JPH0480445B2 - - Google Patents

Info

Publication number
JPH0480445B2
JPH0480445B2 JP19614584A JP19614584A JPH0480445B2 JP H0480445 B2 JPH0480445 B2 JP H0480445B2 JP 19614584 A JP19614584 A JP 19614584A JP 19614584 A JP19614584 A JP 19614584A JP H0480445 B2 JPH0480445 B2 JP H0480445B2
Authority
JP
Japan
Prior art keywords
core
wire
conductive
core chip
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP19614584A
Other languages
Japanese (ja)
Other versions
JPS6174116A (en
Inventor
Kenji Yoshikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kansai Nippon Electric Co Ltd
Original Assignee
Kansai Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kansai Nippon Electric Co Ltd filed Critical Kansai Nippon Electric Co Ltd
Priority to JP19614584A priority Critical patent/JPS6174116A/en
Publication of JPS6174116A publication Critical patent/JPS6174116A/en
Publication of JPH0480445B2 publication Critical patent/JPH0480445B2/ja
Granted legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/127Structure or manufacture of heads, e.g. inductive
    • G11B5/17Construction or disposition of windings

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Magnetic Heads (AREA)

Description

【発明の詳細な説明】 産業上の利用分野 この発明はVTR等の磁気記録装置に組み込ま
れる磁気ヘツドに関するものである。
DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application This invention relates to a magnetic head incorporated in a magnetic recording device such as a VTR.

従来の技術 VTRに使用される磁気ヘツドは、一般に単結
晶フエライト等からなる一対のコアブロツクを、
磁気ギヤツプを形成して接合一体化して磁気回路
を構成したコアチツプに、絶縁被覆処理した銅線
等の線材を、数ターン或いはそれ以上巻着した構
造のもので、この磁気ヘツドは、ヘツドベースに
固定された配線された状態でVTRの回転ドラム
等に実装される。
Conventional technology Magnetic heads used in VTRs generally have a pair of core blocks made of single-crystal ferrite, etc.
This magnetic head has a structure in which several or more turns of insulated copper wire or other wire are wound around a core chip that forms a magnetic gap and is integrated to form a magnetic circuit.This magnetic head is fixed to the head base. It is mounted on the rotating drum of a VTR, etc., with the wires attached.

上記磁気ヘツドの従来例を第4図及び第5図を
参照し乍ら説明すると、図において1は金属製の
取付基板となるヘツドベース、2はヘツドベース
1の表面先端部に貼着固定されたコアチツプ、3
はヘツドベース1の裏面に貼着固定されたプリン
ト基板である。コアチツプ2は2つのコアブロツ
ク2a,2bを、両者間に巻線挿通穴4が形成さ
れるようにして接合一体化したものである。又プ
リント基板3の表面には一対の導電パターン5,
5が被着形成してある。6はコアチツプ2の一対
のコアブロツク2a,2bの一方から他方へと
夫々所定の回転巻回した線材で、巻き始め端と巻
き終り端がプリント基板3の2つの導電パターン
5,5の夫々に半田7,7を用いて電気的かつ機
械的に接続される。尚、8はヘツドベース1の先
端部に形成された線材通し穴で、ヘツドベース1
の表面側から裏面側へと線材6巻始め及び巻終り
の両端を通す。9はヘツドベース1の中央部に形
成した取付穴で、ヘツドベース1を回転ドラム等
にネジ止めするさいに利用される。
A conventional example of the above-mentioned magnetic head will be explained with reference to FIGS. 4 and 5. In the figures, 1 is a head base which is a metal mounting board, and 2 is a core chip fixed to the front end of the surface of the head base 1. ,3
is a printed circuit board that is adhered and fixed to the back surface of the head base 1. The core chip 2 is made by integrally joining two core blocks 2a and 2b such that a winding insertion hole 4 is formed between them. Further, on the surface of the printed circuit board 3, a pair of conductive patterns 5,
5 is formed by adhesion. Reference numeral 6 denotes a wire rod which is wound in a predetermined rotation from one side of the pair of core blocks 2a, 2b of the core chip 2 to the other, respectively, and the winding start end and winding end end are soldered to the two conductive patterns 5, 5 of the printed circuit board 3, respectively. 7, 7 to be electrically and mechanically connected. In addition, 8 is a wire passing hole formed at the tip of the head base 1.
Pass the ends of the 6th turn of wire from the front side to the back side of the wire. Reference numeral 9 denotes a mounting hole formed in the center of the head base 1, which is used when the head base 1 is screwed to a rotating drum or the like.

