JPH0472650U - - Google Patents
Info
- Publication number
- JPH0472650U JPH0472650U JP11655190U JP11655190U JPH0472650U JP H0472650 U JPH0472650 U JP H0472650U JP 11655190 U JP11655190 U JP 11655190U JP 11655190 U JP11655190 U JP 11655190U JP H0472650 U JPH0472650 U JP H0472650U
- Authority
- JP
- Japan
- Prior art keywords
- component
- circuit board
- integrated circuit
- resistor
- hybrid integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009966 trimming Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11655190U JPH0472650U (is) | 1990-11-06 | 1990-11-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11655190U JPH0472650U (is) | 1990-11-06 | 1990-11-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0472650U true JPH0472650U (is) | 1992-06-26 |
Family
ID=31864385
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11655190U Pending JPH0472650U (is) | 1990-11-06 | 1990-11-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0472650U (is) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018043076A1 (ja) * | 2016-09-01 | 2018-03-08 | 日立金属株式会社 | 絶縁基板およびこれを用いた半導体装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS601847A (ja) * | 1983-06-20 | 1985-01-08 | Toshiba Corp | 混成集積回路 |
| JPH01179352A (ja) * | 1987-12-30 | 1989-07-17 | Nec Corp | 半導体集積回路装置 |
-
1990
- 1990-11-06 JP JP11655190U patent/JPH0472650U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS601847A (ja) * | 1983-06-20 | 1985-01-08 | Toshiba Corp | 混成集積回路 |
| JPH01179352A (ja) * | 1987-12-30 | 1989-07-17 | Nec Corp | 半導体集積回路装置 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018043076A1 (ja) * | 2016-09-01 | 2018-03-08 | 日立金属株式会社 | 絶縁基板およびこれを用いた半導体装置 |
| US10559509B2 (en) | 2016-09-01 | 2020-02-11 | Hitachi Metals, Ltd. | Insulating substrate and semiconductor device using same |