JPH0479441U - - Google Patents
Info
- Publication number
- JPH0479441U JPH0479441U JP12258490U JP12258490U JPH0479441U JP H0479441 U JPH0479441 U JP H0479441U JP 12258490 U JP12258490 U JP 12258490U JP 12258490 U JP12258490 U JP 12258490U JP H0479441 U JPH0479441 U JP H0479441U
- Authority
- JP
- Japan
- Prior art keywords
- leads
- led out
- wall surface
- lead
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12258490U JPH0479441U (ru) | 1990-11-22 | 1990-11-22 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12258490U JPH0479441U (ru) | 1990-11-22 | 1990-11-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0479441U true JPH0479441U (ru) | 1992-07-10 |
Family
ID=31870350
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12258490U Pending JPH0479441U (ru) | 1990-11-22 | 1990-11-22 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0479441U (ru) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006222168A (ja) * | 2005-02-09 | 2006-08-24 | Shindengen Electric Mfg Co Ltd | 樹脂封止型半導体装置のリードフレーム及び樹脂封止型半導体装置の製造方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6049643B2 (ja) * | 1983-09-16 | 1985-11-02 | 禎一 谷垣 | 4−ヒドロキシ−4′−ビニルビフエニル重合体およびその製造法 |
JPH01238152A (ja) * | 1988-03-18 | 1989-09-22 | Nec Kyushu Ltd | 半導体装置 |
-
1990
- 1990-11-22 JP JP12258490U patent/JPH0479441U/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6049643B2 (ja) * | 1983-09-16 | 1985-11-02 | 禎一 谷垣 | 4−ヒドロキシ−4′−ビニルビフエニル重合体およびその製造法 |
JPH01238152A (ja) * | 1988-03-18 | 1989-09-22 | Nec Kyushu Ltd | 半導体装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006222168A (ja) * | 2005-02-09 | 2006-08-24 | Shindengen Electric Mfg Co Ltd | 樹脂封止型半導体装置のリードフレーム及び樹脂封止型半導体装置の製造方法 |