JPH0488064U - - Google Patents

Info

Publication number
JPH0488064U
JPH0488064U JP1990400965U JP40096590U JPH0488064U JP H0488064 U JPH0488064 U JP H0488064U JP 1990400965 U JP1990400965 U JP 1990400965U JP 40096590 U JP40096590 U JP 40096590U JP H0488064 U JPH0488064 U JP H0488064U
Authority
JP
Japan
Prior art keywords
boot
bellows
equipment element
steering
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1990400965U
Other languages
Japanese (ja)
Other versions
JP2529475Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990400965U priority Critical patent/JP2529475Y2/en
Priority to US07/808,857 priority patent/US5291038A/en
Priority to EP91311917A priority patent/EP0493051B1/en
Priority to DE69111211T priority patent/DE69111211T2/en
Publication of JPH0488064U publication Critical patent/JPH0488064U/ja
Application granted granted Critical
Publication of JP2529475Y2 publication Critical patent/JP2529475Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案による実施例の機器要素への固
定部と蛇腹部を結ぶ連結部のステアリングブーツ
の軸方向断面図、第２図は第１図の実施例を収縮
させて第４図―ｂの状態にした軸方向断面図、第
３図は従来の機器要素への固定部と蛇腹部を結ぶ
連結部のステアリングブーツの軸方向断面部分図
、第４図は本考案による実施例のステアリングブ
ーツの上記連結部の収縮時の挙動を示す部分断面
図、第５図は従来のステアリングブーツの上記連
結部の収縮時の挙動を示す部分断面図である。 １，１１……ステアリングブーツ、２，２′，
１２……固定部、３，１３……蛇腹部、３ａ，３
ａ′，１３ａ……蛇腹部端部、３ｂ，１３ｂ……
蛇腹部山部、４，４′，１４……連結部、５，５
′……連結部のＲ又はＲ′の中心点、６，６′，
１６……固定部付近。 Fig. 1 is an axial sectional view of a steering boot of a connecting part connecting a fixing part to an equipment element and a bellows part according to an embodiment of the present invention, and Fig. 2 shows a state in which the embodiment of Fig. 1 is contracted. Fig. 3 is a partial axial cross-sectional view of the steering boot of the connection part connecting the fixing part to the conventional equipment element and the bellows part, and Fig. 4 shows the steering according to the embodiment of the present invention. FIG. 5 is a partial cross-sectional view showing the behavior of the connecting portion of the boot when contracted. FIG. 5 is a partial cross-sectional view showing the behavior of the connecting portion of a conventional steering boot when contracted. 1, 11... Steering boots, 2, 2',
12... Fixed part, 3, 13... Bellows part, 3a, 3
a', 13a... end of bellows section, 3b, 13b...
Bellows crest, 4, 4', 14... Connection part, 5, 5
'...Center point of R or R' of the connecting part, 6,6',
16... Near the fixed part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 樹脂製フレキシブルブーツで、機器要素への固
定部と蛇腹部とを結ぶ連結部がブーツの外方へ向
けて凹型に湾曲している形状であることを特徴と
する樹脂製フレキシブルブーツ。 1. A flexible resin boot, characterized in that a connecting part connecting a part fixed to an equipment element and a bellows part is curved concavely toward the outside of the boot.
JP1990400965U 1990-12-19 1990-12-19 Reflective photo interrupter Expired - Lifetime JP2529475Y2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP1990400965U JP2529475Y2 (en) 1990-12-19 1990-12-19 Reflective photo interrupter
US07/808,857 US5291038A (en) 1990-12-19 1991-12-18 Reflective type photointerrupter
EP91311917A EP0493051B1 (en) 1990-12-19 1991-12-19 Reflective type photo-interrupter
DE69111211T DE69111211T2 (en) 1990-12-19 1991-12-19 Photoelectric switch device of the reflection type.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990400965U JP2529475Y2 (en) 1990-12-19 1990-12-19 Reflective photo interrupter

Publications (2)

Publication Number Publication Date
JPH0488064U true JPH0488064U (en) 1992-07-30
JP2529475Y2 JP2529475Y2 (en) 1997-03-19

Family

ID=31879136

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990400965U Expired - Lifetime JP2529475Y2 (en) 1990-12-19 1990-12-19 Reflective photo interrupter

Country Status (1)

Country Link
JP (1) JP2529475Y2 (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54100678A (en) * 1978-01-25 1979-08-08 Omron Tateisi Electronics Co Photo coupler
JPS5652951A (en) * 1979-10-08 1981-05-12 Japanese National Railways<Jnr> Data transmission system
JPS60221701A (en) * 1984-04-19 1985-11-06 Sumitomo Bakelite Co Ltd Optical element coated with cured transparent and flame-retardant resin
JPS61167575A (en) * 1985-01-21 1986-07-29 Rohm Co Ltd Thermal printing head
JPS635701U (en) * 1986-06-28 1988-01-14
JPS63274188A (en) * 1987-05-06 1988-11-11 Sharp Corp Optical coupling element

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54100678A (en) * 1978-01-25 1979-08-08 Omron Tateisi Electronics Co Photo coupler
JPS5652951A (en) * 1979-10-08 1981-05-12 Japanese National Railways<Jnr> Data transmission system
JPS60221701A (en) * 1984-04-19 1985-11-06 Sumitomo Bakelite Co Ltd Optical element coated with cured transparent and flame-retardant resin
JPS61167575A (en) * 1985-01-21 1986-07-29 Rohm Co Ltd Thermal printing head
JPS635701U (en) * 1986-06-28 1988-01-14
JPS63274188A (en) * 1987-05-06 1988-11-11 Sharp Corp Optical coupling element

Also Published As

Publication number Publication date
JP2529475Y2 (en) 1997-03-19

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term