JPH0476089U - - Google Patents
Info
- Publication number
- JPH0476089U JPH0476089U JP11932890U JP11932890U JPH0476089U JP H0476089 U JPH0476089 U JP H0476089U JP 11932890 U JP11932890 U JP 11932890U JP 11932890 U JP11932890 U JP 11932890U JP H0476089 U JPH0476089 U JP H0476089U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- board
- circuit board
- support
- locking
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 210000000078 claw Anatomy 0.000 claims description 3
- 239000002184 metal Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11932890U JPH075660Y2 (ja) | 1990-11-16 | 1990-11-16 | プリント基板支持装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11932890U JPH075660Y2 (ja) | 1990-11-16 | 1990-11-16 | プリント基板支持装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0476089U true JPH0476089U (no) | 1992-07-02 |
JPH075660Y2 JPH075660Y2 (ja) | 1995-02-08 |
Family
ID=31867294
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11932890U Expired - Lifetime JPH075660Y2 (ja) | 1990-11-16 | 1990-11-16 | プリント基板支持装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH075660Y2 (no) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014053449A (ja) * | 2012-09-07 | 2014-03-20 | Mitsubishi Electric Corp | 半導体装置、半導体装置の製造方法 |
-
1990
- 1990-11-16 JP JP11932890U patent/JPH075660Y2/ja not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014053449A (ja) * | 2012-09-07 | 2014-03-20 | Mitsubishi Electric Corp | 半導体装置、半導体装置の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JPH075660Y2 (ja) | 1995-02-08 |