発明が解決しようとする問題点 上記磁気ヘツドは、ヘツドベース1にコアチツ
プ2、プリント基板3を固定する工程、コアチツ
プ2に線材6を巻回して半田付けする工程を経て
行われるが、線材6のコアチツプ2への巻回及び
線材6の半田付けは手作業で行われているため、
この作業に非常に作業工数がかかると同時に作業
能率が悪く、コスト高になるといつた問題があつ
た。
Problems to be Solved by the Invention The magnetic head described above is manufactured through the steps of fixing the core chip 2 and printed circuit board 3 to the head base 1, and winding and soldering the wire 6 around the core chip 2. Since the winding around 2 and the soldering of wire 6 are done manually,
This work required a large number of man-hours, was inefficient, and resulted in high costs.

問題点を解決するための手段 本発明の問題を解決するための手段は、磁気ヘ
ツドを、両コア部間に線材挿通穴を有する如く接
合一体化された一対のコアからなるコアチツプ
と、上記コアチツプが貼着固定される表面に、上
記コアブロツクのコア部を横断し、かつ、一端が
上記線材挿通穴内に位置する所定本数の導電ラン
ドからなる一対の導電パターンを構成したりプリ
ント基板と、上にプリント基板が表面に貼着固定
される基板であるヘツドベースと、ワイヤボンデ
イング装置により、上記コアチツプのコア部を跨
ぐように配線され、かつ、上記所定本数の導電ラ
ンドを直列に接続するための線材とによつて構成
し、線材のコアチツプへの巻回及び半田付けを自
動化するものである。
Means for Solving the Problems Means for solving the problems of the present invention is to provide a magnetic head with a core chip consisting of a pair of cores integrally joined so as to have a wire insertion hole between both core parts, and A pair of conductive patterns consisting of a predetermined number of conductive lands that cross the core part of the core block and one end of which is located in the wire insertion hole is formed on the surface to which the wire is pasted and fixed. A head base, which is a board on which a printed circuit board is adhered and fixed; and a wire rod which is wired to straddle the core part of the core chip using a wire bonding device, and which connects the predetermined number of conductive lands in series. This system automates the winding and soldering of the wire onto the core chip.

実施例 第1図は本発明に係る磁気ヘツドを示す図面で
あり、図中20は凸形状をした金属製のヘツドベ
ース、21はヘツドベース20の表面に貼着固定
されたプリント基板である。このプリント基板2
1の先端部21はヘツドベース20の先端部20
aより若干前方に突出するように形成してある。
又、プリント基板21の表面には、一対の導電パ
ターン22,23が形成してあり、更にプリント
基板21の先端部21aには、第2図及び第3図
の拡大図に示す如く、一対の導電パターン24,
25が形成してある。この両導電パターン24,
25は、図示の如く、所定の間隔をあけて配列し
た所定本数の導電ランド24a,25aによつて
構成してある。第3図において26はプリント基
板21の先端部21aに貼着固定されるコアチツ
プである。このコアチツプ26は一対のコア2
7,28によつて構成されており、この一対のコ
ア27,28を接合一体化する時、一対のコア2
7,28のコア脚部27a,28a間に線材挿通
穴29が形成されるようにしてある。又、コアチ
ツプ26のプリント基板21の先端部21aへの
貼着固定時には、第3図に示す如く、コア27,
28の各コア脚部27a,28aが、各導電パタ
ーン24,25を構成する所定本数の導電ランド
24a,25aと交叉し、かつ、コアチツプ26
に形成した線材挿通穴29に各導電ランド24
a,25aの内方側の端部が位置するようにして
ある。
Embodiment FIG. 1 is a drawing showing a magnetic head according to the present invention. In the figure, 20 is a metal head base having a convex shape, and 21 is a printed circuit board fixedly attached to the surface of the head base 20. As shown in FIG. This printed circuit board 2
1 is the tip 20 of the head base 20.
It is formed to protrude slightly forward from point a.
A pair of conductive patterns 22 and 23 are formed on the surface of the printed circuit board 21, and a pair of conductive patterns 22 and 23 are formed on the top end 21a of the printed circuit board 21, as shown in the enlarged views of FIGS. conductive pattern 24,
25 is formed. Both conductive patterns 24,
25 is constituted by a predetermined number of conductive lands 24a, 25a arranged at a predetermined interval as shown in the figure. In FIG. 3, reference numeral 26 denotes a core chip that is adhered and fixed to the tip end 21a of the printed circuit board 21. As shown in FIG. This core chip 26 has a pair of cores 2
7 and 28, and when the pair of cores 27 and 28 are joined and integrated, the pair of cores 2
A wire insertion hole 29 is formed between the core leg portions 27a and 28a of the core legs 7 and 28. Furthermore, when the core chip 26 is attached and fixed to the tip end 21a of the printed circuit board 21, the core 27,
Each of the 28 core legs 27a, 28a intersects with a predetermined number of conductive lands 24a, 25a constituting each conductive pattern 24, 25, and the core chip 26
Each conductive land 24 is inserted into the wire insertion hole 29 formed in the
a, 25a are positioned so that the inner ends thereof are located.

