JPH048627U - - Google Patents
Info
- Publication number
- JPH048627U JPH048627U JP4945990U JP4945990U JPH048627U JP H048627 U JPH048627 U JP H048627U JP 4945990 U JP4945990 U JP 4945990U JP 4945990 U JP4945990 U JP 4945990U JP H048627 U JPH048627 U JP H048627U
- Authority
- JP
- Japan
- Prior art keywords
- eaves
- decorative cover
- gutter
- building
- eaves gutter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Building Environments (AREA)
- Roof Covering Using Slabs Or Stiff Sheets (AREA)
Description
第１図はこの考案の実施例の断面図、第２図は
その屋根伏図、第３図はこの考案の他の実施例の
断面図である。 １２…軒樋兼軒先化粧カバー、１９，２２…建
物構造体、２０…下地部材。
その屋根伏図、第３図はこの考案の他の実施例の
断面図である。 １２…軒樋兼軒先化粧カバー、１９，２２…建
物構造体、２０…下地部材。
Claims (1)
- 下部が軒樋となつた軒樋兼軒先化粧カバーを建
物の軒先に沿つて配設し、前記軒樋兼軒先化粧カ
バーを下地部材を介して建物構造体に固定してな
る軒先構造。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4945990U JPH048627U (ja) | 1990-05-11 | 1990-05-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4945990U JPH048627U (ja) | 1990-05-11 | 1990-05-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH048627U true JPH048627U (ja) | 1992-01-27 |
Family
ID=31567171
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4945990U Pending JPH048627U (ja) | 1990-05-11 | 1990-05-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH048627U (ja) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53131622U (ja) * | 1977-03-25 | 1978-10-19 | ||
| JPS6015857U (ja) * | 1983-07-13 | 1985-02-02 | 池本 滋 | シ−ル材パツケ−ジ |
| JPS6460623A (en) * | 1987-08-31 | 1989-03-07 | Toshiba Corp | Epoxy resin composition for semiconductor sealing |
-
1990
- 1990-05-11 JP JP4945990U patent/JPH048627U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53131622U (ja) * | 1977-03-25 | 1978-10-19 | ||
| JPS6015857U (ja) * | 1983-07-13 | 1985-02-02 | 池本 滋 | シ−ル材パツケ−ジ |
| JPS6460623A (en) * | 1987-08-31 | 1989-03-07 | Toshiba Corp | Epoxy resin composition for semiconductor sealing |