JPH0474419U - - Google Patents
Info
- Publication number
- JPH0474419U JPH0474419U JP11863590U JP11863590U JPH0474419U JP H0474419 U JPH0474419 U JP H0474419U JP 11863590 U JP11863590 U JP 11863590U JP 11863590 U JP11863590 U JP 11863590U JP H0474419 U JPH0474419 U JP H0474419U
- Authority
- JP
- Japan
- Prior art keywords
- photoresist
- photoresist liquid
- viscosity
- wafer
- resist coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920002120 photoresistant polymer Polymers 0.000 claims description 12
- 239000007788 liquid Substances 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims 3
- 238000000576 coating method Methods 0.000 claims 3
- 238000005259 measurement Methods 0.000 description 1
Landscapes
- Coating Apparatus (AREA)
Description
第1図は、本考案の一実施例を示すレジスト装
置の断面図、第2図は従来のレジスト装置の一例
を示す断面図、第3図はウエーハ回転数とフオト
レジスト粘度によるフオトレジスト膜厚の関係を
示す図である。
1……回転制御装置、2……粘度測定装置、2
a……細管、3……フオトレジスト容器、4……
フオトレジスト液、5……N2ガス用配管、6…
…フオトレジスト用配管、7……定量ポンプ、8
……ノズル、9……ウエーハ、10……ウエーハ
チヤツク、11……モータ、12……ドレイン、
13……カツプ。
FIG. 1 is a sectional view of a resist device showing an embodiment of the present invention, FIG. 2 is a sectional view of an example of a conventional resist device, and FIG. 3 is a photoresist film thickness depending on wafer rotation speed and photoresist viscosity. FIG. 1... Rotation control device, 2... Viscosity measurement device, 2
a... Thin tube, 3... Photoresist container, 4...
Photoresist liquid, 5... Piping for N2 gas, 6...
...Piping for photoresist, 7...metering pump, 8
... Nozzle, 9 ... Wafer, 10 ... Wafer chuck, 11 ... Motor, 12 ... Drain,
13...Katsupu.
Claims (1)
ウエーハチヤツクを回転するモータと、前記ウエ
ーハ上にフオトレジスト液を滴下するノズルと、
このノズルに前記フオトレジスト液を供給する定
量ポンプと、この定量ポンプに接続されるととも
に前記フオトレジスト液を溜めるフオトレジスト
容器内に挿入されるフオトレジスト用配管とを有
するレジスト塗布装置において、前記フオトレジ
スト用配管と並列に接続される細管と、この細管
におけるフオトレジスト液の入口と出口との圧力
差を測定することにより前記フオトレジスト液の
粘度を測定する粘度測定器と、この粘度測定器の
粘度値により前記モータの回転数を補正する回転
制御装置とを備えることを特徴とするレジスト塗
布装置。 A wafer chuck that holds the wafer by suction;
a motor that rotates a wafer chuck; a nozzle that drips photoresist liquid onto the wafer;
In the resist coating apparatus, the resist coating apparatus includes a metering pump that supplies the photoresist liquid to the nozzle, and a photoresist piping connected to the metering pump and inserted into a photoresist container that stores the photoresist liquid. A thin tube connected in parallel with resist piping, and a viscosity measuring device that measures the viscosity of the photoresist liquid by measuring the pressure difference between the inlet and outlet of the photoresist liquid in this thin tube, and the viscosity measuring device A resist coating device comprising: a rotation control device that corrects the rotation speed of the motor based on a viscosity value.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11863590U JPH0474419U (en) | 1990-11-13 | 1990-11-13 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11863590U JPH0474419U (en) | 1990-11-13 | 1990-11-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0474419U true JPH0474419U (en) | 1992-06-30 |
Family
ID=31866582
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11863590U Pending JPH0474419U (en) | 1990-11-13 | 1990-11-13 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0474419U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020126886A (en) * | 2019-02-01 | 2020-08-20 | 東京エレクトロン株式会社 | Substrate processing apparatus, substrate processing method and storage medium |
-
1990
- 1990-11-13 JP JP11863590U patent/JPH0474419U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020126886A (en) * | 2019-02-01 | 2020-08-20 | 東京エレクトロン株式会社 | Substrate processing apparatus, substrate processing method and storage medium |
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