JPH0475347A - Hetrojunction bipolar transistor - Google Patents

Hetrojunction bipolar transistor

Info

Publication number
JPH0475347A
JPH0475347A JP19013590A JP19013590A JPH0475347A JP H0475347 A JPH0475347 A JP H0475347A JP 19013590 A JP19013590 A JP 19013590A JP 19013590 A JP19013590 A JP 19013590A JP H0475347 A JPH0475347 A JP H0475347A
Authority
JP
Japan
Prior art keywords
layer
collector
hbt
base
bipolar transistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19013590A
Other languages
Japanese (ja)
Inventor
Norio Okubo
典雄 大久保
Toshio Kikuta
俊夫 菊田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP19013590A priority Critical patent/JPH0475347A/en
Publication of JPH0475347A publication Critical patent/JPH0475347A/en
Pending legal-status Critical Current

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  • Bipolar Transistors (AREA)

Abstract

PURPOSE:To make it possible to obtain HBT whose current gain is enhanced by installing an interposition layer comprising InGaAsP between a collector layer and a base layer. CONSTITUTION:A conduction band between a base layer 6 and a collector layer 4 can be smoothly connected by means of an extremely low level of spiking by interposing a graded layer 5 between the base layer 6 and the collect layer 4. In terms of HBT 1 having the graded layer 5 thus obtained, the current amplification factor is 490, which provides current gain two times and more times compared with 210 of the prior art HBT 2. HBT 1 rarely depends on the collector current voltage when it is turned on.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、化合物半導体を用いたヘテロ接合バイポーラ
トランジスタの改良に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to improvements in heterojunction bipolar transistors using compound semiconductors.

〔従来の技術〕[Conventional technology]

ヘテロ接合バイポーラトランジスタ(Hetero−j
unction Bipolar Transisto
rs、以下、HBTと略す)は、次世代電子デバイスと
してその高電流増幅率、高速性が期待され、現在、主に
GaAs/AlGaAs系で盛んに研究開発が行われて
いる。
Heterojunction bipolar transistor (Hetero-j
unction Bipolar Transistor
rs (hereinafter abbreviated as HBT) is expected to have a high current amplification factor and high speed as a next-generation electronic device, and is currently being actively researched and developed mainly in the GaAs/AlGaAs system.

最近では、InPに格子整合するInP系HBTの開発
も並行して進みつつある。InP系HBTは、そのベー
ス層にInGaAsを用いるため、バンドギャップでほ
ぼ決まるターンオフ電圧がシリコンバイポーラトランジ
スタとほとんど同じとなり既存回路との互換性が期待さ
れ、またGaAs系HBTより低消費電力型デバイスの
可能性を有している。さらに、本HBTはInP系発光
発光光デバイスとの集積化が可能になるというメリット
もある。
Recently, development of InP-based HBTs that are lattice-matched to InP is also progressing. Since InP-based HBTs use InGaAs for their base layer, the turn-off voltage determined by the bandgap is almost the same as that of silicon bipolar transistors, and is expected to be compatible with existing circuits. It has potential. Furthermore, this HBT has the advantage that it can be integrated with an InP-based light-emitting optical device.

InP系HBTとしては、エミッタ層とコレクタ層にn
−1nP+ベ一ス層にp−1nGaAsを用いたInP
系ダブルへテロ接合バイポーラトランジスタ(D−HB
T)がある。しかしながら、この素子では、ベース・コ
レクタ間に導入されたヘテロ接合により、第4図に示す
ように、エネルギイバンドの伝導バンドにスパイク状の
障壁が形成され、電流利得が稼げないという問題があっ
た。そこで、最近になり、ベース・コレクタ間にコレク
タ層よりも不純物濃度の高いInP層を挿入することに
より伝導バンド障壁を下げ、大きな電流利得を得ている
(IEEE Electron Device Let
t、、  Vol、9.  No、5p、253.19
88参照)。
As an InP-based HBT, n is used in the emitter layer and collector layer.
-1nP + InP using p-1nGaAs as base layer
double heterojunction bipolar transistor (D-HB
There is a T). However, this device had the problem that the heterojunction introduced between the base and collector formed a spike-like barrier in the conduction band of the energy band, making it impossible to obtain current gain, as shown in Figure 4. . Therefore, recently, an InP layer with a higher impurity concentration than the collector layer is inserted between the base and collector to lower the conduction band barrier and obtain a large current gain (IEEE Electron Device Let
t,, Vol, 9. No, 5p, 253.19
88).

