JPH0486237A - Temperature-regulating mechanism for mold - Google Patents

Temperature-regulating mechanism for mold

Info

Publication number
JPH0486237A
JPH0486237A JP2201399A JP20139990A JPH0486237A JP H0486237 A JPH0486237 A JP H0486237A JP 2201399 A JP2201399 A JP 2201399A JP 20139990 A JP20139990 A JP 20139990A JP H0486237 A JPH0486237 A JP H0486237A
Authority
JP
Japan
Prior art keywords
mold
temperature control
temperature
platen
control liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2201399A
Other languages
Japanese (ja)
Inventor
Zenji Inaba
善治 稲葉
Susumu Ito
進 伊藤
Takayuki Taira
平 尊之
Kikuo Watanabe
渡辺 菊夫
Akira Koketsu
晃 纐纈
Toshio Matsukura
利夫 松倉
Kaoru Maeda
薫 前田
Hiroshi Yonekubo
広志 米久保
Kenji Haga
健二 芳賀
Kazunari Tokuda
一成 徳田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olympus Corp
Fanuc Corp
Original Assignee
Fanuc Corp
Olympus Optical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fanuc Corp, Olympus Optical Co Ltd filed Critical Fanuc Corp
Priority to JP2201399A priority Critical patent/JPH0486237A/en
Priority to PCT/JP1991/000377 priority patent/WO1991014560A1/en
Priority to KR1019910701665A priority patent/KR960016029B1/en
Priority to AT91905902T priority patent/ATE166023T1/en
Priority to EP91905902A priority patent/EP0544902B1/en
Priority to US07/773,941 priority patent/US5249947A/en
Priority to CA002057893A priority patent/CA2057893A1/en
Priority to DE69129412T priority patent/DE69129412T2/en
Publication of JPH0486237A publication Critical patent/JPH0486237A/en
Pending legal-status Critical Current

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  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

PURPOSE:To contrive to reduce the labor used for fitting and releasing the feeding hose of temperature-regulating liquid by a method in which a mold temperature- regulating hose is fixedly connected to a stationary platen and a movable platen and is also automatically connected to the matrix of the mold. CONSTITUTION:The halves 4a, 4b of a mold 4 are arranged on each of a stationary platen 1 and a movable platen 3, and when the fitting thereof by a clamp is finished, the path 10 of temperature-regulating liquid in the mold 4 is connected to the feeding device 8 of temperature-regulating liquid through an automatically connecting structure 11 and the path 9 of the temperature-regulating liquid in each platen. While the operation-command for solenoid values 15 (a, b) is released by the signal of the finish of said fitting from a sensor 23, the solenoid valves 15 (a, b) are switched to feeding side by NC device. Consequently, the temperature-regulating liquid is fed to the stationary platen 1 and the movable platen 3 from the feeding device 8 of temperature- regulating liquid through feeding hoses 12, 13., and then circulates through the matrix 6 of the mold 4, whereby a core 7 is kept at set temperature. When the mold 4 is replaced, by the solenoid valves 15 (a, b) the temperature-regulating liquid is prevented from being spouted.

Description

【発明の詳細な説明】 産業上の利用分野 この発明は、射出成形機において金型または中子を設定
温度に維持する温度調整機構に関する。
DETAILED DESCRIPTION OF THE INVENTION Field of the Invention This invention relates to a temperature adjustment mechanism for maintaining a mold or core at a set temperature in an injection molding machine.

従来技術 射出成形機の金型温調機構は金型の温度を、成形する樹
脂の特性に適合したものに維持し、均一な成形製品を得
る上で重要である。
The mold temperature control mechanism of a conventional injection molding machine is important for maintaining the temperature of the mold at a temperature that is compatible with the characteristics of the resin to be molded, and for obtaining uniform molded products.

しかし、従来の金型温調機構では、温調液供給装置から
の液供給ホースが金型に接続されており、金型交換の度
に脱着を繰り返すなと手間を要する。
However, in the conventional mold temperature control mechanism, the liquid supply hose from the temperature control liquid supply device is connected to the mold, which requires repeated attachment and detachment every time the mold is replaced.

