JPH0480048U - - Google Patents
Info
- Publication number
- JPH0480048U JPH0480048U JP12441890U JP12441890U JPH0480048U JP H0480048 U JPH0480048 U JP H0480048U JP 12441890 U JP12441890 U JP 12441890U JP 12441890 U JP12441890 U JP 12441890U JP H0480048 U JPH0480048 U JP H0480048U
- Authority
- JP
- Japan
- Prior art keywords
- film carrier
- film
- holes
- carrier tape
- resin film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims 1
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12441890U JP2500236Y2 (ja) | 1990-11-26 | 1990-11-26 | フイルムキヤリアテ―プ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12441890U JP2500236Y2 (ja) | 1990-11-26 | 1990-11-26 | フイルムキヤリアテ―プ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0480048U true JPH0480048U (US20030220297A1-20031127-C00074.png) | 1992-07-13 |
| JP2500236Y2 JP2500236Y2 (ja) | 1996-06-05 |
Family
ID=31872070
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12441890U Expired - Lifetime JP2500236Y2 (ja) | 1990-11-26 | 1990-11-26 | フイルムキヤリアテ―プ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2500236Y2 (US20030220297A1-20031127-C00074.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000054324A1 (fr) * | 1999-03-11 | 2000-09-14 | Seiko Epson Corporation | Substrat de cablage flexible, bande porte-puces, dispositif a semiconducteur de type bande, dispositif a semiconducteur, procede de fabrication d'un dispositif a semiconducteur, carte de circuit imprime, et dispositif electronique. |
-
1990
- 1990-11-26 JP JP12441890U patent/JP2500236Y2/ja not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000054324A1 (fr) * | 1999-03-11 | 2000-09-14 | Seiko Epson Corporation | Substrat de cablage flexible, bande porte-puces, dispositif a semiconducteur de type bande, dispositif a semiconducteur, procede de fabrication d'un dispositif a semiconducteur, carte de circuit imprime, et dispositif electronique. |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2500236Y2 (ja) | 1996-06-05 |
