JPH0477654A - Temperature correction method for thermomechanical analysis - Google Patents
Temperature correction method for thermomechanical analysisInfo
- Publication number
- JPH0477654A JPH0477654A JP19334790A JP19334790A JPH0477654A JP H0477654 A JPH0477654 A JP H0477654A JP 19334790 A JP19334790 A JP 19334790A JP 19334790 A JP19334790 A JP 19334790A JP H0477654 A JPH0477654 A JP H0477654A
- Authority
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- Prior art keywords
- sample
- temperature
- temperature correction
- correction
- measurement
- Prior art date
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- Granted
Links
- 238000012937 correction Methods 0.000 title claims abstract description 74
- 238000000034 method Methods 0.000 title claims description 13
- 230000000930 thermomechanical effect Effects 0.000 title claims description 10
- 238000004458 analytical method Methods 0.000 title claims description 5
- 239000000523 sample Substances 0.000 claims abstract description 131
- 238000006073 displacement reaction Methods 0.000 claims abstract description 16
- 230000007704 transition Effects 0.000 claims abstract description 14
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000000463 material Substances 0.000 claims abstract description 9
- 238000010438 heat treatment Methods 0.000 claims description 7
- 238000005259 measurement Methods 0.000 abstract description 26
- 238000002844 melting Methods 0.000 abstract description 9
- 230000008018 melting Effects 0.000 abstract description 9
- 238000009529 body temperature measurement Methods 0.000 description 6
- 238000012360 testing method Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 4
- 238000001816 cooling Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000013076 target substance Substances 0.000 description 1
Landscapes
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、熱機械的分析の温度補正方法に関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a temperature correction method for thermomechanical analysis.
本発明は、熱機械的分析装置を用いて測定を行う場合、
正確に試料温度を測定することを目的とし、試料保持部
材の底部に測定試料の約半分から同一の長さで測定試料
と同一材質の材料を配置し、これを温度補正用台座とし
、この温度補正用台座の上部に試料容器を載置し、この
試料容器の中に温度補正用試料を入れ、この温度補正用
試料の融点を測定し、一種または複数種の前記温度補正
用試料の融点測定値より温度補正値を算出し、この温度
補正値を温度補正器に入力し、測定試料の熱電対による
検出温度を前記温度補正器によって補正し出力すること
により、測定試料の材質や太きさによる温度計測誤差を
防ぐこ止ができ１．熱膨張率測定や転移温度測定などに
おいて測定精度を向上させることができる方法である。In the present invention, when measuring using a thermomechanical analysis device,
In order to accurately measure the sample temperature, a piece of material made of the same material as the sample to be measured is placed at the bottom of the sample holding member at the same length from about half of the sample to be measured, and this is used as a pedestal for temperature correction. A sample container is placed on the top of the correction pedestal, a temperature correction sample is placed in the sample container, the melting point of the temperature correction sample is measured, and the melting point of one or more types of temperature correction samples is measured. By calculating a temperature correction value from the value, inputting this temperature correction value into a temperature correction device, and correcting the temperature detected by the thermocouple of the measurement sample using the temperature correction device and outputting it, the material and thickness of the measurement sample can be determined. It is possible to prevent temperature measurement errors due to 1. This is a method that can improve measurement accuracy in thermal expansion coefficient measurements, transition temperature measurements, etc.
従来の熱機械的分析装置の温度補正方法は、第４図に示
される構成によって行われていた。A conventional temperature correction method for a thermomechanical analyzer has been performed using the configuration shown in FIG.
底を有する筒状の試料保持部材１の底部に試料台８が載
置され、その上部に温度補正用試料１１の入った試料容
器１０が載置され、更にその上部に試料容器Ｍ１２が載
せである。前記試料保持部材１の試料載置部と前記試料
容器１０及び前記温度補正用試料１１は、加熱炉７内に
配置される。A sample stage 8 is placed on the bottom of a cylindrical sample holding member 1 having a bottom, a sample container 10 containing a temperature correction sample 11 is placed on top of the table 8, and a sample container M12 can be placed on top of it. be. The sample mounting portion of the sample holding member 1, the sample container 10, and the temperature correction sample 11 are placed in a heating furnace 7.
