JPH04742U - - Google Patents
Info
- Publication number
- JPH04742U JPH04742U JP4093290U JP4093290U JPH04742U JP H04742 U JPH04742 U JP H04742U JP 4093290 U JP4093290 U JP 4093290U JP 4093290 U JP4093290 U JP 4093290U JP H04742 U JPH04742 U JP H04742U
- Authority
- JP
- Japan
- Prior art keywords
- tab
- wiring board
- bonding
- flexible wiring
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000465 moulding Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4093290U JPH04742U (fr) | 1990-04-17 | 1990-04-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4093290U JPH04742U (fr) | 1990-04-17 | 1990-04-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04742U true JPH04742U (fr) | 1992-01-07 |
Family
ID=31551159
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4093290U Pending JPH04742U (fr) | 1990-04-17 | 1990-04-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04742U (fr) |
-
1990
- 1990-04-17 JP JP4093290U patent/JPH04742U/ja active Pending