JPH048052U

JPH048052U -

Info

Publication number: JPH048052U
Application number: JP4803290U
Authority: JP
Priority date: 1990-05-08
Filing date: 1990-05-08
Publication date: 1992-01-24

Description

[Brief explanation of the drawing]

第１図は本考案の二重管式井戸装置及び熱源供
給装置の一実施例を示す概念模式図、第２図は従
来の装置を示す概念模式図、である。１……井戸装置、２……熱源供給装置、３……
内管、４……外管、６……上部キヤツプロツク、
７……上部帯水層、８……下部キヤツプロツク、
９……下部帯水層、１０，１２……揚水パイプ、
１１，１３……復水パイプ、１４……熱交換器、
１５……放熱管。 FIG. 1 is a conceptual schematic diagram showing an embodiment of the double tube well device and heat source supply device of the present invention, and FIG. 2 is a conceptual schematic diagram showing a conventional device. 1...Well device, 2...Heat source supply device, 3...
Inner pipe, 4...outer pipe, 6...upper cap block,
7... Upper aquifer, 8... Lower capstone,
9...lower aquifer, 10,12...pumping pipe,
11, 13... condensate pipe, 14... heat exchanger,
15... Heat dissipation tube.

Claims

[Scope of Claim for Utility Model Registration] (1) In a well device having a well pipe inserted into a groundwater vein layer, a water well is provided with an appropriate gap between the outer pipe and the inner circumferential wall of the outer pipe. A double well pipe consisting of an inner pipe installed, and a pair of pumping pipes and condensate pipes connected to each of the inner pipe and the outer pipe, and the water sampling port of the outer pipe is connected to the upper part of the well pipe. In addition to facing the aquifer, the inner pipe is also extended to the lower aquifer located below via the capsule, and the water intake port is facing the lower aquifer, making it possible to pump and return water to multiple aquifers with different water temperatures. A well device characterized by making water possible. (2) The well apparatus according to claim 1, and a heat exchanger connected to each pumping pipe and condensate pipe of the inner pipe and outer pipe of the well apparatus, and when heating the heat exchanger. In this case, high-temperature water pumped from the inner pumping pipe is introduced into the heat dissipation pipe and condensed into the upper aquifer through the outer condensation pipe, while during cooling, low-temperature water pumped from the outer pumping pipe is introduced into the heat dissipation pipe. A heat source supply device characterized in that the heat source supply device is configured such that water can be condensed into a lower aquifer through an inner condensate pipe.