JPH0481273A - Cream solder dispernser - Google Patents

Cream solder dispernser

Info

Publication number
JPH0481273A
JPH0481273A JP18986290A JP18986290A JPH0481273A JP H0481273 A JPH0481273 A JP H0481273A JP 18986290 A JP18986290 A JP 18986290A JP 18986290 A JP18986290 A JP 18986290A JP H0481273 A JPH0481273 A JP H0481273A
Authority
JP
Japan
Prior art keywords
pressure
cream solder
syringe
regulator
supply source
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18986290A
Other languages
Japanese (ja)
Inventor
Takayoshi Atou
阿藤 貴好
Nobuyuki Koike
延幸 小池
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP18986290A priority Critical patent/JPH0481273A/en
Publication of JPH0481273A publication Critical patent/JPH0481273A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To stabilize the amt. of cream solder by providing a feedback control system which compensates the pressure fluctuation of an air pressure supply source and subjects the secondary side pressure of a pressure regulator to control with fixed set-point to a set pressure in a pneumatic pipeline. CONSTITUTION:An electropneumatic regulator (to regulate the setter of the secondary pressure in correspondence to the electric signal from the outside, more specifically an impressed voltage) is adopted for the pressure regulator 7. The feedback system takes the detected value of the pressure sensor 12 detected on the secondary side of the pneumatic pipeline 8 on the downstream of the pressure regulator as a feedback signal into a controller 5. The controller compares the feedback signal and the set pressure valve and applies the control signal corresponding to this deviation to the pressure regulator 7, thereby making the control with fixed set-point of the secondary side pressure to the set pressure. The casual main pressure fluctuation of the air pressure supply source 9 is compensated in this way and the air pressure to be introduced into a syringe 1 is maintained always under a prescribed pressure. The discharge rate of the cream solder supplied onto printed wirings from the syringe is stabilized and the reflow soldering of electronic parts is executed in a normal state.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、混成集積回路を対象に、フラットパッケージ
ICなどの表面実装形電子部品をプリント配線板に半田
付けする前段工程として、プリント配線板上に指定した
電子部品の実装位置にクリーム半田を塗布するクリーム
半田ディスペンサに関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention targets hybrid integrated circuits, and is a method for soldering surface-mounted electronic components such as flat package ICs to printed wiring boards. The present invention relates to a cream solder dispenser that applies cream solder to the mounting position of the electronic component specified above.

〔従来の技術〕[Conventional technology]

まず、第2図にて従来使用されているクリーム半田ディ
スペンサの制御系統、並びに半田塗布動作を説明する。
First, the control system and solder application operation of a conventionally used cream solder dispenser will be explained with reference to FIG.

図において、1はクリーム半田2を収容したプランジャ
1a付きのシリンジであり、シリンジ1の先端にはノズ
ル3を備えている。かかるシリンジ1は位置決め用のX
−Y移動操作ユニット4に搭載され、コントローラ5か
らの指令によりX、Y軸方向に移動操作される。また、
前記シリンジ1はソレノイドバルブ6、圧力レギュレー
タ7(減圧弁)を接続した空気圧回路8を介して空気圧
供給源9に接続されている。
In the figure, 1 is a syringe with a plunger 1a containing cream solder 2, and the tip of the syringe 1 is equipped with a nozzle 3. Such a syringe 1 has an X for positioning.
- It is mounted on the Y movement operation unit 4 and is operated to move in the X and Y axis directions by commands from the controller 5. Also,
The syringe 1 is connected to an air pressure supply source 9 via a pneumatic circuit 8 connected to a solenoid valve 6 and a pressure regulator 7 (pressure reducing valve).

次にかかるクリーム半田ディスペンサの動作について説
明する。まず、シリンジ1に導入する空気圧を圧力レギ
ュレータ7であらかじめ設定(圧力調整ハンドルをマニ
ュアル操作して二次側圧力を設定する)しておく。次に
、プリント配線板10をディスペンサに供給し、コント
ローラ5(コントローラには各種電子部品の形状、サイ
ズ、リードピッチなどに関する部品データのファイルが
格納されている)に実装部品の種類、実装位置などのデ
ータを入力してスタート指令を与えると、コントローラ
5からの指令でX−Y移動操作ユニット4がシリンジ1
を部品実装位置に対応した半田塗布開始地点に移動し、
ここから指定された半田塗布パターン11に沿ってx、
Y軸方向に移動操作するとともに、半田塗布パターン1
1に合わせてソレノイドバルブ6を開閉制御する。これ
により、シリンジ1はソレノイドバルブ6が開放した際
に圧力レギュレータ7の二次側圧力を受けてその先端ノ
ズル3よりクリーム半田を吐出し、プリント配線板上の
半田塗布パターン11に沿ってクリーム半田を塗布する
。上記の操作で実装部品1個分の半田塗布が終了すると
、続いてシリンジ1が別な実装部品の実装位置に移動し
て同様にクリーム半田を塗布する。
Next, the operation of the cream solder dispenser will be explained. First, the air pressure introduced into the syringe 1 is set in advance using the pressure regulator 7 (the pressure on the secondary side is set by manually operating the pressure adjustment handle). Next, the printed wiring board 10 is supplied to the dispenser, and the controller 5 (the controller stores component data files regarding the shape, size, lead pitch, etc. of various electronic components) is loaded with information such as the type of mounted components, mounting position, etc. When inputting the data and giving a start command, the X-Y movement operation unit 4 moves the syringe 1 in response to a command from the controller 5.
Move to the solder application starting point corresponding to the component mounting position,
From here, x along the specified solder application pattern 11,
While moving in the Y-axis direction, solder application pattern 1
The solenoid valve 6 is controlled to open and close according to the timing. As a result, when the solenoid valve 6 opens, the syringe 1 receives the secondary pressure of the pressure regulator 7 and discharges the cream solder from its tip nozzle 3, and the cream solder is applied along the solder application pattern 11 on the printed wiring board. Apply. When the solder application for one mounted component is completed by the above operation, the syringe 1 is subsequently moved to the mounting position of another mounted component and applies cream solder in the same manner.

なお、図示の半田塗布パターン11は、パッケージの周
囲4辺からリード列を引き出したフラットパッケージI
Cに対応した半田塗布パターンを示している。
The illustrated solder application pattern 11 is a flat package I in which lead rows are drawn out from the four sides around the package.
A solder application pattern corresponding to C is shown.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

ところで、前記した従来のディスペンサでは、使用中に
空気圧供給源9 (例えば工場内に設備されている多目
的用の空気圧源)の元圧が変動すると圧力レギュレータ
7の二次側圧力が変動してしまい、このためにシリンジ
1からのクリーム半田吐出量にバラツキが生じる。
By the way, in the conventional dispenser described above, if the source pressure of the air pressure supply source 9 (for example, a multi-purpose air pressure source installed in a factory) fluctuates during use, the secondary pressure of the pressure regulator 7 fluctuates. Therefore, the amount of cream solder discharged from the syringe 1 varies.

第3図はこの様子を表した動作特性図であり、空気圧供
給源の元圧5Kg/cdlに対し、圧力レギュレータの
二次側圧力を3Kg/ctffに設定して使用している
状態で、元圧が4Kg/cdlに低下したとすると、圧
力レギュレータの二次側圧力も低下してシリンジからの
クリーム半田吐出量にΔQの変動が生じる。この結果、
プリント配線板上に適正量のクリーム半田を塗布するこ
とができず、次段工程でプリント配線板上に装着した電
子部品をリフロー半田付けする際に、半田塗布量の不足
が原因で半田不良を引き起こす。また、空気圧供給源の
元圧が上昇した場合にはクリーム半田吐出量が過剰とな
り、リフロー半田付けの際に半田ブリッジが生しる。な
お、シリンジに加える空気圧の変動。
Figure 3 is an operating characteristic diagram showing this situation, and shows that the pressure regulator's secondary pressure is set to 3 kg/ctff and the original pressure of the air pressure supply source is 5 kg/cdl. Assuming that the pressure decreases to 4 kg/cdl, the pressure on the secondary side of the pressure regulator also decreases, causing a fluctuation of ΔQ in the amount of cream solder discharged from the syringe. As a result,
It was not possible to apply the appropriate amount of cream solder on the printed wiring board, and when reflow soldering the electronic components mounted on the printed wiring board in the next process, the insufficient amount of solder application caused soldering defects. cause. Further, when the source pressure of the air pressure supply source increases, the amount of cream solder discharged becomes excessive, and a solder bridge occurs during reflow soldering. Furthermore, fluctuations in the air pressure applied to the syringe.

つまりクリーム半田の吐出量変化に対応してシリンジの
移動速度を調整することでプリント配線板への半田塗布
量の適正化を図る方法も考えられるが、その制御は極め
て厄介である。
In other words, it is possible to consider a method of optimizing the amount of solder applied to the printed wiring board by adjusting the moving speed of the syringe in response to changes in the amount of cream solder discharged, but such control is extremely difficult.

本発明は上記の点にかんがみなされたものであり、空気
圧供給源の圧力変動を補償して、シリンジからのクリー
ム半田吐出量を常に一定量に維持できるようにしたディ
スペンサを提供することを目的とする。
The present invention has been made in consideration of the above points, and an object of the present invention is to provide a dispenser that can always maintain a constant amount of cream solder discharged from a syringe by compensating for pressure fluctuations in a pneumatic supply source. do.

