JPH0477230U - - Google Patents

Info

Publication number
JPH0477230U
JPH0477230U JP1990120552U JP12055290U JPH0477230U JP H0477230 U JPH0477230 U JP H0477230U JP 1990120552 U JP1990120552 U JP 1990120552U JP 12055290 U JP12055290 U JP 12055290U JP H0477230 U JPH0477230 U JP H0477230U
Authority
JP
Japan
Prior art keywords
protruding electrode
passivation film
opening
view
bump
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990120552U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990120552U priority Critical patent/JPH0477230U/ja
Publication of JPH0477230U publication Critical patent/JPH0477230U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/701—

Landscapes

  • Wire Bonding (AREA)
JP1990120552U 1990-11-16 1990-11-16 Pending JPH0477230U (cg-RX-API-DMAC10.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990120552U JPH0477230U (cg-RX-API-DMAC10.html) 1990-11-16 1990-11-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990120552U JPH0477230U (cg-RX-API-DMAC10.html) 1990-11-16 1990-11-16

Publications (1)

Publication Number Publication Date
JPH0477230U true JPH0477230U (cg-RX-API-DMAC10.html) 1992-07-06

Family

ID=31868453

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990120552U Pending JPH0477230U (cg-RX-API-DMAC10.html) 1990-11-16 1990-11-16

Country Status (1)

Country Link
JP (1) JPH0477230U (cg-RX-API-DMAC10.html)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011021317A1 (ja) * 2009-08-19 2011-02-24 パナソニック株式会社 半導体デバイス及びそれを用いた半導体装置
WO2011074158A1 (ja) * 2009-12-17 2011-06-23 パナソニック株式会社 半導体チップ及び該半導体チップを備えた半導体装置
JP2013045843A (ja) * 2011-08-23 2013-03-04 Kyocera Corp 電極構造、半導体素子、半導体装置、サーマルヘッドおよびサーマルプリンタ

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011021317A1 (ja) * 2009-08-19 2011-02-24 パナソニック株式会社 半導体デバイス及びそれを用いた半導体装置
WO2011074158A1 (ja) * 2009-12-17 2011-06-23 パナソニック株式会社 半導体チップ及び該半導体チップを備えた半導体装置
JP2013045843A (ja) * 2011-08-23 2013-03-04 Kyocera Corp 電極構造、半導体素子、半導体装置、サーマルヘッドおよびサーマルプリンタ

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