JPH0488064U - - Google Patents
Info
- Publication number
- JPH0488064U JPH0488064U JP1990400965U JP40096590U JPH0488064U JP H0488064 U JPH0488064 U JP H0488064U JP 1990400965 U JP1990400965 U JP 1990400965U JP 40096590 U JP40096590 U JP 40096590U JP H0488064 U JPH0488064 U JP H0488064U
- Authority
- JP
- Japan
- Prior art keywords
- boot
- bellows
- equipment element
- steering
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990400965U JP2529475Y2 (ja) | 1990-12-19 | 1990-12-19 | 反射型フオトインタラプタ |
| US07/808,857 US5291038A (en) | 1990-12-19 | 1991-12-18 | Reflective type photointerrupter |
| DE69111211T DE69111211T2 (de) | 1990-12-19 | 1991-12-19 | Photoelektrisches Schaltgerät vom Reflektionstyp. |
| EP91311917A EP0493051B1 (en) | 1990-12-19 | 1991-12-19 | Reflective type photo-interrupter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990400965U JP2529475Y2 (ja) | 1990-12-19 | 1990-12-19 | 反射型フオトインタラプタ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0488064U true JPH0488064U (US08088918-20120103-C00476.png) | 1992-07-30 |
| JP2529475Y2 JP2529475Y2 (ja) | 1997-03-19 |
Family
ID=31879136
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990400965U Expired - Lifetime JP2529475Y2 (ja) | 1990-12-19 | 1990-12-19 | 反射型フオトインタラプタ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2529475Y2 (US08088918-20120103-C00476.png) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54100678A (en) * | 1978-01-25 | 1979-08-08 | Omron Tateisi Electronics Co | Photo coupler |
| JPS5652951A (en) * | 1979-10-08 | 1981-05-12 | Japanese National Railways<Jnr> | Data transmission system |
| JPS60221701A (ja) * | 1984-04-19 | 1985-11-06 | Sumitomo Bakelite Co Ltd | 透明難燃性樹脂硬化物で被覆された光学素子 |
| JPS61167575A (ja) * | 1985-01-21 | 1986-07-29 | Rohm Co Ltd | サ−マルプリントヘツド |
| JPS635701U (US08088918-20120103-C00476.png) * | 1986-06-28 | 1988-01-14 | ||
| JPS63274188A (ja) * | 1987-05-06 | 1988-11-11 | Sharp Corp | 光結合素子 |
-
1990
- 1990-12-19 JP JP1990400965U patent/JP2529475Y2/ja not_active Expired - Lifetime
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54100678A (en) * | 1978-01-25 | 1979-08-08 | Omron Tateisi Electronics Co | Photo coupler |
| JPS5652951A (en) * | 1979-10-08 | 1981-05-12 | Japanese National Railways<Jnr> | Data transmission system |
| JPS60221701A (ja) * | 1984-04-19 | 1985-11-06 | Sumitomo Bakelite Co Ltd | 透明難燃性樹脂硬化物で被覆された光学素子 |
| JPS61167575A (ja) * | 1985-01-21 | 1986-07-29 | Rohm Co Ltd | サ−マルプリントヘツド |
| JPS635701U (US08088918-20120103-C00476.png) * | 1986-06-28 | 1988-01-14 | ||
| JPS63274188A (ja) * | 1987-05-06 | 1988-11-11 | Sharp Corp | 光結合素子 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2529475Y2 (ja) | 1997-03-19 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |