JPH0487775A - Resin bond superabrasive grain grinding wheel - Google Patents
Resin bond superabrasive grain grinding wheelInfo
- Publication number
- JPH0487775A JPH0487775A JP20133490A JP20133490A JPH0487775A JP H0487775 A JPH0487775 A JP H0487775A JP 20133490 A JP20133490 A JP 20133490A JP 20133490 A JP20133490 A JP 20133490A JP H0487775 A JPH0487775 A JP H0487775A
- Authority
- JP
- Japan
- Prior art keywords
- resin bond
- resin
- cbn
- grains
- hardness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 title claims abstract description 41
- 229920005989 resin Polymers 0.000 title claims abstract description 41
- 238000000227 grinding Methods 0.000 title abstract description 24
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 14
- 239000010432 diamond Substances 0.000 claims abstract description 14
- 239000002245 particle Substances 0.000 claims description 36
- 239000000654 additive Substances 0.000 claims description 10
- 239000000463 material Substances 0.000 abstract description 5
- 230000000996 additive effect Effects 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 7
- QDOXWKRWXJOMAK-UHFFFAOYSA-N dichromium trioxide Chemical compound O=[Cr]O[Cr]=O QDOXWKRWXJOMAK-UHFFFAOYSA-N 0.000 description 6
- 239000006061 abrasive grain Substances 0.000 description 5
- 239000011247 coating layer Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 239000010410 layer Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- 229910052582 BN Inorganic materials 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004814 ceramic processing Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 238000009941 weaving Methods 0.000 description 1
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は、ＣＢＮ粒若しくはダイヤモンド粒をレジンボ
ンド（結合材）で固めて成ろレジンボンド超砥粒砥石に
関する。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a resin-bonded superabrasive grindstone made by hardening CBN grains or diamond grains with a resin bond (binding material).
〈従来の技術〉
ＣＢＮ （立方晶窒化硼素）粒若しくはダイヤモンド粒
を砥粒として用いてなるレジンボンド超砥粒砥石は、従
来より知られており、ＣＢＮ粒を用いたＣＢＮ砥石は主
に金属加工用に、又ダイヤモンド砥石は主にセラミック
ス加工層にそれぞれ使用されている。<Prior art> Resin-bonded superabrasive grinding wheels using CBN (cubic boron nitride) grains or diamond grains as abrasive grains have been known for a long time, and CBN grinding wheels using CBN grains are mainly used for metal processing. Diamond grinding wheels are mainly used for ceramic processing layers.
ＣＢＮ粒を用いたレジンボンド超砥粒砥石の構造として
は、一般にＣＢＮ粒には例えばＮｉ にッケル）等の
金属をコーティングしたＮｉコーティング層が設けられ
てお抄、該Ｎｉコーティング層の外表面には凸凹部が設
けられており、フェノール樹脂等のレジンボンドとの接
着性を高めている。The structure of a resin-bonded superabrasive grinding wheel using CBN grains is that the CBN grains are generally coated with a Ni coating layer coated with a metal such as Ni (nickel). is provided with uneven parts to improve adhesion with resin bonds such as phenolic resin.
また、とのレジンボンドの中には、その硬度（結合度）
をＩｇ整するための、例えばＳｉＣやＣｒ２Ｏ３等の１
０μｍ程度の硬質粒子を含有させている。In addition, the hardness (degree of bonding) of the resin bond with
For example, SiC, Cr2O3, etc.
It contains hard particles of about 0 μm.
この従来の砥石の製織としては、レジンボンドの粉体、
硬質粒子及びＣＢＮ粒を混練し、その混合物を焼成して
砥石を製造するようにしている。This conventional grindstone weaving process includes resin bond powder,
A grindstone is manufactured by kneading hard particles and CBN particles and firing the mixture.
〈発明が解決しようとする課題〉
ところで、従来のレジンボンド砥石は、マトリックスで
あるレジンボンド中に、ＳｉＣ等の硬質粒子を含有させ
てその結合度を調整しているものの、添加材のＳｉＣ等
の粒径が一定でありＷＮも豊富ではないので、レジンボ
ンドの硬度をｆＩｌＩＩＩ！ｌするためには、添加材で
ある硬質粒子の含有率を変化させるしか方法がなかった
。すなわち、同じ粒径の硬質粒子の個数の増減で硬度を
変化させていた。<Problems to be Solved by the Invention> By the way, in conventional resin bonded grindstones, hard particles such as SiC are contained in the resin bond matrix to adjust the degree of bonding. Since the grain size of is constant and WN is not abundant, the hardness of the resin bond is fIlIII! The only way to do this was to change the content of hard particles as additives. That is, the hardness was changed by increasing or decreasing the number of hard particles having the same particle size.
しかしながらこの方法では、レジンボンドの硬度（結合
度）の詳細な制御をすることができないという問題があ
り、加工ワーク、研削条件に見合ったレジンボンド超砥
粒砥石を製造できなかった。However, this method has the problem of not being able to precisely control the hardness (degree of bonding) of the resin bond, and it has not been possible to manufacture a resin bond superabrasive grindstone that is suitable for the processing work and grinding conditions.
く課題を解決するための手段〉
前記課題を解決する本発明に係ろレジンボンド超砥粒砥
石は、ＣＢＮ粒若しくはダイヤモンド粒をレジンボンド
中に散在させたレジンボンド超砥粒砥石であって、上記
ＣＢＮ粒若しくはダイヤモンド粒の外周近傍に所定の粒
径を有する硬質粒子をレジンボンドを介して単独で又は
混合して設けてなり、該レジンボンドの硬度を１１１１
１．たことを特徴とする。Means for Solving the Problems> A resin bonded superabrasive grindstone according to the present invention that solves the above problems is a resin bonded superabrasive grindstone in which CBN grains or diamond grains are interspersed in a resin bond, and comprises: Hard particles having a predetermined particle size are provided in the vicinity of the outer periphery of the CBN grains or diamond grains, alone or in combination via a resin bond, and the hardness of the resin bond is 1111.
1. It is characterized by:
以下、本発明の詳細な説明する。The present invention will be explained in detail below.
ここで本発明で添加材とは、例えばＳｉ３Ｎ４゜Ｂ１０
、 Ｓ ｉＣ、Ｃｒ２Ｏ３，ＷＣ、ＡＪ、０３等のセ
ラミックス粉末、ＣＢＮ粉末、ダイヤモンド粉末等の硬
質粒子をいい、マトリックスであるレジンボンドの硬度
（結合度）を変化させるため、七〇粒径を所望粒径（例
えば１μｍ〜５０μｍ）に設定し、これらを単独若しく
は複合させて、レジンボンドに添加するようにすればよ
い。Here, in the present invention, the additive material is, for example, Si3N4°B10
, refers to hard particles such as ceramic powders such as SiC, Cr2O3, WC, AJ, 03, CBN powder, diamond powder, etc. In order to change the hardness (bonding degree) of the resin bond that is the matrix, the desired particle size is 70. The particles may be set to a particle size (for example, 1 μm to 50 μm) and added to the resin bond singly or in combination.
具体的には、例えば、添加材の粒径を１μｍとし、その
レジンボンド中の体積含有率を１０ｖｏ１％としたもの
と、粒径５０μｍの添加材を１０ｖｏ１％含有させたも
のとでは超砥粒を保持する保持力が変わり、研削性能に
影響を及ぼす。そこで、それぞれの加工ワークや各研削
条件に合わせ添加材粒径を１μｍ〜５０μｍと所定粒径
に変化させ、最適な粒径の添加材によりレジンボンドの
硬度を制御する。又１μｍ〜５０μｍの粒径の添加材を
二重以上混合して含有させることでも異なった研削性能
を有する砥石を製作することができる。Specifically, for example, when the particle size of the additive is 1 μm and the volume content in the resin bond is 10 vol.1%, and when the additive material with a particle size of 50 μm is contained at 10 vol. The holding force that holds the material changes, which affects grinding performance. Therefore, the particle size of the additive is changed to a predetermined particle size of 1 μm to 50 μm in accordance with each workpiece and each grinding condition, and the hardness of the resin bond is controlled by the additive with the optimum particle size. Also, by mixing and containing two or more additives having particle sizes of 1 μm to 50 μm, grindstones having different grinding performances can be manufactured.
このように添加材として、硬質粒子の粒径を従来のもの
より小さく゛することにより、レジンボンドの均一性が
さらに向上し砥粒層の摩耗が均一となすＴｉＦ前性能が
向上する。逆に研削条件によっては超砥粒が容易に脱落
し加工ワークの面粗度を向上させたいものもあり、その
場合には、粒径の大きなものを用いるとよい。By making the particle size of the hard particles smaller than conventional ones as an additive in this way, the uniformity of the resin bond is further improved and the pre-TiF performance of making the abrasive layer wear uniform is improved. On the other hand, depending on the grinding conditions, there are cases where the superabrasive grains easily fall off and it is desired to improve the surface roughness of the processed workpiece, and in that case, it is better to use one with a large grain size.
