JPH0491199A - Cleanser for rosin solder flux and method for cleansing rosin solder flux with the cleanser - Google Patents

Abstract

PURPOSE:To provide the subject cleanser without problem of ozone layer decomposition. reduced in odors and satisfied with non-flammability by compounding a mixture of a specific glycol ether compound. a nonionic surfactant and a basic amino acid as active ingredients. CONSTITUTION:The objective cleanser contains a mixture of (A) a glycol ether compound of the formula (R<1> is H, 1-5C alkyl; R<2> is 1-5C alkyl, R<3> is H, methyl; m is 2-4) (e.g. diethylene glycol monomethyl ether). (B) a nonionic surfactant (preferably polyethylene glycol ether type surfactant) and (C) a basic amino acid (preferably arginine lysine) preferably in an A:B:C ratio of 70-90:5-30:0.5-10wt.% as active components.

Description

Detailed Description of the Invention (Field of Industrial Application) The present invention relates to a cleaning agent for rosin-based solder flux, particularly a cleaning agent for rosin-based solder flux for assembly, and a cleaning agent for rosin-based solder flux using the cleaning agent. Regarding the method.

(Prior Art) Rosin-based solder flux is used in the production of modules such as printed circuit boards and printed wiring boards. The purpose of soldering is generally to increase the adhesive strength between the board and the input/output pins, and to prevent oxidation of the contacts and maintain conductivity. Solder flux is used. After soldering is completed, a cleaning agent is used to selectively and completely remove only the flux from the board surface. In other words, if the flux is not sufficiently cleaned, the residual flux may cause circuit corrosion, or the electrical insulation of the board surface may deteriorate.
This has the disadvantage of ultimately leading to circuit damage. Therefore, by using a cleaning agent to remove the residual flux, especially the activator component contained in it, 11
The disadvantages listed in j have been resolved.

Conventionally, halogenated hydrocarbon preparations such as so-called chlorofluorocarbons such as trichlorethylene and trichlorotrifluoroethane have been used as cleaning agents for rosin-based solder flux. However, due to environmental pollution problems such as ozone layer depletion, restrictions on the use of such halogenated hydrocarbon solvents are becoming more serious, and the development of so-called fluorocarbon substitute solder flux cleaning agents has become an urgent need in the electronics industry. .

Recently, various non-halogen solder flux cleaning agents have been developed. For example, in the case of the alkaline saponification type, there is no flammability problem because it is a water-based liquid type, but cleaning efficiency is low because it requires long-term contact with the liquid under heating. There are disadvantages such as concerns about corrosion of the metal parts of the board.

On the other hand, although non-alkaline saponification type cleaning agents have been developed, the current situation is that no one has yet been found that completely satisfies all required performance such as cleaning power, toxicity, odor, and flammability. .

Therefore, the inventors of the present invention are working hard to solve the above-mentioned problems. As a result of repeated studies, it was discovered that the above-mentioned problems could be solved when a specific glycol ether compound and a nonionic surfactant were used as essential components, and the authors disclosed in Japanese Patent Application No. 1-291905. The invention has been completed and a patent application has already been filed.

If the solder flux cleaning agent can maintain sufficient cleaning power even when diluted with water, the benefits include reducing the risk of ignition of the cleaning agent, reducing the cost of the cleaning agent, and significantly reducing the burden of wastewater treatment. The above-mentioned patent application specification also describes that the cleaning agent is used after being diluted with water. However, even according to the invention, when used diluted with water, there is a tendency for the detergency to decrease.

(Problems to be Solved by the Invention) The present invention provides a non-halogen solder flux cleaning product that has excellent cleaning power, especially when diluted with water, and is substantially satisfactory in terms of environmental characteristics, odor, and flammability. An object of the present invention is to provide a cleaning agent and a cleaning method using the cleaning agent.

(Means for Solving the Problems) In order to achieve the above-mentioned object, the present inventors have made intensive studies and found that a specific glycol ether compound, a nonionic surfactant, and a specific amino acid are essential components. The present inventors have found that problem 1iii can be solved when a mixture is used, and have completed the present invention.

