-27 Pending JPH0492659U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990402358U JPH0492659U (enExample) 1990-12-27 1990-12-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990402358U JPH0492659U (enExample) 1990-12-27 1990-12-27

Publications (1)

Publication Number Publication Date
JPH0492659U true JPH0492659U (enExample) 1992-08-12

Family

ID=31880286

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990402358U Pending JPH0492659U (enExample) 1990-12-27 1990-12-27

Country Status (1)

Country Link
JP (1) JPH0492659U (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008258336A (ja) * 2007-04-04 2008-10-23 Toyoda Gosei Co Ltd 発光装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6431473A (en) * 1987-07-27 1989-02-01 Sharp Kk 2-color light emitting element
JPH0355888A (ja) * 1989-07-25 1991-03-11 Toshiba Corp 光半導体装置
JPH0482279A (ja) * 1990-07-24 1992-03-16 Toshiba Corp 半導体装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6431473A (en) * 1987-07-27 1989-02-01 Sharp Kk 2-color light emitting element
JPH0355888A (ja) * 1989-07-25 1991-03-11 Toshiba Corp 光半導体装置
JPH0482279A (ja) * 1990-07-24 1992-03-16 Toshiba Corp 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008258336A (ja) * 2007-04-04 2008-10-23 Toyoda Gosei Co Ltd 発光装置

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