また、前記ホースを定位置に配置できないため、温調液
供給用のホースが作業上で邪魔になることがある。
Furthermore, since the hose cannot be placed in a fixed position, the hose for supplying the temperature control liquid may become an obstacle during work.

発明が解決しようとする課題 この発明は、金型または中子の交換に際して、液供給ホ
ースの脱着を必要とせず、前記ポースをほぼ定位置に配
置しておくことができる金型温調機構の提供を課題とす
る。
Problems to be Solved by the Invention The present invention provides a mold temperature control mechanism that does not require the removal and attachment of the liquid supply hose when replacing the mold or the core, and allows the ports to be placed in approximately the same position. The challenge is to provide

課題を解決するだめの手段 型締部の固定プラテンおよび可動プラテンに温調液通路
を形成する。
A further means for solving the problem is to form temperature regulating liquid passages in the fixed platen and movable platen of the mold clamping part.

前記温調液通路の一端に温調液供給装置からの液供給路
を接続する。また、他端には金型の温調液通路が接続さ
れる。
A liquid supply path from a temperature control liquid supply device is connected to one end of the temperature control liquid passage. Moreover, the temperature control liquid passage of the mold is connected to the other end.

前記のプラテンと金型間の温調液通路相互の接続は自動
接続構造とされる。
The temperature control liquid passages between the platen and the mold are connected to each other by an automatic connection structure.

なお、前記の金型は母型を伴なわない中子だ+Jの場合
もある。
In addition, the above-mentioned mold may be a core without a matrix (+J).

さらに、前記中子にも温調液通路の形成されることがあ
る。
Furthermore, a temperature regulating liquid passage may also be formed in the core.

作用 温調液装置は固定プラテン、可動プラテンの温調液通路
から、金型あるいは中子の温調液通路に自動接続構造を
介して温調液を循環させ、金型あるいは中子を設定温度
に維持する。
The working temperature control liquid device circulates the temperature control liquid from the temperature control liquid passages of the fixed platen and movable platen to the temperature control liquid passage of the mold or core through an automatic connection structure, and maintains the mold or core at the set temperature. to be maintained.

実施例 第1−図は射出成形機にお(・)る型締部の要部を示し
たもので、固定プラテン1と図示していないリアプラテ
ンとがタイバーで結合され、タイバー2に可動プラテン
3が摺動可能に装着されている。
Embodiment 1 - Figure 1 shows the main parts of the mold clamping part installed in an injection molding machine.A fixed platen 1 and a rear platen (not shown) are connected by a tie bar, and a movable platen 3 is connected to a tie bar 2. is slidably mounted.

この型締部の作動は通常の射出成形機の場合と同じであ
る。
The operation of this mold clamping section is the same as in a normal injection molding machine.

固定プラテン1には金型4の固定側半部4aが、可動プ
ラテン3には可動側半部41〕が装着されている。
A fixed half 4a of a mold 4 is attached to the fixed platen 1, and a movable half 41 of the mold 4 is attached to the movable platen 3.

符号5はクランプを示す。Reference numeral 5 indicates a clamp.

前記両半部4a、4bはぞれぞれ母型6a、6bと中子
7の同定側半部7aおよび可動側半部7bで構成されて
いる。
The two halves 4a, 4b are respectively composed of master molds 6a, 6b, an identification side half 7a and a movable side half 7b of the core 7.

この型締部において、金型温調機構は、温調液供給装置
8、温調液通路9.10および両温調液通路9,10間
の自動接続構造11て構成されている。
In this mold clamping section, the mold temperature control mechanism is composed of a temperature control liquid supply device 8, a temperature control liquid passage 9, 10, and an automatic connection structure 11 between both temperature control liquid passages 9, 10.