〔課題を解決するための手段〕[Means to solve the problem]

上記課題を解決するために、本発明ではシリンジに通じ
る空気圧回路に対し、空気圧供給源の圧力変動を補償し
て圧力レギュレータの二次側圧力を設定圧に定値制御す
るフィードバック制御系を設けるものとする。
In order to solve the above problems, the present invention provides a feedback control system for the pneumatic circuit connected to the syringe, which compensates for pressure fluctuations in the pneumatic supply source and controls the secondary pressure of the pressure regulator to a set pressure. do.

〔作用〕[Effect]

上記の構成で、圧力レギュレータには電空レギュレータ
(外部からの電気信号、具体的には印加電圧に相応して
二次側圧力の設定値を調整する)を採用し、フィードバ
ック系は、圧力レギュレータより下流の空気圧回路二次
側で検出した圧力センサの検出値をフィードバック信号
としてコントローラに取り込み、コントローラはフィー
ドバック信号と圧力設定値とを対比し、その偏差に対応
した制御信号を圧力レギュレータに与えて二次側圧力を
設定圧に定値制御する。
In the above configuration, an electro-pneumatic regulator (which adjusts the set value of the secondary pressure according to an external electrical signal, specifically an applied voltage) is used as the pressure regulator, and the feedback system uses the pressure regulator as the pressure regulator. The detected value of the pressure sensor detected on the secondary side of the pneumatic circuit further downstream is input to the controller as a feedback signal, and the controller compares the feedback signal with the pressure set value and gives a control signal corresponding to the deviation to the pressure regulator. Controls the secondary pressure at a fixed value to the set pressure.

これにより、空気圧供給源の不測な元圧変動を補償して
シリンジに導入する空気圧を常に所定圧に維持すること
ができ、シリンジよりプリント配線板上に供給するクリ
ーム半田吐出量の安定化が図れる。
This makes it possible to compensate for unexpected fluctuations in the source pressure of the air pressure supply source and to always maintain the air pressure introduced into the syringe at a predetermined pressure, thereby stabilizing the amount of cream solder discharged from the syringe onto the printed wiring board. .

〔実施例〕〔Example〕

第1図は本発明実施例によるクリーム半田ディスペンサ
の制御系統図であり、第2図と対応する同一部品には同
じ符号が付しである。
FIG. 1 is a control system diagram of a cream solder dispenser according to an embodiment of the present invention, and the same parts corresponding to those in FIG. 2 are given the same reference numerals.

第1図において、ソレノイドバルブ6とともに空気圧回
路8へ接続した圧力レギュレータ7には電空レギュレー
タを採用し、圧力レギュレータ7より下流の二次側に接
続した圧力センサ12と、可変抵抗13および該可変抵
抗13の調節操作モータ14(ステッピングモータ)を
組合わせた電空レギュレータ7の印加電圧調整部15と
を含めてコントローラ5との間で圧力レギュレータフに
対するフィードバック制御系16を構成している。ここ
で、コントローラ5にはあらかじめ二次側圧力の設定値
が与えられており、圧力センサ12からの検出値と設定
値とを対比し、その偏差に基づき電圧調整部15を介し
て圧力レギュレータフに印加する電圧を調整し、その二
次側圧力が設定値を維持するように定値制御を行う。
In FIG. 1, an electro-pneumatic regulator is adopted as the pressure regulator 7 connected to the pneumatic circuit 8 together with the solenoid valve 6, and a pressure sensor 12 connected to the secondary side downstream of the pressure regulator 7, a variable resistor 13 and the variable A feedback control system 16 for the pressure regulator is configured with the controller 5, including an applied voltage adjustment section 15 of the electropneumatic regulator 7 combined with an adjustment operation motor 14 (stepping motor) of the resistor 13. Here, the controller 5 is given a set value of the secondary pressure in advance, compares the detected value from the pressure sensor 12 with the set value, and adjusts the pressure regulator via the voltage regulator 15 based on the deviation. The voltage applied to the pump is adjusted and constant value control is performed to maintain the secondary pressure at the set value.

前記のフィードバック制御を行うことにより、ディスペ
ンサの使用中に空気圧供給源9の元圧が変動しても、圧
力レギュレータ7の二次側圧力は常に設定圧力に維持さ
れ、これにより半田塗布工程でシリンジ1からプリント
配線板10に供給するクリーム半田吐出量が安定する。
By performing the feedback control described above, even if the source pressure of the air pressure supply source 9 fluctuates while the dispenser is in use, the secondary pressure of the pressure regulator 7 is always maintained at the set pressure. 1 to the printed wiring board 10 becomes stable.