また、前記試料容器１０の近傍には、熱電対６が配置さ
れ、熱電対６によって前記温度補正用試料】】の温度を
検出する。前記熱電対６は、温度計測器１３に接続され
、温度検出信号をこの温度計測器１３に送る。Further, a thermocouple 6 is arranged near the sample container 10, and the temperature of the temperature correction sample is detected by the thermocouple 6. The thermocouple 6 is connected to a temperature measuring device 13 and sends a temperature detection signal to this temperature measuring device 13.
一方、前記試料容器蓋１２の上端には、プローブ２が案
内され、このプローブ２の中央部には、差動トランスコ
ア３が固定され、その上部には力発生器５が設置されて
いる。On the other hand, a probe 2 is guided at the upper end of the sample container lid 12, a differential transformer core 3 is fixed to the center of the probe 2, and a force generator 5 is installed above the probe 2.
１１；ｊ記温度補正用試料１１の温度を前記カロ熱炉７
によって上部さ−Ｕると、前記温度ｅ＋）ｉ正用試ネ旧
１が純金属等である場合、その融点の温度に到達すると
直ちに融解し始めるため、前記プローブ２と前記差動ト
ランスコア３は前記力発生器５により下方に押され、ト
コ時に１陵し始める。このときの変位の信号は、差動ト
ランス本体４からこれに接続されている変位計測器１６
に送られる。また、このときの温度は、前記熱電対６か
ら温度ａ１測器１３に送られる。この測定温度と前記温
度補正用試料１１の融点の文献値とを比較して、その差
分を補正値とする方法がある。11; Adjust the temperature of the sample 11 for temperature correction in j.
If the probe 2 and the differential transformer core 3 is pushed downward by the force generator 5, and when it reaches the top, it begins to curve. The displacement signal at this time is transmitted from the differential transformer main body 4 to the displacement measuring device 16 connected to the differential transformer main body 4.
sent to. Further, the temperature at this time is sent from the thermocouple 6 to the temperature a1 measuring device 13. There is a method of comparing this measured temperature with the literature value of the melting point of the temperature correction sample 11 and using the difference as a correction value.
−ｉに連続的に温度を変化させながら、物質の温度を計
測する場合、対象の物質と温度計との間に温度勾配が生
しる。そこで、温度測定の精度を」二げるため温度勾配
による誤差を補正する必要がある。この補正方法として
は、前述のように転移温度（融点）の良く知られた物質
の転移する温度を温度ｇＩで計測し、この測定値と転移
温度の良く知られている物質の転移温度値との差分を補
正値とする。実際にある試料を測定した場合には、その
測定温度値に補正値を加える方法が良く用いられる。When measuring the temperature of a substance while continuously changing the temperature to −i, a temperature gradient occurs between the target substance and the thermometer. Therefore, in order to improve the accuracy of temperature measurement, it is necessary to correct errors caused by temperature gradients. As mentioned above, this correction method involves measuring the transition temperature of a substance with a well-known transition temperature (melting point) at the temperature gI, and comparing this measured value with the transition temperature value of a substance with a well-known transition temperature. Let the difference be the correction value. When a sample is actually measured, a method of adding a correction value to the measured temperature value is often used.
前述補正方法は、温度計と測定試料との位置関係が一定
でかつ試ネ４の測定が温度補正のための温度補正用試料
を測定したときとほぼ同一状態である場合のみ有効であ
る。The above-mentioned correction method is effective only when the positional relationship between the thermometer and the measurement sample is constant and the measurement by the test tube 4 is in almost the same state as when measuring the temperature correction sample for temperature correction.
通常、熱機械的分析装置においては、測定に用いられる
試料の形状が多様なため温度計と測定試料との位置関係
は一定とはならない。また、この試ネ４体積は、温度補
正用試料に比べ、著しく大きいため測定試料と温度補正
試料とが同一状態で測定されることはほとんどない。従
って、従来の補正方法により補正された温度は、測定試
料の真の温度に対し、大きな誤差をもち正しい温度測定
がなされなかった。Normally, in a thermomechanical analyzer, the positional relationship between the thermometer and the measurement sample is not constant because the shapes of the samples used for measurement vary. Furthermore, since the volume of the sample 4 is significantly larger than that of the temperature correction sample, the measurement sample and the temperature correction sample are almost never measured in the same state. Therefore, the temperature corrected by the conventional correction method has a large error with respect to the true temperature of the measurement sample, and correct temperature measurement cannot be performed.
