JPH0476049U - - Google Patents
Info
- Publication number
- JPH0476049U JPH0476049U JP11911890U JP11911890U JPH0476049U JP H0476049 U JPH0476049 U JP H0476049U JP 11911890 U JP11911890 U JP 11911890U JP 11911890 U JP11911890 U JP 11911890U JP H0476049 U JPH0476049 U JP H0476049U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- heat radiator
- angle
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000001154 acute effect Effects 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11911890U JPH0476049U (en18) | 1990-11-14 | 1990-11-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11911890U JPH0476049U (en18) | 1990-11-14 | 1990-11-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0476049U true JPH0476049U (en18) | 1992-07-02 |
Family
ID=31867098
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11911890U Pending JPH0476049U (en18) | 1990-11-14 | 1990-11-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0476049U (en18) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013069756A (ja) * | 2011-09-21 | 2013-04-18 | Toshiba Mitsubishi-Electric Industrial System Corp | 半導体素子の冷却装置 |
-
1990
- 1990-11-14 JP JP11911890U patent/JPH0476049U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013069756A (ja) * | 2011-09-21 | 2013-04-18 | Toshiba Mitsubishi-Electric Industrial System Corp | 半導体素子の冷却装置 |