なお、図示実施例のように可変抵抗13.モータ14を
組合わせた電圧調整部15を使用する代わりに、コント
ローラ5から前記の偏差に対応した制御電圧を出力し、
これを圧力レギュレータフに直接与えて二次側圧力の定
植制御を行うこともできる。
Note that, as in the illustrated embodiment, the variable resistor 13. Instead of using the voltage regulator 15 combined with the motor 14, the controller 5 outputs a control voltage corresponding to the deviation,
This can also be applied directly to the pressure regulator to control the secondary pressure.

〔発明の効果〕〔Effect of the invention〕

以上述べたように、本発明によれば空気圧供給源の元圧
が変動しても、空気圧回路を通じてシリンジに導入する
圧力レギュレータの二次側圧力を常に設定圧に維持する
ことができ、これにより半田塗布工程でシリンジよりプ
リント配線板に供給するクリーム半田吐出量の安定化が
図れ、後段工程での電子部品のりフロー半田付けを正常
な状態で行うことができる。
As described above, according to the present invention, even if the source pressure of the pneumatic pressure supply source fluctuates, the secondary side pressure of the pressure regulator introduced into the syringe through the pneumatic circuit can always be maintained at the set pressure. In the solder application process, the amount of cream solder supplied from the syringe to the printed wiring board can be stabilized, and electronic component glue flow soldering in the subsequent process can be performed in a normal state.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図、第2図はそれぞれ本発明の実施例、および従来
におけるクリーム半田ディスペンサの制御系統図、第3
図は従来のディスペンサによる空気圧供給源の元圧変動
とクリーム半田吐出量との関係を表した特性図である。 図において、1:シリンジ、2:クリーム半田、5:コ
ントローラ、6:ソレノイドバルブ、7:圧力レギュレ
ータ、8:空気圧回路、9:空気圧供給源、10ニブリ
ント配線板、12:圧力センサ、16:フィ一
1 and 2 are control system diagrams of an embodiment of the present invention and a conventional cream solder dispenser, respectively.
The figure is a characteristic diagram showing the relationship between the source pressure fluctuation of the pneumatic supply source and the amount of cream solder discharged by a conventional dispenser. In the figure, 1: syringe, 2: cream solder, 5: controller, 6: solenoid valve, 7: pressure regulator, 8: pneumatic circuit, 9: pneumatic supply source, 10 niblint wiring board, 12: pressure sensor, 16: fift one

Claims (1)

【特許請求の範囲】[Claims] 1)プリント配線板上に指定した電子部品の実装位置に
クリーム半田を塗布するクリーム半田ディスペンサであ
り、クリーム半田を収容したシリンジと空気圧供給源と
の間を結ぶ空気圧回路にソレノイドバルブ、圧力レギュ
レータを接続し、シリンジを半田塗布パターンに沿って
移動操作しつつ、その移動過程でソレノイドバルブを開
閉して圧力レギュレータの二次側圧力をシリンジに導入
し、その先端ノズルよりプリント配線板上にクリーム半
田を吐出し供給するものにおいて、前記の空気圧回路に
対し、空気圧供給源の圧力変動を補償して圧力レギュレ
ータの二次側圧力を設定圧に定値制御するフィードバッ
ク制御系を設けたことを特徴とするクリーム半田ディス
ペンサ。
1) A cream solder dispenser that applies cream solder to the specified mounting position of electronic components on a printed wiring board, and a solenoid valve and pressure regulator are installed in the pneumatic circuit that connects the syringe containing the cream solder and the pneumatic pressure supply source. Connect the syringe, move the syringe along the solder application pattern, open and close the solenoid valve during the movement process, introduce the pressure regulator's secondary pressure into the syringe, and apply cream solder onto the printed wiring board from the tip nozzle. The pneumatic circuit is characterized by being equipped with a feedback control system for compensating for pressure fluctuations in the pneumatic supply source and controlling the secondary pressure of the pressure regulator to a set pressure at a constant value. Cream solder dispenser.
JP18986290A 1990-07-18 1990-07-18 Cream solder dispernser Pending JPH0481273A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18986290A JPH0481273A (en) 1990-07-18 1990-07-18 Cream solder dispernser

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18986290A JPH0481273A (en) 1990-07-18 1990-07-18 Cream solder dispernser

Publications (1)

Publication Number Publication Date
JPH0481273A true JPH0481273A (en) 1992-03-13

Family

ID=16248427

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18986290A Pending JPH0481273A (en) 1990-07-18 1990-07-18 Cream solder dispernser

Country Status (1)

Country Link
JP (1) JPH0481273A (en)

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