JPH0485731U - - Google Patents

Info

Publication number
JPH0485731U
JPH0485731U JP12641090U JP12641090U JPH0485731U JP H0485731 U JPH0485731 U JP H0485731U JP 12641090 U JP12641090 U JP 12641090U JP 12641090 U JP12641090 U JP 12641090U JP H0485731 U JPH0485731 U JP H0485731U
Authority
JP
Japan
Prior art keywords
flat plate
wafer
semiconductor wafer
processing
suction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12641090U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12641090U priority Critical patent/JPH0485731U/ja
Publication of JPH0485731U publication Critical patent/JPH0485731U/ja
Pending legal-status Critical Current

Links

JP12641090U 1990-11-30 1990-11-30 Pending JPH0485731U (US07122547-20061017-C00273.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12641090U JPH0485731U (US07122547-20061017-C00273.png) 1990-11-30 1990-11-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12641090U JPH0485731U (US07122547-20061017-C00273.png) 1990-11-30 1990-11-30

Publications (1)

Publication Number Publication Date
JPH0485731U true JPH0485731U (US07122547-20061017-C00273.png) 1992-07-24

Family

ID=31873969

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12641090U Pending JPH0485731U (US07122547-20061017-C00273.png) 1990-11-30 1990-11-30

Country Status (1)

Country Link
JP (1) JPH0485731U (US07122547-20061017-C00273.png)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000349050A (ja) * 1999-06-09 2000-12-15 Disco Abrasive Syst Ltd 被加工物の切削方法及び切削装置
JP2014045144A (ja) * 2012-08-28 2014-03-13 Fujitsu Semiconductor Ltd ダイシング方法及びダイシング装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000349050A (ja) * 1999-06-09 2000-12-15 Disco Abrasive Syst Ltd 被加工物の切削方法及び切削装置
JP2014045144A (ja) * 2012-08-28 2014-03-13 Fujitsu Semiconductor Ltd ダイシング方法及びダイシング装置

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