更に、測定試料の体積が同一の場合でもその材質の相違
により熱伝導度や熱容量が異なるため試月内の温度分布
も異なってくる。そのため、試料の温度をその近傍に配
置されている熱電対によって正しく計測することはほと
んど不可能である。Furthermore, even if the volume of the measurement sample is the same, the thermal conductivity and heat capacity will differ due to the difference in the material, so the temperature distribution within the trial month will also differ. Therefore, it is almost impossible to accurately measure the temperature of the sample using a thermocouple placed nearby.
本発明は上記の欠点をなくすため開発されたもので、試
料を底部に配置する試料保持部材と、試才°ｌの上部に
案内されたプローブと、試料の長さの変化を検出する変
位検出器と、これに接続された変位計測器と試料の近傍
に配置された温度検出器と、これに接続された温度計測
器とこれに接続された温度補正器と、試＄４の温度を変
化させる加熱炉とを備えた熱機械的分析装置において、
試料の約半分の長さの材料の上部に温度補正用試料の入
った試料容器を載置し、この試料容器に試料容器蓋を置
き、前記プローブを前記試料容器蓋に押し当て、前記加
熱炉により前記温度補正用試料を加熱し、前記温度補正
用試料の転移温度の計測値より前記温度検出器での検出
温度を補正する方法である。The present invention was developed to eliminate the above-mentioned drawbacks, and includes a sample holding member for placing the sample at the bottom, a probe guided at the top of the sample, and a displacement detector for detecting changes in sample length. A displacement measuring device connected to this, a temperature detector placed near the sample, a temperature measuring device connected to this, a temperature compensator connected to this, and the temperature of the test $4 are changed. In a thermomechanical analyzer equipped with a heating furnace,
A sample container containing a temperature correction sample is placed on top of the material about half the length of the sample, a sample container lid is placed on the sample container, the probe is pressed against the sample container lid, and the heating furnace is heated. In this method, the temperature correction sample is heated, and the temperature detected by the temperature detector is corrected based on the measured value of the transition temperature of the temperature correction sample.
上記方法による作用は、分析する試料の測定と温度補正
のだめの測定を同時に行うためほぼ同一条件でそれらを
測定することになり、試料温度を代表する試料の中心位
置に温度補正用試料を置き測定し、その検出値より温度
補正値を求めるため、温度補正精度が向上し正確に温度
計測することができる。それによって、熱膨張率や転移
温度などを精度良く測定することができる。The effect of the above method is that the measurement of the sample to be analyzed and the measurement of the temperature correction tank are performed at the same time, so they are measured under almost the same conditions, and the temperature correction sample is placed at the center of the sample that represents the sample temperature However, since a temperature correction value is determined from the detected value, temperature correction accuracy is improved and temperature can be measured accurately. Thereby, the coefficient of thermal expansion, transition temperature, etc. can be measured with high accuracy.
第１図は本発明に関わる実施例の構成図である。 FIG. 1 is a configuration diagram of an embodiment related to the present invention.
９は温度補正用台座であり、試料と同材質で、試料の約
半分の長さのものである。この温度（；ｌ圧用台座９は
試料台８の上に置かれ、更に試ｔＪ台Ｂは試料保持部材
ｌの底に設置される。温度補正用台座９の上には試料容
器８が載置され、この試ギ４容器８の中に転移温度の良
く知られた温度補正用試料（高純度物質）】１を入れ、
その上に試料容器蓋】２を載せる。温度補正用試料１１
、試料容器蓋１２は力発生器５から適切な力を伝達され
たプローブ２によって押され固定される。６は温度検出
器としての熱電対で、試ｔ［保持部材Ｉ内の定まった位
置に固定され、温度信号を出力し温度計測器Ｉ３に送る
。差動トランスコア３と差動トランス本体４は変位検出
器で差動トランスコア３はプローブ２と差動トランス本
体４は試１．）保持部材１とそれぞれ接続されている。Reference numeral 9 denotes a temperature correction pedestal, which is made of the same material as the sample and has a length approximately half that of the sample. The pressure pedestal 9 is placed on the sample pedestal 8, and the test tJ pedestal B is placed on the bottom of the sample holding member 1. The sample container 8 is placed on the temperature correction pedestal 9. A temperature correction sample (high-purity substance) with a well-known transition temperature was placed in the sample 4 container 8,
Place the sample container lid 2 on top of it. Temperature correction sample 11
, the sample container lid 12 is pushed and fixed by the probe 2 to which an appropriate force is transmitted from the force generator 5. Reference numeral 6 denotes a thermocouple as a temperature detector, which is fixed at a fixed position within the holding member I, outputs a temperature signal, and sends it to the temperature measuring device I3. The differential transformer core 3 and the differential transformer main body 4 are the displacement detectors, and the differential transformer core 3, the probe 2, and the differential transformer main body 4 are the test 1. ) are respectively connected to the holding member 1.
