JPH0474427U - - Google Patents

Info

Publication number
JPH0474427U
JPH0474427U JP11791390U JP11791390U JPH0474427U JP H0474427 U JPH0474427 U JP H0474427U JP 11791390 U JP11791390 U JP 11791390U JP 11791390 U JP11791390 U JP 11791390U JP H0474427 U JPH0474427 U JP H0474427U
Authority
JP
Japan
Prior art keywords
electronic component
plane
rectangular parallelepiped
terminal electrodes
opposing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11791390U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11791390U priority Critical patent/JPH0474427U/ja
Publication of JPH0474427U publication Critical patent/JPH0474427U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)
JP11791390U 1990-11-07 1990-11-07 Pending JPH0474427U (US20020051482A1-20020502-M00012.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11791390U JPH0474427U (US20020051482A1-20020502-M00012.png) 1990-11-07 1990-11-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11791390U JPH0474427U (US20020051482A1-20020502-M00012.png) 1990-11-07 1990-11-07

Publications (1)

Publication Number Publication Date
JPH0474427U true JPH0474427U (US20020051482A1-20020502-M00012.png) 1992-06-30

Family

ID=31865809

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11791390U Pending JPH0474427U (US20020051482A1-20020502-M00012.png) 1990-11-07 1990-11-07

Country Status (1)

Country Link
JP (1) JPH0474427U (US20020051482A1-20020502-M00012.png)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998025298A1 (fr) * 1996-12-04 1998-06-11 Seiko Epson Corporation Dispositif a semiconducteur, procede de fabrication dudit dispositif, plaquette de circuit et materiel electronique
JP2005217445A (ja) * 1996-12-04 2005-08-11 Seiko Epson Corp 半導体装置の製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998025298A1 (fr) * 1996-12-04 1998-06-11 Seiko Epson Corporation Dispositif a semiconducteur, procede de fabrication dudit dispositif, plaquette de circuit et materiel electronique
US6608389B1 (en) 1996-12-04 2003-08-19 Seiko Epson Corporation Semiconductor device with stress relieving layer comprising circuit board and electronic instrument
JP2005217445A (ja) * 1996-12-04 2005-08-11 Seiko Epson Corp 半導体装置の製造方法
JP4513973B2 (ja) * 1996-12-04 2010-07-28 セイコーエプソン株式会社 半導体装置の製造方法
US8384213B2 (en) 1996-12-04 2013-02-26 Seiko Epson Corporation Semiconductor device, circuit board, and electronic instrument

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