30は導電パターン24,25を構成する各導
電ランド24a,25a同士を各々接続するため
の線材であり、この線材30はコアブロツク2
7,28のコア脚部27a,28aを夫々跨ぐよ
うに配線してある。すなわち、任意の導電ランド
24aの窓側端部と、隣りの導電ランド24aの
外側端部とが、一本の線材30で接続され、コア
脚部27aをコイル巻きすることになる。そして
この線材30によつて導電パターン22,23及
び導電パターン24,25は直列に接続される。
31はヘツドベース20の中央部に形成した取付
穴で、ヘツドベース20を回転ドラム等にネジ止
めするさいに利用される。
Reference numeral 30 denotes a wire rod for connecting the conductive lands 24a, 25a constituting the conductive patterns 24, 25, respectively, and this wire rod 30 is connected to the core block 2.
The wires are wired so as to straddle the core leg portions 27a and 28a of No. 7 and 28, respectively. That is, the window-side end of any conductive land 24a and the outer end of the adjacent conductive land 24a are connected by one wire 30, and the core leg 27a is wound into a coil. The conductive patterns 22 and 23 and the conductive patterns 24 and 25 are connected in series by this wire 30.
Reference numeral 31 denotes a mounting hole formed in the center of the head base 20, which is used when the head base 20 is screwed to a rotating drum or the like.