差動トランスコア３及び差動トランス本体４は、プロー
ブ２と試料保持部材ｌとの相対位置の変位量を検出し、
変位量信号を出力し、変位３１測器１６に送る。試料保
持部材１の周辺には加υ−炉７が固定されている。この
加熱炉７は冷却装置１７と温度制御器１８に接続され、
この温度！ＩＩ＋御２３１８により温度プログラムに従
って試料保持部イイ１内の温度が制御され、温度補正用
台座９、試料容器１０． ’ｉユ度補正補正用試料１１
度を連続的に変化さセる。The differential transformer core 3 and the differential transformer main body 4 detect the displacement amount of the relative position between the probe 2 and the sample holding member l,
A displacement signal is output and sent to the displacement 31 measuring instrument 16. A heating furnace 7 is fixed around the sample holding member 1 . This heating furnace 7 is connected to a cooling device 17 and a temperature controller 18,
This temperature! II+ control 2318 controls the temperature inside the sample holder II 1 according to the temperature program, and the temperature correction pedestal 9, sample container 10. 'iyu degree correction sample 11
The degree changes continuously.
このように構成された装置において、例えば測定試料と
同じプログラムで温度が変化するように指定しておくと
、温度制御器１８によって試料保持部材１内の温度が上
がっていく。温度が上昇し、温度補正用試料ＩＩがその
転移温度（融点）付近に到達すると融解し始める。温度
補正用試料ＩＩはプローブ２により押されているため融
解と同時に圧縮される。このときの変位量は、プローブ
２、差動トランスコア３、差動トランス本体４を通して
変位計測器１６に送られる。In the apparatus configured in this way, if the temperature is specified to change according to the same program as that of the measurement sample, the temperature inside the sample holding member 1 is increased by the temperature controller 18. When the temperature rises and temperature correction sample II reaches around its transition temperature (melting point), it begins to melt. Since the temperature correction sample II is pressed by the probe 2, it is simultaneously melted and compressed. The amount of displacement at this time is sent to the displacement measuring device 16 through the probe 2, the differential transformer core 3, and the differential transformer main body 4.
一方、試料保持部材１内の温度は熱電対６により連続的
に計測されているため、第２図に示したように変位信号
の急激に減少する温度を読みとることにより、温度補正
試料の融点（正確な温度を示す）を測定することができ
る。第３図に示したように温度補正用試料の文献値との
差に基づいて温度補正値を求める。つまり、温度補正試
料」１１の融点をＴ２４とし、そのとき熱電対による検
出温度をＴｏとすると、熱Ｔｉ、幻での検出温度がＴ！
３のときの補正値はＴ、、−Ｔ、、となる。温度補正の
精度は補正点から遠ざかるに従い低下するが補正点を複
数とすることにより、補正点間の補正精度は著しく向上
する。複数の転移温度の良く知られた温度補正用試料を
上記と同様の方法で測定することにより、複数の温度で
の温度補正値を求めることができる。これらの温度補正
値を温度補正器１４に入力しておく。その後で試料台８
の上に測定試料を載置し、その上に力発生器５から適当
な力を伝達されたプローブを押し当てる。更に、温度プ
ログラムに従って温度制御器１８により試料保持部材１
内の温度が制御され、測定試料の温度を連続的に変化さ
せる。このときの温度は熱電対６により検知され、温度
信号として出力され、温度計測器に送られ温度計測値と
して計測される。更に、この計ｉ！ＩＩＩ値が温度補正
器１４に送られ、その計測値に先に入力されていた温度
補正値が加えられ試料の温度値として温度出力器Ｉ５に
送られ温度測定値とじ−ζ出力される。出力された計測
値は、温度補正のための測定と実試料の測定とがほぼ同
一条件で行われているため温度補正点の範囲内では十分
に精度が高い値となる。On the other hand, since the temperature inside the sample holding member 1 is continuously measured by the thermocouple 6, by reading the temperature at which the displacement signal rapidly decreases as shown in FIG. (indicating accurate temperature) can be measured. As shown in FIG. 3, a temperature correction value is determined based on the difference between the temperature correction sample and the literature value. In other words, if the melting point of Temperature Correction Sample 11 is T24, and the temperature detected by the thermocouple is To, then the heat Ti, the phantom detected temperature is T!