That is, the present invention.

■General formula (1): % formula % (In the formula, R1 is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, R2 is an alkyl group having 1 to 5 carbon atoms, R3 is a hydrogen atom or a methyl group, m represents an integer of 2 to 4), a nonionic surfactant, and a mixture of basic amino acids as an active ingredient. The present invention relates to a cleaning agent for rosin-based solder flux, and a method for cleaning rosin-based solder flux, which is characterized by bringing the cleaning agent into contact with rosin-based solder flux.

Among the components of the cleaning agent for the rosin-based solder flux of the present invention, the glycol ether compounds represented by the general formula (1) include diethylene glycol dimethyl ether, diethylene glycol dimethyl ether, diethylene glycol monoethyl ether, and diethylene glycol diethyl ether. Dell, diethylene glycol methyl ethyl ether, diethylene glycol monopropyl ether, diethylene glycol dipropyl ether, diethylene glycol methyl propyl ether, diethylene glycol ethyl propyl ether, diethylene glycol monobutyl ether, diethylene glycol dibutyl ether, diethylene glycol methyl butyl ether, diethylene glycol ethyl butyl ether, diethylene glycol propyl butyl ether, diethylene glycol Monopentyl ether, diethylene glycol dibutyl ether, diethylene glycol methyl pentyl ether, diethylene glycol ethyl pentyl ether, diethylene glycol probyl pentyl ether, diethylene glycol butyl pentyl ether:
Examples include tri- or tetraethylene glycol ethers corresponding to these; and di-, tri- or tetrapropylene glycol ethers corresponding to these. These compounds can be used alone or in an appropriate combination of two or more.

Among the components of the rosin-based solder flux cleaning agent of the present invention, the nonionic surfactant is not particularly limited as long as its ionicity is nonionic, and various known surfactants may be used. Specific examples include polyethylene glycol ether type nonionic surfactants such as polyoxyethylene alkyl (ci<) ether, polyoxyethylene phenol ether, polyoxyethylene alkyl phenol ether; polyethylene glycol monoester, polyethylene glycol diester, etc. Glycol ester type nonionic surfactants; ethylene oxide adducts of higher aliphatic amines; ethylene oxide adducts of fatty acid amides; polyhydric alcohol type nonionic surfactants such as sorbitan fatty acid esters and sucrose fatty acid esters; fatty acid alkanolamides Such.

Furthermore, corresponding polyoxypropylene type nonionic surfactants and polyoxyethylene polyoxybrobylene copolymer type nonionic surfactants can be mentioned. These nonionic surfactants can be used alone or in combination of two or more.

Among these, the preferred ones in terms of cleaning power are:
A polyethylene glycol ether type nonionic surfactant, more preferably one represented by the following general formula (2)
The following are applicable.

R' O-(CH, CH, O), -H (wherein R4 is a straight or branched alkyl group having 6 to 20 carbon atoms, preferably 10 to 14 carbon atoms, or a phenyl group.

or a phenyl group substituted with a linear or branched alkyl group having 7 to 12 carbon atoms, where n is an integer of 2 to 20, preferably an integer of 3 to 16. ) The cleaning agent for the rosin-based solder flux of the present invention is the glycol ether (A).
In addition to the nonionic surfactant IB), it is essential to contain a basic amino acid as a third component. The basic amino acids include those without a heterocycle such as arginine and lysine, and those with a heterocycle such as histidine, tryptophan, proline, and oxyproline, and these may be used alone or in combination. I can do it. Preferably, arginine and lysine are applicable. Although there are many types of amino acids in addition to those mentioned above, none of them can serve as the third component that achieves the purpose of the present invention.

The proportions of the above fA) component, +B) component, and [C) component are not particularly limited, but 1 usually - is about 10 to 95 weight i in order, 5 to 9011 grade: about 0.1 to 20 weight N%. Yes, preferably about 70 to 90% by weight = 5 to 3
The weight is about 0.011 and about 0.5 to 10 weight.