また、本発明で超砥粒とはＣＢＮ （立方晶窒化硼素）
砥粒、ダイヤモンド砥粒をいい、これら砥粒の外周には
、例えば無電解法等の公知の手段によってＮｉ等の金属
をコーティングしたものを用いてもよい。In addition, in the present invention, superabrasive grains are CBN (cubic boron nitride).
This refers to abrasive grains and diamond abrasive grains, and the outer periphery of these abrasive grains may be coated with a metal such as Ni by a known method such as an electroless method.
く実 施 例〉
実施例１
第１図に示すように、ＣＢＮ粒１０の外周面に設けたＮ
ｉコーティング層１１の外周近傍には、添加材として粒
径２μｍの硬質粒子（ＳｉＣ又はＣｒ ２０．） １２
と粒径２０μｍの硬質粒子（ＳｉＣ又はＣｒ２０３）１
２とが共に１０ｖｏ１％づつフェノール樹脂を介して設
けられている。Example Example 1 As shown in FIG.
Near the outer periphery of the i-coating layer 11, hard particles (SiC or Cr 20.) 12 with a particle size of 2 μm are added as an additive.
and hard particles (SiC or Cr203) with a particle size of 20 μm 1
2 and 2 are provided through a phenol resin of 10vol% each.
この際、硬質粒子は同−重類であっても異覆類であって
もよい。ＣＢＮ粒度ば１７０メツシユ、集中度は１００
ｅｔ／ｃｃである。In this case, the hard particles may be homogeneous or metamorphic. CBN particle size is 170 mesh, concentration is 100
et/cc.
この得られたＣＢＮレジンボンド超砥粒砥石を用い、従
来の粒径１０μの硬質粒子で硬度を調整したＣＢＮレジ
ンボンド砥石とを絞べた結果、レジンボンドの均一性が
向上し、砥粒層の摩耗が均一となり、また高速研削にお
いてもａｉＦＦＩＩＪ性能が向上した。Using this obtained CBN resin bonded superabrasive grinding wheel, we were able to compare it with a conventional CBN resin bonded grinding wheel whose hardness was adjusted using hard particles with a grain size of 10 μm. As a result, the uniformity of the resin bond was improved and the abrasive grain layer was Wear became uniform, and aiFFIIJ performance improved even in high-speed grinding.
実施例２
第２図に示すような、ダイヤモンド砥粒１゜の外周面に
設けたＮｉコーティング層１１の外周近傍に、粒径１μ
ｍの硬質粒子（ＳｉＣ又はＣｒ２Ｏρ１２が１０ｖｏ１
％フェノール＠Ｉ！１１３を介して設けられたダイヤモ
ンドレジンボンド超砥粒砥石を製作した。Example 2 As shown in FIG.
m hard particles (SiC or Cr2Oρ12 is 10vol
%phenol@I! A diamond resin-bonded superabrasive grinding wheel provided through 113 was manufactured.
この得られたＣＢＮレジンボンド超砥粒砥石はレジンボ
ン〆の均一性の向上が図られ研削性能が向上した。The obtained CBN resin-bonded superabrasive grinding wheel had improved uniformity of resin bonding and improved grinding performance.
実施例３
ＣＢＮ粒１０の外周面に設けたＮｉコーティング層１１
の外刃近傍に、粒径５０ ｐｍの硬質粒子（ＳｉＣ又は
Ｃｒ２０３）１２が１０ｖｏ１％フェノール樹脂１３を
介して設けられたレジンボンド超砥粒砥石を製作した。Example 3 Ni coating layer 11 provided on the outer peripheral surface of CBN grains 10
A resin-bonded superabrasive grinding wheel was manufactured in which hard particles (SiC or Cr203) 12 with a particle size of 50 pm were provided via a 10vol% phenol resin 13 near the outer blade.
この得られた超砥粒砥石を用い研削したところ、超砥粒
のＣＢＮ粒が容易に脱落し、加工ワークの面粗度を向上
させることができた。When the obtained superabrasive grindstone was used for grinding, the CBN grains of the superabrasive easily fell off, and the surface roughness of the processed workpiece could be improved.