3, the correction value becomes T, , -T, . The accuracy of temperature correction decreases as the distance from the correction point increases, but by providing a plurality of correction points, the correction accuracy between the correction points is significantly improved. By measuring well-known temperature correction samples having a plurality of transition temperatures in the same manner as described above, temperature correction values at a plurality of temperatures can be obtained. These temperature correction values are input into the temperature corrector 14. After that, sample stage 8
A measurement sample is placed on top of the sample, and a probe to which an appropriate force is applied from the force generator 5 is pressed onto the sample. Further, the sample holding member 1 is heated by the temperature controller 18 according to the temperature program.
The temperature inside the chamber is controlled, and the temperature of the sample to be measured is continuously changed. The temperature at this time is detected by the thermocouple 6, outputted as a temperature signal, sent to a temperature measuring device, and measured as a temperature measurement value. Furthermore, this total i! The III value is sent to the temperature corrector 14, and the previously input temperature correction value is added to the measured value, and the result is sent to the temperature output device I5 as the sample temperature value, where the temperature measurement value is output. The output measurement value has sufficiently high accuracy within the range of the temperature correction point because the measurement for temperature correction and the measurement of the actual sample are performed under almost the same conditions.
以上のように、本発明によれば熱機械的分析装置におい
て実試料の測定と同一条件、同一状態で温度補正の測定
を行うため、従来の技術に比べ数倍以上の精度で温度の
補正ができ、高精度の温度測定ができる。更に、熱膨張
率や転移温度などの測定精度を上げることができる。As described above, according to the present invention, temperature correction is performed using a thermomechanical analyzer under the same conditions and conditions as those used for measurement of an actual sample, so temperature correction can be performed with an accuracy several times higher than that of conventional techniques. It is possible to measure temperature with high precision. Furthermore, the measurement accuracy of thermal expansion coefficient, transition temperature, etc. can be improved.
第１図は本発明を実施する装置の断面図、第２図は温度
とプローブ変位量の関係図、第３図は測定時間と温度の
関係図、第４図は従来例による装置の断面図である。
】 ・ ・
２ ・
３ ・ ・
４ ・ ・
５ ・ ・
６ ・ ・
７ ・ ・
８ ・ ・
９ ・ ・
１０・ ・
試料保持部材
プローブ
差動トランスコア
差動トランス本体
力発生器
熱電対
加熱炉
試料台
温度補正用台座
試料容器
１ｊ ・・温度補正用試料
１２・・・試ｉｌ容器用蓋
１３・・・温度計測器
１４・・・温度補正器
】５・・・温度出力器
１６・・・変位計測器
１７・・・冷却４Ａ置
１８・・・温度制御器
２１ ・・融点測定値
１゛２３・・熱電対による検出温度
”ｆ” ２４・・融点
出願人 セイコー電子工業株式会社
代理人 弁理士 林 敬 之 助逼曳細
両支市、ヲ見ｊ定４直の説Ｂ月図
第２図
第１図
時間
温度稀°正の説明図
第３図Fig. 1 is a sectional view of an apparatus implementing the present invention, Fig. 2 is a relation between temperature and probe displacement, Fig. 3 is a relation between measurement time and temperature, and Fig. 4 is a sectional view of a conventional apparatus. It is. ] ・ ・ 2 ・ 3 ・ ・ 4 ・ ・ 5 ・ ・ 6 ・ ・ 7 ・ ・ 8 ・ ・ 9 ・ ・ 10 Temperature correction pedestal sample container 1j...Temperature correction sample 12...Test sample container lid 13...Temperature measuring device 14...Temperature compensator] 5...Temperature output device 16...Displacement measurement Container 17...Cooling 4A position 18...Temperature controller 21...Measured value of melting point 1゛23...Temperature detected by thermocouple "f" 24...Melting point Applicant Seiko Electronic Industries Co., Ltd. Agent Patent attorney Hayashi Takayuki Suketao Hikisai Ryōshiichi, Womiji 4 shift theory B Monthly map Figure 2 Figure 1 Explanatory diagram of time temperature frequency correction Figure 3
Claims (1)
に案内されたプローブと、前記試料の長さの変化を検出
する変位検出器と、前記試料の近傍に配置された熱電対
と、前記熱電対に接続された温度計測器と、前記温度計
測器に接続された温度補正器と、前記試料の温度を変化
させる加熱炉とを備えた熱機械的分析装置にて、熱機械
的分析を行う方法において、分析する試料と同材質の温
度補正用台座を前記試料保持部材に載置し、前記温度補
正用台座の上部に試料容器を載置し、前記試料容器の中
に温度補正用試料を入れ、前記温度補正用試料の上に試
料容器蓋を配置し、前記プローブを前記試料容器蓋に押
し当て、前記加熱炉により前記温度補正用試料を加熱し