温調液通路9は、固定プラテン1と可動プラテン3に形
成され(9a、9b・・・以下、固定プラテン側を81
可動プラテン側をbとし、指示しない場合は両方を意味
するものとする)、温調通路10は、金型4の母型6 
(a、b)に形成されている(10 a、 ]−0b)
。したがって、前記の自動接続構造11は、両プラテン
1,3の温調液通路9とそれぞれの母型6の温調液通路
1oの間に構成されている。
The temperature control liquid passage 9 is formed in the fixed platen 1 and the movable platen 3 (9a, 9b...Hereinafter, the fixed platen side will be referred to as 81).
The movable platen side is referred to as b, and if not specified, both are meant), and the temperature control passage 10 is the mother mold 6 of the mold 4.
(10 a, ]-0b) formed in (a, b)
. Therefore, the automatic connection structure 11 described above is constructed between the temperature regulating liquid passages 9 of both platens 1 and 3 and the temperature regulating liquid passages 1o of the respective mother molds 6.

中子7は、突き合わせ面(パーティング面)に成形用キ
ャビティを備える。
The core 7 includes a molding cavity on the abutting surface (parting surface).

温調液供給装置8は、水または油である温調液を所定温
度(50〜150°C)に調整して前記温調液通路9,
110に供給し、循環させる公知の装置で射出成形機1
の起動と同時に作動される。
The temperature control liquid supply device 8 adjusts the temperature control liquid, which is water or oil, to a predetermined temperature (50 to 150°C) and supplies the temperature control liquid to the temperature control liquid passage 9,
The injection molding machine 1 is supplied to the injection molding machine 1 using a known device for supplying and circulating the
It is activated at the same time as the start of.

この装置8は、液供給路としての供給ホース12.13
(それぞれに送り側p、戻り側r)で固定プラテン1、
可動プラテン3の温調液通路9(a、  b)にカプラ
ー14を介して固定的に接続され、送り側1.2p、i
3pの経路には射出成形機が備えたNC装置によって制
御される電磁弁15、(a、b)が接続されている。
This device 8 includes a supply hose 12.13 as a liquid supply path.
(Fixed platen 1 on feed side p and return side r respectively)
It is fixedly connected to the temperature control liquid passage 9 (a, b) of the movable platen 3 via a coupler 14, and is connected to the feed side 1.2p, i.
Connected to the path 3p are solenoid valves 15, (a, b) that are controlled by an NC device included in the injection molding machine.

電磁弁15は二方向切り替え弁で、NC装置からの指令
によりプラテン(1,3)への供給側pと戻り側rへの
切り替えを行う。
The electromagnetic valve 15 is a two-way switching valve, and switches between the supply side p and the return side r to the platen (1, 3) according to a command from the NC device.

温調液通路9 (a、b) 、10 (a、b)は第2
図のように、母型6に設けた直孔16の端部をホース1
7により母型6の外部で相互に結合して回路を構成し、
該回路の両端を、ねじ18などで閉鎖すると共に、プラ
テンに装着する面の側から前記回路の両端部付近に到達
する導入、導出孔19を形成して構成されている。
Temperature control liquid passages 9 (a, b) and 10 (a, b) are the second
As shown in the figure, connect the end of the straight hole 16 provided in the matrix 6 to the hose 1.
7 to form a circuit by interconnecting them outside the matrix 6,
Both ends of the circuit are closed with screws 18 or the like, and inlet and outlet holes 19 are formed that reach near both ends of the circuit from the side to be attached to the platen.

自動接続構造11は、プラテン1,3に対し金型4が装
着されたとき、第3図(イ)のようにプラテンおよび母
型側の温調液通路9.10の対抗する端部の内、一方(
実施例ではプラテン側の温調液通路9)が径大または環
状に巡るポート19に形成され、その周辺をとりまいて
Oリング20が装着されており、ポート19にこれより
径のちいさな他方の温調液通路端部(母型6側の温調液
通路10)が正面から押し当てられて結合された構造で
ある。
When the mold 4 is attached to the platens 1 and 3, the automatic connection structure 11 connects the insides of the opposing ends of the temperature control liquid passages 9 and 10 on the platen and mother mold sides as shown in FIG. ,on the other hand(
In the embodiment, the temperature control liquid passage 9) on the platen side is formed in a port 19 with a large diameter or annularly circulating, and an O-ring 20 is attached around the periphery of the port 19. It has a structure in which the ends of the temperature regulating liquid passage (temperature regulating liquid passage 10 on the mother mold 6 side) are pressed together from the front.

自動接続構造11は、さらに第3図(ロ)のように、母
型6からポート19に嵌入する突起21を設けて構成す
ることもある。突起21の外周には0リング22が装着
される。
The automatic connection structure 11 may further include a protrusion 21 that fits into the port 19 from the mother die 6, as shown in FIG. 3(B). An O-ring 22 is attached to the outer periphery of the protrusion 21.

なお、これらの場合、母型6が押し当てられる前のOリ
ング20の突出量、あるいは前記の突起24の突出量(
」、金型交換の際に、上方あるいは側方から固定プラテ
ン1と可動プラテン3間に配置される金型4と、これら
プラテン1,3との間のクリアランスより小さいものと
されている。
In these cases, the amount of protrusion of the O-ring 20 before the mother mold 6 is pressed or the amount of protrusion of the protrusion 24 (
'', which is smaller than the clearance between these platens 1 and 3 and the mold 4 which is placed between the fixed platen 1 and the movable platen 3 from above or from the side when replacing the molds.

司号23はセンサーで、前記のクランプ5による金型4
の取付けが完了したことをNC装置に伝達するためのも
のである。
The controller 23 is a sensor, and the mold 4 is connected to the clamp 5.
This is to notify the NC device that the installation has been completed.

固定プラテン1、可動プラテン3のそれぞれに金型4の
半部(4a、  4 b)が配置され、クランプ5によ
る取付けが完了すると、金型4における温調液通路10
が自動接続構造11および各プラテンにおける温調液通
路9を介して温調液供給装置8に連結される。また、セ
ンサー23からの取(=jけ完了信号によって電磁弁1
.5(a、b)に対する操作指令が解除されると共に、
NC装置により電磁弁15(a、b)が供給側に切り替
えられる。
When the halves (4a, 4b) of the mold 4 are placed on each of the fixed platen 1 and the movable platen 3, and the installation using the clamps 5 is completed, the temperature control liquid passage 10 in the mold 4 is installed.
is connected to the temperature control liquid supply device 8 via the automatic connection structure 11 and the temperature control liquid passage 9 in each platen. In addition, the solenoid valve 1 is activated by the removal (=j) completion signal from the sensor 23.
.. The operation command for 5(a, b) is canceled, and
The solenoid valves 15 (a, b) are switched to the supply side by the NC device.

これにより、温調液供給装置8から供給ホース1.2.
13を通じて温調液が固定プラテン1、可動プラテン3
に供給され、金型4の母型6を経て循環し、中子7が設
定温度に維持される。
As a result, the supply hoses 1, 2.
13, the temperature control liquid is supplied to fixed platen 1 and movable platen 3.
The core 7 is maintained at a set temperature by being supplied to the core 7 and circulating through the mother mold 6 of the mold 4.

電磁弁1.5(a、b)は金型4を交換する時に戻り側
へ切り替えられ、金型を取り外したときに温調液が噴き
出すのを防II−するようになっている。
The solenoid valves 1.5 (a, b) are switched to the return side when replacing the mold 4 to prevent the temperature control liquid from spouting out when the mold is removed.

第4図は第2の実施例を示すもので、型締部における固
定プラテン1、可動プラテン3が中子取付は部24 (
a、  b)を備えて、金型の母型6(a、  b)そ
のものに構成され、中子7 (a、  b)は母型6す
なわち、プラテン1,3に直接装着された形となるもの
である。したがって、固定プラテン1、可動プラテン3
の温調液通路9は前記実施例の母型6における温調液通
路10と同様な構成となっており、中子取付は部24の
周囲に配置され、これに直接、温調液供給装置8からの
液供給路、すなわち供給ホース12.13が電磁弁15
を介して接続されている。
FIG. 4 shows the second embodiment, in which the fixed platen 1 and the movable platen 3 in the mold clamping part are connected to the core mounting part 24 (
a, b), and is configured in the mold matrix 6 (a, b) itself, and the core 7 (a, b) is directly attached to the matrix 6, that is, the platens 1 and 3. It is something. Therefore, fixed platen 1, movable platen 3
The temperature control liquid passage 9 has the same structure as the temperature control liquid passage 10 in the mother mold 6 of the above embodiment, and the core attachment is arranged around the part 24, and the temperature control liquid supply device is directly attached to it. The liquid supply path from 8, that is, the supply hose 12.13 is connected to the solenoid valve 15.
connected via.

