JPH0476051U - - Google Patents
Info
- Publication number
- JPH0476051U JPH0476051U JP11944890U JP11944890U JPH0476051U JP H0476051 U JPH0476051 U JP H0476051U JP 11944890 U JP11944890 U JP 11944890U JP 11944890 U JP11944890 U JP 11944890U JP H0476051 U JPH0476051 U JP H0476051U
- Authority
- JP
- Japan
- Prior art keywords
- solder plating
- leads
- cathode
- solder
- plating liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims description 11
- 238000007747 plating Methods 0.000 claims description 10
- 239000007788 liquid Substances 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 2
- 238000001914 filtration Methods 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 239000002659 electrodeposit Substances 0.000 claims 1
- 230000003134 recirculating effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990119448U JPH087642Y2 (ja) | 1990-11-16 | 1990-11-16 | リードの半田メッキ装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990119448U JPH087642Y2 (ja) | 1990-11-16 | 1990-11-16 | リードの半田メッキ装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0476051U true JPH0476051U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1992-07-02 |
| JPH087642Y2 JPH087642Y2 (ja) | 1996-03-04 |
Family
ID=31867405
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990119448U Expired - Fee Related JPH087642Y2 (ja) | 1990-11-16 | 1990-11-16 | リードの半田メッキ装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH087642Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS572899A (en) * | 1980-05-07 | 1982-01-08 | Perkin Elmer Corp | Method and device for electroplating electroconductive substrate |
| JPS6067689A (ja) * | 1983-09-22 | 1985-04-18 | Nec Corp | めつき方法及びめつき装置 |
| JPS6092497A (ja) * | 1983-10-27 | 1985-05-24 | Nec Corp | メツキ装置 |
| JPS61253399A (ja) * | 1985-05-07 | 1986-11-11 | Sumitomo Metal Ind Ltd | メツキ液浄化装置 |
| JPS6240391A (ja) * | 1985-08-13 | 1987-02-21 | Matsushita Electric Ind Co Ltd | 情報記録体の電鋳装置 |
| JPS62210688A (ja) * | 1986-03-11 | 1987-09-16 | 日本碍子株式会社 | セラミツクパツケ−ジの部分めつき方法及びその装置 |
| JPS63243297A (ja) * | 1987-03-31 | 1988-10-11 | Mitsubishi Metal Corp | 伝熱管の製造方法 |
| JPH02111898A (ja) * | 1988-10-20 | 1990-04-24 | Mitsubishi Electric Corp | 半導体素子の製造装置 |
-
1990
- 1990-11-16 JP JP1990119448U patent/JPH087642Y2/ja not_active Expired - Fee Related
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS572899A (en) * | 1980-05-07 | 1982-01-08 | Perkin Elmer Corp | Method and device for electroplating electroconductive substrate |
| JPS6067689A (ja) * | 1983-09-22 | 1985-04-18 | Nec Corp | めつき方法及びめつき装置 |
| JPS6092497A (ja) * | 1983-10-27 | 1985-05-24 | Nec Corp | メツキ装置 |
| JPS61253399A (ja) * | 1985-05-07 | 1986-11-11 | Sumitomo Metal Ind Ltd | メツキ液浄化装置 |
| JPS6240391A (ja) * | 1985-08-13 | 1987-02-21 | Matsushita Electric Ind Co Ltd | 情報記録体の電鋳装置 |
| JPS62210688A (ja) * | 1986-03-11 | 1987-09-16 | 日本碍子株式会社 | セラミツクパツケ−ジの部分めつき方法及びその装置 |
| JPS63243297A (ja) * | 1987-03-31 | 1988-10-11 | Mitsubishi Metal Corp | 伝熱管の製造方法 |
| JPH02111898A (ja) * | 1988-10-20 | 1990-04-24 | Mitsubishi Electric Corp | 半導体素子の製造装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH087642Y2 (ja) | 1996-03-04 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |