JPH048374U - - Google Patents
Info
- Publication number
- JPH048374U JPH048374U JP4876890U JP4876890U JPH048374U JP H048374 U JPH048374 U JP H048374U JP 4876890 U JP4876890 U JP 4876890U JP 4876890 U JP4876890 U JP 4876890U JP H048374 U JPH048374 U JP H048374U
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- board
- printed wiring
- tip
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims 2
- 238000000605 extraction Methods 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4876890U JPH048374U (de) | 1990-05-10 | 1990-05-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4876890U JPH048374U (de) | 1990-05-10 | 1990-05-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH048374U true JPH048374U (de) | 1992-01-24 |
Family
ID=31565878
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4876890U Pending JPH048374U (de) | 1990-05-10 | 1990-05-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH048374U (de) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4735483B2 (ja) * | 2006-09-05 | 2011-07-27 | 株式会社デンソー | 電子部品の実装構造 |
| JP2013247099A (ja) * | 2012-05-30 | 2013-12-09 | Sanyo Electric Co Ltd | 配線基板 |
-
1990
- 1990-05-10 JP JP4876890U patent/JPH048374U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4735483B2 (ja) * | 2006-09-05 | 2011-07-27 | 株式会社デンソー | 電子部品の実装構造 |
| JP2013247099A (ja) * | 2012-05-30 | 2013-12-09 | Sanyo Electric Co Ltd | 配線基板 |