このような構造は実質的にはプラテンの温調機構である
Such a structure is essentially a temperature control mechanism for the platen.

温調機構としての作動に前記実施例と格別な差異はない
There is no particular difference in operation as a temperature control mechanism from the previous embodiment.

第5図は第3の実施例で、前記実質的なプラテン温調機
構の中子7にさらに温調液通路25が設けられ、プラテ
ン側の温調液通路9 (a、  b)とそれぞれ直列に
接続されている。また、中子7の温調液通路25と各プ
ラテン1,3における温調液通路9 (a、  b)は
、前記したと同じ自動接続構造11で連結される。ただ
し、この場合、固定プラテン1には、中子7aが」二方
からスライドして装着されるため、ポート19としては
前記第3図(イ)の構造が採用され、しかもOリング2
0の突出爪はより少なく、表面は滑りの良いものとされ
ている。
FIG. 5 shows a third embodiment, in which a temperature control liquid passage 25 is further provided in the core 7 of the substantial platen temperature control mechanism, and is connected in series with the temperature control liquid passage 9 (a, b) on the platen side. It is connected to the. Further, the temperature regulating liquid passage 25 of the core 7 and the temperature regulating liquid passage 9 (a, b) in each platen 1, 3 are connected by the same automatic connection structure 11 as described above. However, in this case, since the core 7a is attached to the fixed platen 1 by sliding it from both sides, the structure shown in FIG.
0 has fewer protruding claws and a smoother surface.

温調機構としての作動に前記実施例と比較して格別な差
異はない。
There is no particular difference in operation as a temperature control mechanism compared to the previous embodiment.

第2、第3の実施例は、プラテン1,3に中子7と母型
6からなる金型を取り付りて射出作業を行うが、成形製
品が小形なため、金型の交換自体が成形キャビティを備
えた中子7の交換たけで充分であり、母型6の交換かほ
とんどない場合に相当し、プラテン1.3自体を母型に
構成する方が合理的である、との技術的思想に基づいて
いる。
In the second and third embodiments, the injection work is performed by attaching a mold consisting of a core 7 and a mother die 6 to platens 1 and 3, but since the molded product is small, the mold itself cannot be replaced. The technique is that it is sufficient to replace the core 7 with the molding cavity, which corresponds to the case where the mother mold 6 is hardly ever replaced, and that it is more rational to configure the platen 1.3 itself as the mother mold. It is based on the idea of

なお、第3実施例のように中子7の内部にも温調液通路
25を形成する場合において、この通路25をプラテン
側の温調液通路9と正確に位置決めする必要があるとき
は、中子7の断面を多角形にするなど中子装着時に中子
の軸回り角度が定まるように構成される。
In addition, when forming the temperature regulating liquid passage 25 inside the core 7 as in the third embodiment, when it is necessary to accurately position this passage 25 with the temperature regulating liquid passage 9 on the platen side, The core 7 is configured to have a polygonal cross section so that the angle around the axis of the core is determined when the core is installed.

以上は実施例である。The above is an example.

金型および中子の取付は構造は実施例のものにかぎらな
い。
The structure for attaching the mold and core is not limited to that of the embodiment.

プラテンと母型あるいは中子に形成する温調液通路の構
造は実施例のものにかぎらず、プラテン、金型あるいは
中子を作る時に、必要な形状に屈曲した管をうめ込んで
成形し、外部からこの管に連通路を到達させた構造とす
ることもできる。
The structure of the temperature-regulating liquid passage formed in the platen and the mother mold or core is not limited to that of the embodiment. When making the platen, mold or core, a bent tube is inserted into the required shape and formed. It is also possible to have a structure in which a communication path reaches this pipe from the outside.