The cleaning agent of the present invention comprising the fAl component, fBl component and fc) component is applied to cleaning rosin-based solder flux, particularly rosin-based solder flux for assembly. The flux includes an inactive rosin flux mainly composed of rosins such as rosin and modified rosin, and rosins and activators (for example, triethanolamine hydrochloride, triethylenetetramine hydrochloride, cyclohexylamine hydrochloride, etc.). Activated rosin fluxes whose main components are organic or inorganic acid salts of amine compounds such as aniline hydrochloride are common. If necessary, additives such as antifoaming agents and antioxidants can be added, and the amount of these additives used is about 0.1z or less relative to the cleaning agent. The cleaning agent of the present invention has great significance when used as an active rosin flux for assembly.

The following means are employed to bring the cleaning agent of the present invention into contact with the rosin flux on the substrate. That is, the active ingredients of the present invention (Al component, fil component, and tcr
The cleaning agent consisting of the ingredients is adjusted as it is or dissolved in water so that the concentration of the active ingredient is usually less than 100% to about 10% by weight. A method of directly immersing the substrate in the thus obtained aqueous solution or the active ingredient itself for cleaning, a method of flushing out the water using a spray device, a method of cleaning while brushing with a mechanical hand 9, etc. are selected as appropriate. and can be adopted. Conditions for applying the cleaning agent of the present invention may be appropriately selected depending on the concentration of the active ingredient in the cleaning agent, the usage ratio of the ingredient, the type of flux to be removed, etc. Generally, the flux to be removed is cleaned. Contact the cleaning agent with the flux at a temperature and time effective to remove it. The temperature during use of the cleaning agent is from about room temperature to about 80°C, and is usually preferably about 50 to 70°C. When removing solder flux on a board by dipping at a temperature of, for example, 50 to 70°C, -M can be effectively removed by immersing the board with solder flux in the cleaning agent of the present invention for about 1 to 5 minutes. can be removed.

The substrate from which the flux has been removed is preferably washed with water as a finishing treatment to completely remove any cleaning agent that may remain. By such water washing treatment, the cleanliness of the substrate becomes extremely high. The cleaning agent of the present invention exhibits flux cleaning effects similar to or better than those using conventional halogenated hydrocarbon cleaning agents,
Achieve a high level of substrate cleanliness.

(Example) Hereinafter, the present invention will be explained in more detail with reference to Examples.
The present invention is not limited only to these examples.

Example 1 59.5 parts by weight of diethylene glycol dimethyl ether and a polyethylene glycol alkyl ether type nonionic surfactant (manufactured by Daiichi Kogyo Seiyaku ■, trade name [Neugen E])
T-135J, in general formula (2), R4 has 1 carbon number
2 to 14 branched alkyl groups, n is 9) 9.4
5 parts by weight, 1.05 parts by weight of arginine, and 3 parts by weight of pure water
A cleaning agent of the present invention was prepared by mixing 0 parts by weight.

On the other hand, apply rosin-based flux (manufactured by LONCO, trade name: Re5in) to the entire surface of the printed wiring board (copper-clad laminate).
Flux #77-25 J) was applied and heated to 130°C.
After drying for 2 minutes at 260° C., solder flow was performed at 260° C. for 5 seconds to prepare a test board.

This substrate was immersed in the above cleaning agent at room temperature, and the degree of flux removal was visually evaluated based on the following criteria. The results are shown in Table 1.

○ Can be removed well △ Slightly remaining × Significantly remaining Next, after washing and drying the above substrate, the cleanliness of the substrate (residual ion concentration ) was measured.

The results are shown in Table 1.

Examples 2 to 6J5 and Comparative Example 1 Evaluations were conducted in the same manner as in Example 1, except that the composition ratio of the cleaning agent or the immersion temperature during cleaning were changed as shown in Table 1. The results are shown in Table 1.

