JPH0487775A - Resin bond superabrasive grain grinding wheel - Google Patents

Resin bond superabrasive grain grinding wheel

Info

Publication number
JPH0487775A
JPH0487775A JP20133490A JP20133490A JPH0487775A JP H0487775 A JPH0487775 A JP H0487775A JP 20133490 A JP20133490 A JP 20133490A JP 20133490 A JP20133490 A JP 20133490A JP H0487775 A JPH0487775 A JP H0487775A
Authority
JP
Japan
Prior art keywords
resin bond
grinding wheel
cbn
superabrasive grain
hardness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20133490A
Other languages
Japanese (ja)
Inventor
Tsuneo Egawa
Yukio Hiasa
Yukio Kigami
Akihisa Koizumi
Hajime Yoshioka
Original Assignee
Mitsubishi Heavy Ind Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Heavy Ind Ltd filed Critical Mitsubishi Heavy Ind Ltd
Priority to JP20133490A priority Critical patent/JPH0487775A/en
Publication of JPH0487775A publication Critical patent/JPH0487775A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To minutely control hardness of a resin bond so as to perform desired grinding suited for a workpiece and a grinding condition by providing an addition material, having a predetermined grain size, singly or mixedly through the resin bond in the vicinity of the periphery of CBN or diamond grains, and adjusting the hardness of the resin bond.
CONSTITUTION: A resin bond superabrasive grain grinding wheel 14 is formed by dispersedly providing CBN or diamond grains 10 in a resin bond 13. Here, hard grains 12, having a predetermined grain size, are provided singly or mixedly through the resin bond 13 in the vicinity of the periphery of the CBN or diamond grains 10 to adjust hardness of this resin bond 13.
COPYRIGHT: (C)1992,JPO&Japio
JP20133490A 1990-07-31 1990-07-31 Resin bond superabrasive grain grinding wheel Pending JPH0487775A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20133490A JPH0487775A (en) 1990-07-31 1990-07-31 Resin bond superabrasive grain grinding wheel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20133490A JPH0487775A (en) 1990-07-31 1990-07-31 Resin bond superabrasive grain grinding wheel

Publications (1)

Publication Number Publication Date
JPH0487775A true JPH0487775A (en) 1992-03-19

Family

ID=16439297

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20133490A Pending JPH0487775A (en) 1990-07-31 1990-07-31 Resin bond superabrasive grain grinding wheel

Country Status (1)

Country Link
JP (1) JPH0487775A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6383238B1 (en) 1999-08-17 2002-05-07 Mitsubishi Materials Corporation Resin bonded abrasive tool
JP2006062009A (en) * 2004-08-25 2006-03-09 Mitsubishi Materials Corp Resin-bond thin blade grinding wheel
JP2008528304A (en) * 2005-01-27 2008-07-31 アトランティック ゲゼルシャフト ミト ベシュレンクテル ハフツング Method and apparatus for polishing ceramic spheres
CN102601745A (en) * 2012-03-22 2012-07-25 湖南大学 Preparation method of resin binder diamond abrasive product used for accurate grinding

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6334070A (en) * 1986-07-29 1988-02-13 Mitsubishi Metal Corp Grindstone

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6334070A (en) * 1986-07-29 1988-02-13 Mitsubishi Metal Corp Grindstone

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6383238B1 (en) 1999-08-17 2002-05-07 Mitsubishi Materials Corporation Resin bonded abrasive tool
JP2006062009A (en) * 2004-08-25 2006-03-09 Mitsubishi Materials Corp Resin-bond thin blade grinding wheel
JP2008528304A (en) * 2005-01-27 2008-07-31 アトランティック ゲゼルシャフト ミト ベシュレンクテル ハフツング Method and apparatus for polishing ceramic spheres
CN102601745A (en) * 2012-03-22 2012-07-25 湖南大学 Preparation method of resin binder diamond abrasive product used for accurate grinding

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