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

しかしながら、上述のように、ベース・コレクタ間にコ
レクタ層よりも不純物濃度の高いInP層を挿入しても
、スパイク状の伝導バンド障壁が依然として残るという
問題があった。
However, as described above, even if an InP layer having a higher impurity concentration than the collector layer is inserted between the base and the collector, there is a problem that a spike-like conduction band barrier still remains.

〔課題を解決するための手段と作用〕[Means and actions to solve the problem]

本発明は上記問題点を解決したヘテロ接合バイポーラト
ランジスタを提供するもので、InPよりなるコレクタ
層、InGaAsよりなるベース層およびInPよりな
るエミッタ層が順次積層されたヘテロ接合バイポーラト
ランジスタにおいて、コレクタ層とベース層の間にIn
GaAsPからなる介在層が設けられていることを特徴
とするものである。
The present invention provides a heterojunction bipolar transistor that solves the above problems, and includes a collector layer made of InP, a base layer made of InGaAs, and an emitter layer made of InP. In between the base layers
It is characterized in that an intervening layer made of GaAsP is provided.

本発明は、上述のように、コレクタ層とベース層の間に
InGaAsPからなる介在層を設けると、InGaA
sのベース層とInPのコレクタ層との間のへテロバン
ドギャップが小さくなり、従ワて、スパイク状の障壁も
小さくなるという考えに基づいている。特に、この介在
層をInGaAsPのバンドギャップ波長を徐々に変え
たグレーデツド層にすると、ヘテロバンドギャップが滑
らかにつながり、スパイク状の障壁が極めて小さくなる
。この介在層の厚さはInGaAsPの電子の拡散長よ
りも薄くする必要がある。
As described above, the present invention provides an intervening layer made of InGaAsP between the collector layer and the base layer.
This is based on the idea that the hetero bandgap between the InP base layer and the InP collector layer becomes smaller, and the spike-like barrier also becomes smaller. In particular, if this intervening layer is a graded layer of InGaAsP whose bandgap wavelength is gradually changed, the heterobandgap will be smoothly connected, and the spike-like barrier will be extremely small. The thickness of this intervening layer needs to be thinner than the electron diffusion length of InGaAsP.

〔実施例〕〔Example〕

以下、実施例に基づいて本発明の詳細な説明する。 Hereinafter, the present invention will be described in detail based on Examples.

第1表は本実施例のへテロ接合バイポーラトランジスタ
の構成材質を示している。
Table 1 shows the constituent materials of the heterojunction bipolar transistor of this example.

即ち、第1図に示すように、TnP基板1上にInP(
λ、 =0.92u)バッファ層2、n−1nGaAs
 (λ。
That is, as shown in FIG. 1, InP (
λ, =0.92u) Buffer layer 2, n-1nGaAs
(λ.

=1.67xm)サブコレクタ層3、n−1nPコレク
タ層4、基板側からそれぞれギャップ波長(λ、)が1
.00m、1.20x、1.30JllIであるn−1
nGaAsPのグレーデツド層5、p−1nGaAs 
(λ、−1.677II+)のベース層6、n4nPの
エミッタ層7、n−InGaAs (λ。
= 1.67xm) The sub-collector layer 3, n-1nP collector layer 4, each has a gap wavelength (λ,) of 1 from the substrate side.
.. 00m, 1.20x, 1.30JllI n-1
Graded layer 5 of nGaAsP, p-1 nGaAs
(λ, -1.677II+) base layer 6, n4nP emitter layer 7, n-InGaAs (λ.

=1.67xm)のキャップ層8を順次積層したもので
ある。9はコレクタ電極、10はベース電極、11エミ
ッタ電極、12は絶縁膜である。上記構造の実施例にお
いて、ベース層6とコレクタ層4の間にグレーデツド層
5を介在させることにより、第2図ニ示スように、ベー
ス層6とコレクタ層4の間の伝導バンドは極めて小さな
スパイクで比較的滑らかに結ばれている。このようにし
て得られたグレーデツド層5の有るHBT (HBTI
)とグレーデツド層5の無い従来例のHBT (HBT
2)のトランジスタ特性を第3図(a)、(b)に示す
0本実施例のHBTIでは電流増幅率が490となり、
HBT2の210に対して2倍以上の電流利得が得られ
た。さらに、HBTlにおいては、オン状態となってか
らは電流のコレクタ電圧依存性も非常に少なかった。
= 1.67xm) are sequentially laminated. 9 is a collector electrode, 10 is a base electrode, 11 is an emitter electrode, and 12 is an insulating film. In the embodiment of the above structure, by interposing the graded layer 5 between the base layer 6 and the collector layer 4, the conduction band between the base layer 6 and the collector layer 4 is extremely small, as shown in FIG. It is tied relatively smoothly with spikes. HBT (HBTI) with graded layer 5 obtained in this way
) and conventional HBT without graded layer 5 (HBT
The transistor characteristics of 2) are shown in FIGS. 3(a) and 3(b). In the HBTI of this embodiment, the current amplification factor is 490,
A current gain more than twice that of 210 of HBT2 was obtained. Furthermore, in the HBT1, the dependence of the current on the collector voltage was also very small after the HBT1 was turned on.