上記構成からなる磁気ヘツドを製造するには、
先ずヘツドベース20の表面にはプリント基板2
1を貼着固定し、次にプリント基板21の先端部
21aにコアチツプ26を接着剤を用いて貼着固
定する。尚、この時、コアチツプ26を構成する
コア27,28の各コア脚部27a,28aが、
各導電パターン24,25を構成する所定本数の
導電ランド24a,25aを横断し、かつ、コア
チツプ26に形成した線材挿通穴29に各導電ラ
ンド24a,25aの内方側の端部が位置するよ
うにしておく。又上記接着剤には、絶縁性も顕著
なもの、例えばエポキシ樹脂を用い、各導電ラン
ド24a,25a同士がシヨートするのを防止す
ると同時に、コアチツプ26のプリント基板21
への接着時、コアチツプ26のエツジによつて導
電ランド24a,25aが切断されるのを防止す
る。次にワイヤボンデイング装置(図示せず)を
用い、線材30によつて各導電ランド24a,2
5a同士を図示の如く接続する。この時、各線材
30は第3図に示した如く、コアブロツク27,
28の各コア脚部27a,28aをそれぞれ跨ぐ
ように配線する。そしてこの導電パターン24,
25を構成する導電ランド24a,25aと線材
30とによつて、従来コアブロツクの外周に巻回
していた線材と等価な作用を持たせると同時に、
この線材30によつて導電ランド22,23及び
導電パターン24,25を直列に接続し、磁気ヘ
ツドの組み立てを終了する。
To manufacture a magnetic head with the above configuration,
First, a printed circuit board 2 is placed on the surface of the head base 20.
1 is attached and fixed, and then a core chip 26 is attached and fixed to the tip end 21a of the printed circuit board 21 using an adhesive. At this time, the core legs 27a, 28a of the cores 27, 28 constituting the core chip 26 are
The inner end of each conductive land 24a, 25a crosses a predetermined number of conductive lands 24a, 25a constituting each conductive pattern 24, 25, and is positioned in a wire insertion hole 29 formed in the core chip 26. Keep it. In addition, the adhesive used is one with remarkable insulating properties, such as epoxy resin, which prevents the conductive lands 24a and 25a from being shot together, and at the same time prevents the printed circuit board 21 of the core chip 26.
This prevents the conductive lands 24a, 25a from being cut by the edges of the core chip 26 when bonding to the conductive lands 24a, 25a. Next, using a wire bonding device (not shown), wire rods 30 are used to bond each conductive land 24a, 2.
5a are connected to each other as shown. At this time, each wire 30 is connected to the core block 27, as shown in FIG.
28 core leg portions 27a, 28a, respectively. And this conductive pattern 24,
The conductive lands 24a, 25a and the wire 30 that make up the core block 25 have an effect equivalent to that of the wire conventionally wound around the outer periphery of the core block.
The conductive lands 22, 23 and the conductive patterns 24, 25 are connected in series using the wire 30, and the assembly of the magnetic head is completed.

尚、上記実施例に於いて、導電パターン24,
25を構成する各導電ランド24a,25aの間
隔は、コアチツプ26の線材挿通穴29内に位置
する内方側を狭くし、外方に行くに従つて広くし
ておけば、各導電ランド24a,25a同士がシ
ヨートするのを確実に防止できる。又コアブロツ
ク27,28のコア脚部27a,28aの線材3
0が接触するエツジ部に、コアチツプ26の先端
面にコーテイングするガラス材と同等のものを塗
布しておければ、このエツジ部に線材30が接触
して絶縁剥れや、極端な場合には、線材30が切
断するのを防止できる。又、上記実施例は、ヘツ
ドベース20上に貼着固定したプリント基板21
の先端部21aに導電パターン24,25を形成
した例について説明したが、導電パターン24,
25のみを形成しヘツドベース並みの強度を有す
る小型のプリント基板21の表面にコアチツプ2
6を貼着固定し、これらの導電パターン24,2
5をワイヤボンデイング装置及び線材30を用
い、上記したのと同様の方法によつて直列に接続
してもよく、この場合には、、線材30を巻回し
たコアチツプ26のみの製造も行える。
Incidentally, in the above embodiment, the conductive pattern 24,
If the distance between the conductive lands 24a and 25a constituting the conductive lands 25 is narrowed on the inner side located in the wire insertion hole 29 of the core chip 26 and widened toward the outside, the distance between the conductive lands 24a, It is possible to reliably prevent the 25a from shooting each other. Also, the wire rods 3 of the core legs 27a, 28a of the core blocks 27, 28
If a glass material equivalent to the glass material coated on the tip surface of the core chip 26 is applied to the edge where the wire 30 contacts, the wire 30 will come into contact with this edge and the insulation will peel off, or in extreme cases, , the wire rod 30 can be prevented from being cut. Further, in the above embodiment, the printed circuit board 21 is attached and fixed on the head base 20.
An example has been described in which the conductive patterns 24 and 25 are formed on the tip end 21a of the conductive patterns 24 and 25.
The core chip 2 is mounted on the surface of a small printed circuit board 21 which has only the core chip 25 and has strength comparable to that of a head base.
6 is pasted and fixed, and these conductive patterns 24, 2
5 may be connected in series by a method similar to that described above using a wire bonding device and the wire 30. In this case, it is also possible to manufacture only the core chip 26 around which the wire 30 is wound.