発明の効果 金型温調のホースは固定プラテン、可動プラテンに固定
的に接続され、また、金型の母型との接続も自動的に行
われるから、温調液供給ホースの脱着に要した手間が削
減される。
Effects of the Invention Since the mold temperature control hose is fixedly connected to the fixed platen and the movable platen, and is also automatically connected to the mold mother mold, the time required to attach and detach the temperature control liquid supply hose is reduced. The effort is reduced.

温調液供給ホースはプラテンへ固定的に接続されている
から、はぼ定位置にあり、作業中に思わぬ位置にある温
調液ホースに煩わされるこ吉が無い。
Since the temperature control liquid supply hose is fixedly connected to the platen, it remains in a fixed position, and there is no need to worry about the temperature control liquid supply hose being in an unexpected position during work.

【図面の簡単な説明】[Brief explanation of drawings]

第4図は断面にて示す平面図、第2図は透視的に示した
斜視図、第3図(イ)は断面にて示す要部の拡大図、同
(ロ)は他の実施例の同様拡大図、第4図は第2実施例
の断面にて示す平面図、第5図は第3実施例の断面にて
示す平面図である。 1・・・固定プラテン、3・・・可動プラテン、4・・
・金型、6・・・母型、7・・・中子、8・・・温調液
供給装置、9、]0・・・温調液通路、11−・・・自
動接続構造、12.13・・・供給ホース。 \才 ■
Fig. 4 is a plan view shown in cross section, Fig. 2 is a perspective view shown in perspective, Fig. 3 (a) is an enlarged view of the main part shown in cross section, and the same (b) is an enlarged view of another embodiment. Similarly, FIG. 4 is a cross-sectional plan view of the second embodiment, and FIG. 5 is a cross-sectional plan view of the third embodiment. 1...Fixed platen, 3...Movable platen, 4...
・Mold, 6... Mother mold, 7... Core, 8... Temperature control liquid supply device, 9, ]0... Temperature control liquid passage, 11-... Automatic connection structure, 12 .13... Supply hose. \Talent■

Claims (3)

【特許請求の範囲】[Claims] (1)型締部の固定プラテンおよび可動プラテンに温調
液通路が形成され、その一端に温調液供給装置からの液
供給路が接続されると共に、他端に金型内部の温調液通
路が自動接続構造を介して接続されていることを特徴と
した金型温調機構。
(1) Temperature control liquid passages are formed in the fixed platen and movable platen of the mold clamping part, one end of which is connected to the liquid supply path from the temperature control liquid supply device, and the other end of which is connected to the temperature control liquid passage inside the mold. A mold temperature control mechanism characterized in that passages are connected through an automatic connection structure.
(2)型締部の固定プラテンおよび可動プラテンが中子
取付け部を備えると共に、内部に前記中子取付け部の周
囲に至る温調液通路が形成され、該通路に温調液供給装
置からの液供給路が接続されていることを特徴とした金
型温調機構。
(2) The fixed platen and the movable platen of the mold clamping part are provided with a core attachment part, and a temperature control liquid passage is formed therein to reach the periphery of the core attachment part, and a temperature control liquid supply device is supplied to the passageway. A mold temperature control mechanism characterized by a liquid supply path being connected.
(3)型締部の固定プラテンおよび可動プラテンが中子
取付け部を備えると共に、これらプラテンおよび中子の
内部にそれぞれ温調液通路が形成され、前記プラテンの
温調液通路の一端に温調液供給装置からの液供給路が接
続されると共に、他端に中子の温調液通路が自動接続構
造を介して接続されていることを特徴とした金型温調機
構。
(3) The fixed platen and the movable platen of the mold clamping part are provided with a core mounting part, and a temperature control liquid passage is formed inside each of these platens and the core, and one end of the temperature control liquid passage of the platen is provided with a temperature control liquid passage. A mold temperature control mechanism, characterized in that a liquid supply path from a liquid supply device is connected to the other end, and a temperature control liquid path of a core is connected to the other end via an automatic connection structure.
JP2201399A 1990-03-22 1990-07-31 Temperature-regulating mechanism for mold Pending JPH0486237A (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2201399A JPH0486237A (en) 1990-07-31 1990-07-31 Temperature-regulating mechanism for mold
PCT/JP1991/000377 WO1991014560A1 (en) 1990-03-22 1991-03-22 Automatic mold exchange type injection molding machine
KR1019910701665A KR960016029B1 (en) 1990-03-22 1991-03-22 Automatic mold exchange type injection molding machine
AT91905902T ATE166023T1 (en) 1990-03-22 1991-03-22 INJECTION MOLDING MACHINE OF AUTOMATIC MOLD CHANGE TYPE
EP91905902A EP0544902B1 (en) 1990-03-22 1991-03-22 Automatic mold exchange type injection molding machine
US07/773,941 US5249947A (en) 1990-03-22 1991-03-22 Injection molding machine having an automatic mold changer
CA002057893A CA2057893A1 (en) 1990-03-22 1991-03-22 Automatic mold exchange type injection molding machine
DE69129412T DE69129412T2 (en) 1990-03-22 1991-03-22 INJECTION MOLDING MACHINE OF THE TYPE WITH AUTOMATIC CHANGE OF FORM

