JPH0474419U - - Google Patents

Info

Publication number
JPH0474419U
JPH0474419U JP11863590U JP11863590U JPH0474419U JP H0474419 U JPH0474419 U JP H0474419U JP 11863590 U JP11863590 U JP 11863590U JP 11863590 U JP11863590 U JP 11863590U JP H0474419 U JPH0474419 U JP H0474419U
Authority
JP
Japan
Prior art keywords
photoresist
photoresist liquid
viscosity
wafer
resist coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11863590U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11863590U priority Critical patent/JPH0474419U/ja
Publication of JPH0474419U publication Critical patent/JPH0474419U/ja
Pending legal-status Critical Current

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  • Coating Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、本考案の一実施例を示すレジスト装
置の断面図、第2図は従来のレジスト装置の一例
を示す断面図、第3図はウエーハ回転数とフオト
レジスト粘度によるフオトレジスト膜厚の関係を
示す図である。 1……回転制御装置、2……粘度測定装置、2
a……細管、3……フオトレジスト容器、4……
フオトレジスト液、5……Nガス用配管、6…
…フオトレジスト用配管、7……定量ポンプ、8
……ノズル、9……ウエーハ、10……ウエーハ
チヤツク、11……モータ、12……ドレイン、
13……カツプ。
FIG. 1 is a sectional view of a resist device showing an embodiment of the present invention, FIG. 2 is a sectional view of an example of a conventional resist device, and FIG. 3 is a photoresist film thickness depending on wafer rotation speed and photoresist viscosity. FIG. 1... Rotation control device, 2... Viscosity measurement device, 2
a... Thin tube, 3... Photoresist container, 4...
Photoresist liquid, 5... Piping for N2 gas, 6...
...Piping for photoresist, 7...metering pump, 8
... Nozzle, 9 ... Wafer, 10 ... Wafer chuck, 11 ... Motor, 12 ... Drain,
13...Katsupu.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ウエーハを吸着保持するウエーハチヤツクと、
ウエーハチヤツクを回転するモータと、前記ウエ
ーハ上にフオトレジスト液を滴下するノズルと、
このノズルに前記フオトレジスト液を供給する定
量ポンプと、この定量ポンプに接続されるととも
に前記フオトレジスト液を溜めるフオトレジスト
容器内に挿入されるフオトレジスト用配管とを有
するレジスト塗布装置において、前記フオトレジ
スト用配管と並列に接続される細管と、この細管
におけるフオトレジスト液の入口と出口との圧力
差を測定することにより前記フオトレジスト液の
粘度を測定する粘度測定器と、この粘度測定器の
粘度値により前記モータの回転数を補正する回転
制御装置とを備えることを特徴とするレジスト塗
布装置。
A wafer chuck that holds the wafer by suction;
a motor that rotates a wafer chuck; a nozzle that drips photoresist liquid onto the wafer;
In the resist coating apparatus, the resist coating apparatus includes a metering pump that supplies the photoresist liquid to the nozzle, and a photoresist piping connected to the metering pump and inserted into a photoresist container that stores the photoresist liquid. A thin tube connected in parallel with resist piping, and a viscosity measuring device that measures the viscosity of the photoresist liquid by measuring the pressure difference between the inlet and outlet of the photoresist liquid in this thin tube, and the viscosity measuring device A resist coating device comprising: a rotation control device that corrects the rotation speed of the motor based on a viscosity value.
JP11863590U 1990-11-13 1990-11-13 Pending JPH0474419U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11863590U JPH0474419U (en) 1990-11-13 1990-11-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11863590U JPH0474419U (en) 1990-11-13 1990-11-13

Publications (1)

Publication Number Publication Date
JPH0474419U true JPH0474419U (en) 1992-06-30

Family

ID=31866582

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11863590U Pending JPH0474419U (en) 1990-11-13 1990-11-13

Country Status (1)

Country Link
JP (1) JPH0474419U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020126886A (en) * 2019-02-01 2020-08-20 東京エレクトロン株式会社 Substrate processing apparatus, substrate processing method and storage medium

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020126886A (en) * 2019-02-01 2020-08-20 東京エレクトロン株式会社 Substrate processing apparatus, substrate processing method and storage medium

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