なお、上記実施例において、pとnを逆にしてもよいこ
とは言うまでもない。
It goes without saying that in the above embodiment, p and n may be reversed.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明によれば、コレクタ層とベー
ス層の間にInGaAsPからなる介在層が設けられて
いるため、電流利得が向上したHBTが得られるという
優れた効果がある。
As explained above, according to the present invention, since the intervening layer made of InGaAsP is provided between the collector layer and the base layer, there is an excellent effect that an HBT with improved current gain can be obtained.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明にがかるヘテロ接合バイポーラトランジ
スタの一実施例の断面説明図、第2図は同実施例のベー
ス・コレクタ間の伝導バンドの説明図、第3図(a)は
同実施例のトランジスタ特性図、第3図(b)は従来例
のトランジスタ特性図、第4図は従来のへテロ接合バイ
ポーラトランジスタのベース・コレクタ間の伝導バンド
の説明図である。 1・・・基板、  2・・・パフフッ層、3・・・サブ
コレクタ層、  4・・・コレクタ層、  5・・・グ
レーデツド層、  6・・・ベース層、  7・・・エ
ミッタ層、  8°゛°キャップ層、  9・・・コレ
クタ電極、 10・・・ベース電極、 11・・・エミ
ッタ電極、 12・・・絶縁膜。
FIG. 1 is an explanatory cross-sectional view of an embodiment of a heterojunction bipolar transistor according to the present invention, FIG. 2 is an explanatory diagram of the conduction band between the base and collector of the same embodiment, and FIG. 3(a) is an explanatory diagram of the same embodiment. FIG. 3(b) is a transistor characteristic diagram of a conventional example, and FIG. 4 is an explanatory diagram of a conduction band between the base and collector of a conventional heterojunction bipolar transistor. DESCRIPTION OF SYMBOLS 1... Substrate, 2... Puff layer, 3... Sub-collector layer, 4... Collector layer, 5... Graded layer, 6... Base layer, 7... Emitter layer, 8 °゛°Cap layer, 9...Collector electrode, 10...Base electrode, 11...Emitter electrode, 12...Insulating film.

Claims (1)

【特許請求の範囲】[Claims]  InPよりなるコレクタ層、InGaAsよりなるベ
ース層およびInPよりなるエミッタ層が順次積層され
たヘテロ接合バイポーラトランジスタにおいて、コレク
タ層とベース層の間にInGaAsPからなる介在層が
設けられていることを特徴とするヘテロ接合バイポーラ
トランジスタ。
A heterojunction bipolar transistor in which a collector layer made of InP, a base layer made of InGaAs, and an emitter layer made of InP are sequentially laminated, characterized in that an intervening layer made of InGaAsP is provided between the collector layer and the base layer. Heterojunction bipolar transistor.
JP19013590A 1990-07-18 1990-07-18 Hetrojunction bipolar transistor Pending JPH0475347A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19013590A JPH0475347A (en) 1990-07-18 1990-07-18 Hetrojunction bipolar transistor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19013590A JPH0475347A (en) 1990-07-18 1990-07-18 Hetrojunction bipolar transistor

Publications (1)

Publication Number Publication Date
JPH0475347A true JPH0475347A (en) 1992-03-10

Family

ID=16252980

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19013590A Pending JPH0475347A (en) 1990-07-18 1990-07-18 Hetrojunction bipolar transistor

Country Status (1)

Country Link
JP (1) JPH0475347A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6707074B2 (en) 2000-07-04 2004-03-16 Matsushita Electric Industrial Co., Ltd. Semiconductor light-emitting device and apparatus for driving the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6707074B2 (en) 2000-07-04 2004-03-16 Matsushita Electric Industrial Co., Ltd. Semiconductor light-emitting device and apparatus for driving the same

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