〈発明の効果〉
以上、実施例と共に述べたように本発明のレジンボンド
超砥粒砥石は、所定粒径を有する硬質粒子の粒径を重々
変化させてレジンボンドの硬度を＊＊ｔ、なので、レジ
ンボンドの硬度（結合度）の詳細な制−ができ、加工ワ
ーク、研削条件に合った所望の研削を行うことができる
という効果を奏する。<Effects of the Invention> As described above with the examples, the resin bonded superabrasive grinding wheel of the present invention can increase the hardness of the resin bond by repeatedly changing the particle size of hard particles having a predetermined particle size. The hardness (degree of bonding) of the resin bond can be controlled in detail, and the desired grinding can be performed in accordance with the workpiece and grinding conditions.
第１図は本発明の一実施例に係るレジンボンド超砥粒砥
石の部分拡大図、第２図は他の一実施例の部分拡大図、
第３図は別の−＊施例の部分拡大図である。
図 面 中、
１０はＣＢＮ粒若しくはダイヤモンド粒、１１はＮｉコ
ーティング層、
１２は硬質粒子、
１３はフェノールｖ！！脂、
１４はレジンボンド超砥粒砥石である。FIG. 1 is a partially enlarged view of a resin bonded superabrasive grindstone according to one embodiment of the present invention, FIG. 2 is a partially enlarged view of another embodiment,
FIG. 3 is a partially enlarged view of another -* embodiment. In the drawing, 10 is CBN grain or diamond grain, 11 is Ni coating layer, 12 is hard particle, and 13 is phenol v! ! 14 is a resin bond super abrasive grindstone.
Claims (1)
在させたレジンボンド超砥粒砥石であって、 上記ＣＢＮ粒若しくはダイヤモンド粒の外周近傍に所定
の粒径を有する添加材をレジンボンドを介して単独で又
は混合して設けてなり、該レジンボンドの硬度を調整し
たことを特徴とするレジンボンド超砥粒砥石。[Scope of Claims] A resin-bonded superabrasive grindstone in which CBN grains or diamond grains are scattered in a resin bond, wherein additives having a predetermined particle size are resin-bonded near the outer periphery of the CBN grains or diamond grains. 1. A resin bonded superabrasive grindstone, characterized in that the hardness of the resin bond is adjusted by providing the resin bond alone or in combination through the resin bond.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20133490A JPH0487775A (en) | 1990-07-31 | 1990-07-31 | Resin bond superabrasive grain grinding wheel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20133490A JPH0487775A (en) | 1990-07-31 | 1990-07-31 | Resin bond superabrasive grain grinding wheel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0487775A true JPH0487775A (en) | 1992-03-19 |
Family
ID=16439297
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20133490A Pending JPH0487775A (en) | 1990-07-31 | 1990-07-31 | Resin bond superabrasive grain grinding wheel |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0487775A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6383238B1 (en) | 1999-08-17 | 2002-05-07 | Mitsubishi Materials Corporation | Resin bonded abrasive tool |
| JP2006062009A (en) * | 2004-08-25 | 2006-03-09 | Mitsubishi Materials Corp | Resin-bond thin blade grinding wheel |
| JP2008528304A (en) * | 2005-01-27 | 2008-07-31 | アトランティック ゲゼルシャフト ミト ベシュレンクテル ハフツング | Method and apparatus for polishing ceramic spheres |
| CN102601745A (en) * | 2012-03-22 | 2012-07-25 | 湖南大学 | Preparation method of resin binder diamond abrasive product used for accurate grinding |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6334070A (en) * | 1986-07-29 | 1988-02-13 | Mitsubishi Metal Corp | Grindstone |
-
1990
- 1990-07-31 JP JP20133490A patent/JPH0487775A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6334070A (en) * | 1986-07-29 | 1988-02-13 | Mitsubishi Metal Corp | Grindstone |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6383238B1 (en) | 1999-08-17 | 2002-05-07 | Mitsubishi Materials Corporation | Resin bonded abrasive tool |
| JP2006062009A (en) * | 2004-08-25 | 2006-03-09 | Mitsubishi Materials Corp | Resin-bond thin blade grinding wheel |
| JP2008528304A (en) * | 2005-01-27 | 2008-07-31 | アトランティック ゲゼルシャフト ミト ベシュレンクテル ハフツング | Method and apparatus for polishing ceramic spheres |
| CN102601745A (en) * | 2012-03-22 | 2012-07-25 | 湖南大学 | Preparation method of resin binder diamond abrasive product used for accurate grinding |
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