JPH0474429U - - Google Patents

Info

Publication number
JPH0474429U
JPH0474429U JP1990116819U JP11681990U JPH0474429U JP H0474429 U JPH0474429 U JP H0474429U JP 1990116819 U JP1990116819 U JP 1990116819U JP 11681990 U JP11681990 U JP 11681990U JP H0474429 U JPH0474429 U JP H0474429U
Authority
JP
Japan
Prior art keywords
wire
block
cylindrical hole
tension mechanism
tension
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990116819U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990116819U priority Critical patent/JPH0474429U/ja
Publication of JPH0474429U publication Critical patent/JPH0474429U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/0711Apparatus therefor
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/0711Apparatus therefor
    • H10W72/07141Means for applying energy, e.g. ovens or lasers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/0711Apparatus therefor
    • H10W72/07168Means for storing or moving the material for the connector
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/075Connecting or disconnecting of bond wires
    • H10W72/07502Connecting or disconnecting of bond wires using an auxiliary member

Landscapes

  • Wire Bonding (AREA)
JP1990116819U 1990-11-07 1990-11-07 Pending JPH0474429U (enFirst)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990116819U JPH0474429U (enFirst) 1990-11-07 1990-11-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990116819U JPH0474429U (enFirst) 1990-11-07 1990-11-07

Publications (1)

Publication Number Publication Date
JPH0474429U true JPH0474429U (enFirst) 1992-06-30

Family

ID=31864659

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990116819U Pending JPH0474429U (enFirst) 1990-11-07 1990-11-07

Country Status (1)

Country Link
JP (1) JPH0474429U (enFirst)

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