JPH0480658U - - Google Patents
Info
- Publication number
- JPH0480658U JPH0480658U JP12153190U JP12153190U JPH0480658U JP H0480658 U JPH0480658 U JP H0480658U JP 12153190 U JP12153190 U JP 12153190U JP 12153190 U JP12153190 U JP 12153190U JP H0480658 U JPH0480658 U JP H0480658U
- Authority
- JP
- Japan
- Prior art keywords
- nozzle
- jet
- fence
- tip
- soldering device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007788 liquid Substances 0.000 claims 2
- 229910000679 solder Inorganic materials 0.000 claims 2
- 238000005476 soldering Methods 0.000 claims 2
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12153190U JPH0480658U (cs) | 1990-11-19 | 1990-11-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12153190U JPH0480658U (cs) | 1990-11-19 | 1990-11-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0480658U true JPH0480658U (cs) | 1992-07-14 |
Family
ID=31869382
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12153190U Pending JPH0480658U (cs) | 1990-11-19 | 1990-11-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0480658U (cs) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010140375A1 (ja) * | 2009-06-04 | 2010-12-09 | パナソニック株式会社 | 噴流半田付け装置および半田付け方法 |
-
1990
- 1990-11-19 JP JP12153190U patent/JPH0480658U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010140375A1 (ja) * | 2009-06-04 | 2010-12-09 | パナソニック株式会社 | 噴流半田付け装置および半田付け方法 |
| JP5312584B2 (ja) * | 2009-06-04 | 2013-10-09 | パナソニック株式会社 | 噴流半田付け装置および半田付け方法 |
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