JPH0488054U - - Google Patents

Info

Publication number
JPH0488054U
JPH0488054U JP40045490U JP40045490U JPH0488054U JP H0488054 U JPH0488054 U JP H0488054U JP 40045490 U JP40045490 U JP 40045490U JP 40045490 U JP40045490 U JP 40045490U JP H0488054 U JPH0488054 U JP H0488054U
Authority
JP
Japan
Prior art keywords
accumulation chamber
pressure accumulation
pressure
accumulator
hydraulic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP40045490U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP40045490U priority Critical patent/JPH0488054U/ja
Publication of JPH0488054U publication Critical patent/JPH0488054U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案を採用したクラツチ油圧制御装
置の回路図、第２図は油圧―クラツチトルク―時
間特性を示すグラフである。１０……第１アキユ
ームレータ、１１……入口油路、（油圧供給油路
の一部）、１２……出口油路、（油圧供給油路の
一部）、１３……チヤージポンプ、（油圧供給源
）、１５……切換弁、１７……第１蓄圧室、１８
……第１ピストン、１９……第１スプリング、２
０……連絡油路、２１……第２アキユームレータ
、２２……第２蓄圧室、２３……第２ピストン、
２４……第２スプリング。 FIG. 1 is a circuit diagram of a clutch hydraulic control device employing the present invention, and FIG. 2 is a graph showing hydraulic pressure-clutch torque-time characteristics. DESCRIPTION OF SYMBOLS 10...First accumulator, 11...Inlet oil path, (part of hydraulic supply oil path), 12...Outlet oil path, (part of hydraulic supply oil path), 13...Charge pump, (hydraulic supply source), 15... switching valve, 17... first pressure accumulation chamber, 18
...First piston, 19...First spring, 2
0... Communication oil passage, 21... Second accumulator, 22... Second pressure accumulation chamber, 23... Second piston,
24...Second spring.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 油圧供給源から切換弁まで延びる油圧供給油路
の間に配置される第１アキユームレータを備え、
上記第１アキユームレータは、上記油圧供給油路
に接続する第１蓄圧室と、第１蓄圧室に対向する
第１ピストンと、第１ピストンを第１蓄圧室側に
付勢する第１スプリングとを備えた油圧制御弁の
モジユレート機構において、上記第１アキユーム
レータと別体の第２アキユームレータを設け、上
記第２アキユームレータは、第２蓄圧室と、第２
蓄圧室に対向する第２ピストンと、第２ピストン
を第２蓄圧室側に付勢する第２スプリングとを備
え、上記第２蓄圧室は、第１ピストンの移動範囲
の中間位置に対応する第１蓄圧室の内壁面に開口
して上記第１ピストンにより開閉される連絡油路
と連通し、上記第１、第２スプリングのばね定数
及び第１、第２ピストンの直径を、上記第１蓄圧
室の油圧が所望の値に上昇したときに、第１蓄圧
室の作動油が上記連絡油路を介して第２蓄圧室に
供給されることにより、第１蓄圧室の油圧を所定
期間中、概ね一定に保持するようにそれぞれ設定
したことを特徴とする油圧制御弁のモジユレート
機構。 a first accumulator disposed between a hydraulic supply oil passage extending from a hydraulic pressure supply source to a switching valve;
The first accumulator includes a first pressure accumulation chamber connected to the hydraulic pressure supply oil passage, a first piston facing the first pressure accumulation chamber, and a first spring biasing the first piston toward the first pressure accumulation chamber. In the modulating mechanism for a hydraulic control valve, a second accumulator separate from the first accumulator is provided, and the second accumulator has a second pressure accumulator and a second accumulator.
The second pressure accumulation chamber includes a second piston that faces the pressure accumulation chamber and a second spring that biases the second piston toward the second pressure accumulation chamber, and the second pressure accumulation chamber has a second piston that faces the second pressure accumulation chamber. The spring constant of the first and second springs and the diameters of the first and second pistons are determined by the first pressure accumulation chamber, which opens on the inner wall surface of the first pressure accumulation chamber and communicates with a communication oil passage opened and closed by the first piston. When the oil pressure in the chamber rises to a desired value, the hydraulic oil in the first pressure accumulation chamber is supplied to the second pressure accumulation chamber through the communication oil passage, thereby increasing the oil pressure in the first pressure accumulation chamber for a predetermined period of time. A modulating mechanism for a hydraulic control valve, characterized in that each hydraulic pressure control valve is set to maintain a substantially constant value.
JP40045490U 1990-12-12 1990-12-12 Pending JPH0488054U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP40045490U JPH0488054U (en) 1990-12-12 1990-12-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP40045490U JPH0488054U (en) 1990-12-12 1990-12-12

Publications (1)

Publication Number Publication Date
JPH0488054U true JPH0488054U (en) 1992-07-30

Family

ID=31878697

Family Applications (1)

Application Number Title Priority Date Filing Date
JP40045490U Pending JPH0488054U (en) 1990-12-12 1990-12-12

Country Status (1)

Country Link
JP (1) JPH0488054U (en)

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