、前記温度補正用試料の転移温度の計測値より前記熱電
対での検出温度を補正することを特徴とする熱機械的分
析の温度補正方法。a sample holding member for disposing the sample at the bottom; a probe guided to the top of the sample; a displacement detector for detecting changes in the length of the sample; a thermocouple disposed near the sample; Thermomechanical analysis is performed using a thermomechanical analyzer equipped with a temperature measuring device connected to a thermocouple, a temperature corrector connected to the temperature measuring device, and a heating furnace that changes the temperature of the sample. In this method, a temperature correction pedestal made of the same material as the sample to be analyzed is placed on the sample holding member, a sample container is placed on top of the temperature correction pedestal, and a temperature correction sample is placed in the sample container. , place a sample container lid on top of the temperature correction sample, press the probe against the sample container lid, heat the temperature correction sample in the heating furnace, and increase the transition temperature of the temperature correction sample. A temperature correction method for thermomechanical analysis, characterized in that the temperature detected by the thermocouple is corrected from the measured value.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19334790A JP2909922B2 (en) | 1990-07-20 | 1990-07-20 | Temperature compensation method for thermomechanical analysis |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19334790A JP2909922B2 (en) | 1990-07-20 | 1990-07-20 | Temperature compensation method for thermomechanical analysis |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0477654A true JPH0477654A (en) | 1992-03-11 |
| JP2909922B2 JP2909922B2 (en) | 1999-06-23 |
Family
ID=16306390
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19334790A Expired - Fee Related JP2909922B2 (en) | 1990-07-20 | 1990-07-20 | Temperature compensation method for thermomechanical analysis |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2909922B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0821810A (en) * | 1994-07-08 | 1996-01-23 | Noritake Co Ltd | Melting point measuring method and measuring device for inorganic material |
| EP1429129A1 (en) * | 2002-12-12 | 2004-06-16 | Rigaku Corporation | Temperature correction method for thermal analysis apparatus and thermal analysis apparatus |
| WO2013125133A1 (en) * | 2012-02-22 | 2013-08-29 | シャープ株式会社 | Heat treatment method of solid phase raw material and device thereof, and method of producing ingot, article and solar cell |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103868947B (en) * | 2014-03-31 | 2016-03-30 | 孙东生 | The measuring method of 0 ~ 60 DEG C of rock thermal linear expansion coefficient and measurement mechanism |
-
1990
- 1990-07-20 JP JP19334790A patent/JP2909922B2/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0821810A (en) * | 1994-07-08 | 1996-01-23 | Noritake Co Ltd | Melting point measuring method and measuring device for inorganic material |
| EP1429129A1 (en) * | 2002-12-12 | 2004-06-16 | Rigaku Corporation | Temperature correction method for thermal analysis apparatus and thermal analysis apparatus |
| US7044635B2 (en) | 2002-12-12 | 2006-05-16 | Rigaku Corporation | Temperature correction method for thermal analysis apparatus and thermal analysis apparatus |
| WO2013125133A1 (en) * | 2012-02-22 | 2013-08-29 | シャープ株式会社 | Heat treatment method of solid phase raw material and device thereof, and method of producing ingot, article and solar cell |
| JP2013170108A (en) * | 2012-02-22 | 2013-09-02 | Sharp Corp | Method and apparatus for heat-treating solid-phase raw material, ingot and application thereof |
| CN104136664A (en) * | 2012-02-22 | 2014-11-05 | 夏普株式会社 | Heat treatment method of solid phase raw material and device thereof, and method of producing ingot, article and solar cell |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2909922B2 (en) | 1999-06-23 |
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