JPH0477236U - - Google Patents
Info
- Publication number
- JPH0477236U JPH0477236U JP12051590U JP12051590U JPH0477236U JP H0477236 U JPH0477236 U JP H0477236U JP 12051590 U JP12051590 U JP 12051590U JP 12051590 U JP12051590 U JP 12051590U JP H0477236 U JPH0477236 U JP H0477236U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- mold cavity
- resin
- cavities
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12051590U JPH0477236U (fi) | 1990-11-16 | 1990-11-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12051590U JPH0477236U (fi) | 1990-11-16 | 1990-11-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0477236U true JPH0477236U (fi) | 1992-07-06 |
Family
ID=31868417
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12051590U Pending JPH0477236U (fi) | 1990-11-16 | 1990-11-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0477236U (fi) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004114696A (ja) * | 2003-11-28 | 2004-04-15 | Oki Electric Ind Co Ltd | モールドパッケージ及びその製造方法 |
-
1990
- 1990-11-16 JP JP12051590U patent/JPH0477236U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004114696A (ja) * | 2003-11-28 | 2004-04-15 | Oki Electric Ind Co Ltd | モールドパッケージ及びその製造方法 |