Examples 7 to 13 and Comparative Examples 2 to 6 In Example 1, fAl component, iB+ component, and FC
Evaluations were conducted in the same manner except that at least one of the + components was changed as shown in Table 1. The results are shown in Table 1.

The surfactants used (component (B)) in Table 1 were [Solgen Tw20J (manufactured by Dai-Kogyo Seiyaku ■, polyoxyethylene sorbitan monolaurate, average number of added moles of ethylene oxide 12), "Evan 420" ( Polyoxyethylene polyoxybrobylene block polymer (manufactured by Dai-Kogyo Yakuhin Aji Co., Ltd.) [Margins below] It is as follows.

[Noigen EA-120J (manufactured by Daiichi Kogyo Seiyaku ■, polyethylene glycol nonylphenyl ether type nonionic surfactant, in general formula (2), R4 is a nonylphenyl group, and n is 5), polyethylene glycol decylphenyl Ether-type nonionic surfactant (manufactured by Dai-ichi Kogyo Seiyaku ■, trade name: "Neugen EA-143J")
, in the general formula (2), R4 is a dodecylphenyl group, and n is 10) (Effects of the present invention) According to the present invention, the following effects are achieved (1) The cleaning agent of the present invention is a non-containing Since it is a halogen-based cleaning agent, it does not cause the problem of ozone layer depletion that occurs with fluorocarbon-based cleaning agents.

(2) Since the cleaning agent of the present invention contains the glycoyl ether compound described in 1ii7, it has a flash point itself in the absence of water. ．． Since the temperature is around 70℃ and it belongs to the Type 3 petroleum class according to the Japanese Fire Service Act, there is no need to use a special explosion-proof cleaning device when using it, and it can be used for conventional Freon cleaning. It is possible to easily use various types of city riot cleaning equipment that have been used as is or by modifying the specifications.

(3) When the cleaning agent of the present invention is used after being diluted with water,
It is possible to reduce the risk of ignition of the cleaning agent, to lower the cost of the cleaning agent, to significantly reduce the υ1 water treatment load, and moreover, to maintain sufficient cleaning power.

(4) What about the present invention? 'Ic/43 agent has very little odor, and even this review is satisfactory.

As described above, according to the present invention, a non-halogen solder flux FC detergent that has high cleaning power and is fully satisfactory despite environmental damage, flammability, odor, etc., and a solder flux using this detergent are provided. A method of cleaning franks is provided.

Arakawa Chemical Industry Co., Ltd.

Claims (1)

[Claims] [1] General formula (1): ▲There are mathematical formulas, chemical formulas, tables, etc.▼ (In the formula, R^1 is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, and R^2 is an alkyl group having 1 to 5 carbon atoms, R^3 represents a hydrogen atom or a methyl group, and m represents an integer of 2 to 4)
A rosin-based solder containing as an active ingredient a mixture consisting of at least one of the glycol ether compounds (A), a nonionic surfactant (B), and a basic amino acid (C). Flux cleaning agent. [2] The nonionic surfactant (B) has the general formula (2
): R^4O-(CH_2CH_2O)_n-H (in the formula, R
^4 is a straight chain or branched alkyl group having 6 to 20 carbon atoms, a phenyl group, or a phenyl group substituted with a straight chain or branched alkyl group having 7 to 12 carbon atoms, and n is 2 to 2
Indicates an integer of 0. ) The cleaning agent according to claim 1, which is a surfactant represented by: [3] The basic amino acid (C) is arginine and/or
The cleaning agent according to claim 1 or 2, which is ricin or ricin. [4] The usage ratio of the glycol ether compound (A), nonionic surfactant (B), and basic amino acid (C) is 10 to 95% by weight: 5 to 90% by weight: 0.1 to
The cleaning agent according to any one of claims 1 to 3, which contains 20% by weight. [5] A method for cleaning rosin-based solder flux, which comprises bringing the cleaning agent according to any one of claims 1 to 4 into contact with rosin-based solder flux.