発明の効果 上記した如く、本発明は、プリント基板に構成
した所定本数の導電ランドからなる導電パターン
と、コアチツプのコア部を跨ぐように配線され、
かつ、上記所定本数の導電ランドを直列に接続す
るための線材とによつて、従来コアチツプに巻回
していた線材と同等の作用を持たせることがで
き、しかも、従来のような手作業によるコア窓へ
の線材挿通作業が不要となる。そして、上記線材
の配線作業をワイヤボンデイング装置によつて行
える。従つて、従来全て手作業で行われていた線
材のコアチツプへの巻回作業を、ワイヤボンデイ
ング技術により、自動化でき、作業能率を向上で
きると同時にコストダウンを図ることができる。
Effects of the Invention As described above, the present invention provides a conductive pattern consisting of a predetermined number of conductive lands configured on a printed circuit board, and a conductive pattern that is wired so as to straddle the core portion of a core chip.
In addition, by using the wire for connecting the predetermined number of conductive lands in series, it is possible to have the same effect as the wire that was conventionally wound around the core chip. There is no need to insert wires into the window. Then, the wire rod wiring work can be performed using a wire bonding device. Therefore, the wire bonding technology can automate the work of winding the wire around the core chip, which has conventionally been done entirely by hand, thereby improving work efficiency and reducing costs.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明に係る磁気ヘツドの平面図、第
2図はプリント基板先端部の拡大図、第3図は磁
気ヘツド先端部の拡大図である。第4図は従来の
磁気ヘツドの背面図、第5図は第4図A−A線断
面図である。 21……プリント基板、24,25……導電パ
ターン、24a,25a……導電ランド、26…
…コアチツプ、27,28……コア、27a,2
8a……コア脚部、29……線材挿通穴、30…
…線材。
FIG. 1 is a plan view of the magnetic head according to the present invention, FIG. 2 is an enlarged view of the tip of the printed circuit board, and FIG. 3 is an enlarged view of the tip of the magnetic head. FIG. 4 is a rear view of a conventional magnetic head, and FIG. 5 is a sectional view taken along the line A--A in FIG. 21... Printed circuit board, 24, 25... Conductive pattern, 24a, 25a... Conductive land, 26...
... Core chip, 27, 28 ... Core, 27a, 2
8a... Core leg portion, 29... Wire insertion hole, 30...
…wire.

Claims (1)

【特許請求の範囲】[Claims] 1 両コア部間に線材挿通穴を有する如く接合一
体化された一対のコアからなるコアチツプと、上
記コアチツプが貼着固定される表面に、上記コア
のコア脚部を横断し、かつ、一端が上記線材挿通
穴内に位置する所定本数の導電ランドからなる一
対の導電パターンを構成したプリント基板と、上
にプリント基板が表面に貼着固定されるヘツドベ
ースと、ワイヤボンデイング装置により、上記コ
アチツプのコア脚部を跨ぐように配線され、か
つ、上記所定本数の導電ランドを直列に接続する
ための線材とからなることを特徴とする磁気ヘツ
ド。
1. A core chip consisting of a pair of cores that are joined and integrated so as to have a wire insertion hole between both core parts, and a core chip that crosses the core leg part of the core and has one end on the surface to which the core chip is adhered and fixed. A printed circuit board comprising a pair of conductive patterns consisting of a predetermined number of conductive lands located in the wire insertion hole, a head base on which the printed circuit board is adhered and fixed, and a wire bonding device are used to form the core legs of the core chip. 1. A magnetic head comprising: a wire rod which is wired so as to straddle the conductive lands and connect the predetermined number of conductive lands in series.
JP19614584A 1984-09-19 1984-09-19 Magnetic head Granted JPS6174116A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19614584A JPS6174116A (en) 1984-09-19 1984-09-19 Magnetic head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19614584A JPS6174116A (en) 1984-09-19 1984-09-19 Magnetic head

Publications (2)

Publication Number Publication Date
JPS6174116A JPS6174116A (en) 1986-04-16
JPH0480445B2 true JPH0480445B2 (en) 1992-12-18

Family

ID=16352966

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19614584A Granted JPS6174116A (en) 1984-09-19 1984-09-19 Magnetic head

Country Status (1)

Country Link
JP (1) JPS6174116A (en)

Also Published As

Publication number Publication date
JPS6174116A (en) 1986-04-16

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