JPH0482880U - - Google Patents

Info

Publication number
JPH0482880U
JPH0482880U JP12506490U JP12506490U JPH0482880U JP H0482880 U JPH0482880 U JP H0482880U JP 12506490 U JP12506490 U JP 12506490U JP 12506490 U JP12506490 U JP 12506490U JP H0482880 U JPH0482880 U JP H0482880U
Authority
JP
Japan
Prior art keywords
conductor
wiring board
printed wiring
pair
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12506490U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12506490U priority Critical patent/JPH0482880U/ja
Publication of JPH0482880U publication Critical patent/JPH0482880U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP12506490U 1990-11-29 1990-11-29 Pending JPH0482880U (it)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12506490U JPH0482880U (it) 1990-11-29 1990-11-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12506490U JPH0482880U (it) 1990-11-29 1990-11-29

Publications (1)

Publication Number Publication Date
JPH0482880U true JPH0482880U (it) 1992-07-20

Family

ID=31872684

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12506490U Pending JPH0482880U (it) 1990-11-29 1990-11-29

Country Status (1)

Country Link
JP (1) JPH0482880U (it)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0638273U (ja) * 1992-10-13 1994-05-20 株式会社村田製作所 チップ部品の実装構造
JP2016001717A (ja) * 2014-05-22 2016-01-07 ソニー株式会社 回路基板、蓄電装置、電池パックおよび電子機器

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0638273U (ja) * 1992-10-13 1994-05-20 株式会社村田製作所 チップ部品の実装構造
JP2016001717A (ja) * 2014-05-22 2016-01-07 ソニー株式会社 回路基板、蓄電装置、電池パックおよび電子機器

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