JPH0477261U - - Google Patents

Info

Publication number
JPH0477261U
JPH0477261U JP12030190U JP12030190U JPH0477261U JP H0477261 U JPH0477261 U JP H0477261U JP 12030190 U JP12030190 U JP 12030190U JP 12030190 U JP12030190 U JP 12030190U JP H0477261 U JPH0477261 U JP H0477261U
Authority
JP
Japan
Prior art keywords
groove
support plate
end side
electronic element
grooves
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12030190U
Other languages
English (en)
Japanese (ja)
Other versions
JP2525555Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990120301U priority Critical patent/JP2525555Y2/ja
Publication of JPH0477261U publication Critical patent/JPH0477261U/ja
Application granted granted Critical
Publication of JP2525555Y2 publication Critical patent/JP2525555Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/183—Connection portion, e.g. seal
    • H01L2924/18301—Connection portion, e.g. seal being an anchoring portion, i.e. mechanical interlocking between the encapsulation resin and another package part

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1990120301U 1990-11-19 1990-11-19 樹脂封止型半導体装置用リードフレーム組立体 Expired - Lifetime JP2525555Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990120301U JP2525555Y2 (ja) 1990-11-19 1990-11-19 樹脂封止型半導体装置用リードフレーム組立体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990120301U JP2525555Y2 (ja) 1990-11-19 1990-11-19 樹脂封止型半導体装置用リードフレーム組立体

Publications (2)

Publication Number Publication Date
JPH0477261U true JPH0477261U (un) 1992-07-06
JP2525555Y2 JP2525555Y2 (ja) 1997-02-12

Family

ID=31868214

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990120301U Expired - Lifetime JP2525555Y2 (ja) 1990-11-19 1990-11-19 樹脂封止型半導体装置用リードフレーム組立体

Country Status (1)

Country Link
JP (1) JP2525555Y2 (un)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04117454U (ja) * 1991-03-29 1992-10-21 サンケン電気株式会社 絶縁物被覆電子部品
JP2009021630A (ja) * 2008-09-24 2009-01-29 Sanyo Electric Co Ltd 半導体装置の製造方法
JP2013258387A (ja) * 2012-05-15 2013-12-26 Rohm Co Ltd パワーモジュール半導体装置
JP2015023212A (ja) * 2013-07-22 2015-02-02 ローム株式会社 パワーモジュールおよびその製造方法
DE102019112979A1 (de) * 2019-05-16 2020-11-19 Infineon Technologies Ag Clip mit Verriegelungsausnehmung

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6366953A (ja) * 1986-09-08 1988-03-25 Toshiba Corp 樹脂絶縁型半導体装置
JPS6378558A (ja) * 1986-09-22 1988-04-08 Hitachi Ltd 電子装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6366953A (ja) * 1986-09-08 1988-03-25 Toshiba Corp 樹脂絶縁型半導体装置
JPS6378558A (ja) * 1986-09-22 1988-04-08 Hitachi Ltd 電子装置

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04117454U (ja) * 1991-03-29 1992-10-21 サンケン電気株式会社 絶縁物被覆電子部品
JP2009021630A (ja) * 2008-09-24 2009-01-29 Sanyo Electric Co Ltd 半導体装置の製造方法
JP2013258387A (ja) * 2012-05-15 2013-12-26 Rohm Co Ltd パワーモジュール半導体装置
US9691673B2 (en) 2012-05-15 2017-06-27 Rohm Co., Ltd. Power module semiconductor device
JP2015023212A (ja) * 2013-07-22 2015-02-02 ローム株式会社 パワーモジュールおよびその製造方法
DE102019112979A1 (de) * 2019-05-16 2020-11-19 Infineon Technologies Ag Clip mit Verriegelungsausnehmung
US11728309B2 (en) 2019-05-16 2023-08-15 Infineon Technologies Ag Clip having locking recess for connecting an electronic component with a carrier in a package
DE102019112979B4 (de) 2019-05-16 2024-07-11 Infineon Technologies Ag Clip mit Verriegelungsausnehmung, Package mit dem Clip und Verfahren zum Herstellen eines Packages

Also Published As

Publication number Publication date
JP2525555Y2 (ja) 1997-02-12

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