JPH0476076U - - Google Patents
Info
- Publication number
- JPH0476076U JPH0476076U JP11954790U JP11954790U JPH0476076U JP H0476076 U JPH0476076 U JP H0476076U JP 11954790 U JP11954790 U JP 11954790U JP 11954790 U JP11954790 U JP 11954790U JP H0476076 U JPH0476076 U JP H0476076U
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- printed wiring
- board
- flexible printed
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 2
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11954790U JPH0476076U (de) | 1990-11-14 | 1990-11-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11954790U JPH0476076U (de) | 1990-11-14 | 1990-11-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0476076U true JPH0476076U (de) | 1992-07-02 |
Family
ID=31867497
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11954790U Pending JPH0476076U (de) | 1990-11-14 | 1990-11-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0476076U (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007006149A (ja) * | 2005-06-23 | 2007-01-11 | Hosiden Corp | 電子部品 |
-
1990
- 1990-11-14 JP JP11954790U patent/JPH0476076U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007006149A (ja) * | 2005-06-23 | 2007-01-11 | Hosiden Corp | 電子部品 |