JPH0476053U - - Google Patents
Info
- Publication number
- JPH0476053U JPH0476053U JP12058090U JP12058090U JPH0476053U JP H0476053 U JPH0476053 U JP H0476053U JP 12058090 U JP12058090 U JP 12058090U JP 12058090 U JP12058090 U JP 12058090U JP H0476053 U JPH0476053 U JP H0476053U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- external electrode
- electrode lead
- lead wires
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図はこの考案の一実施例であるＤＩＰタイ
プ半導体装置の側面図、第２図はこの考案の他の
実施例であるＳＩＰタイプ半導体装置の側面図、
第３図は第２図の半導体装置をソケツトに挿入す
る状態を示す斜視図、第４図は従来のＤＩＰタイ
プ半導体装置の側面図、第５図は従来のＳＩＰタ
イプ半導体装置の側面図、第６図は第５図の半導
体装置をソケツトに挿入する状態を示す斜視図で
ある。
図において、１はモールドパツケージ、７は外
部電極リード線を示す。なお、図中、同一符号は
同一、または相当部分を示す。
FIG. 1 is a side view of a DIP type semiconductor device which is an embodiment of this invention, and FIG. 2 is a side view of a SIP type semiconductor device which is another embodiment of this invention.
3 is a perspective view showing the semiconductor device of FIG. 2 inserted into a socket, FIG. 4 is a side view of a conventional DIP type semiconductor device, FIG. 5 is a side view of a conventional SIP type semiconductor device, and FIG. FIG. 6 is a perspective view showing a state in which the semiconductor device of FIG. 5 is inserted into a socket. In the figure, 1 indicates a mold package, and 7 indicates an external electrode lead wire. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
において、上記外部電極リード線の先端を一方向
に順次段差を持たせて構成させたことを特徴とす
る半導体装置。 1. A semiconductor device comprising a plurality of external electrode lead wires, characterized in that the tips of the external electrode lead wires are sequentially stepped in one direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12058090U JPH0476053U (en) | 1990-11-15 | 1990-11-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12058090U JPH0476053U (en) | 1990-11-15 | 1990-11-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0476053U true JPH0476053U (en) | 1992-07-02 |
Family
ID=31868479
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12058090U Pending JPH0476053U (en) | 1990-11-15 | 1990-11-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0476053U (en) |
-
1990
- 1990-11-15 JP JP12058090U patent/JPH0476053U/ja active Pending