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2201399A JPH0486237A (en) 1990-07-31 1990-07-31 Temperature-regulating mechanism for mold

Publications (1)

Publication Number Publication Date
JPH0486237A true JPH0486237A (en) 1992-03-18

Family

ID=16440448

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2201399A Pending JPH0486237A (en) 1990-03-22 1990-07-31 Temperature-regulating mechanism for mold

Country Status (1)

Country Link
JP (1) JPH0486237A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016007008A1 (en) 2015-06-16 2016-12-22 Fanuc Corporation injection molding system
US10046486B2 (en) 2014-12-22 2018-08-14 Hao-Chieh Liao Mold thermal controlling device and hot press system

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5953908B2 (en) * 1975-07-01 1984-12-27 ゼネラル・エレクトリック・カンパニイ Method for producing N-alkyl phthalimide
JPS6064808A (en) * 1983-09-20 1985-04-13 Toshiba Mach Co Ltd Apparatus for connecting or disconnecting automatically gas/liquid medium pipeline to mold
JPS60245525A (en) * 1984-05-21 1985-12-05 Nissei Plastics Ind Co Molding die
JPS6345018A (en) * 1987-06-12 1988-02-26 Toyo Mach & Metal Co Ltd Piping structure of cooling water in injection molding machine
JPS6458522A (en) * 1987-08-31 1989-03-06 Toshiba Corp Mold apparatus for injection molding

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5953908B2 (en) * 1975-07-01 1984-12-27 ゼネラル・エレクトリック・カンパニイ Method for producing N-alkyl phthalimide
JPS6064808A (en) * 1983-09-20 1985-04-13 Toshiba Mach Co Ltd Apparatus for connecting or disconnecting automatically gas/liquid medium pipeline to mold
JPS60245525A (en) * 1984-05-21 1985-12-05 Nissei Plastics Ind Co Molding die
JPS6345018A (en) * 1987-06-12 1988-02-26 Toyo Mach & Metal Co Ltd Piping structure of cooling water in injection molding machine
JPS6458522A (en) * 1987-08-31 1989-03-06 Toshiba Corp Mold apparatus for injection molding

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10046486B2 (en) 2014-12-22 2018-08-14 Hao-Chieh Liao Mold thermal controlling device and hot press system
TWI633000B (en) * 2014-12-22 2018-08-21 廖晧傑 Mold thermal controlling device and hot pressing system
DE102016007008A1 (en) 2015-06-16 2016-12-22 Fanuc Corporation injection molding system
US10035288B2 (en) 2015-06-16 2018-07-31 Fanuc Corporation Injection molding system

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