JPH0472646U - - Google Patents
Info
- Publication number
- JPH0472646U JPH0472646U JP1990114846U JP11484690U JPH0472646U JP H0472646 U JPH0472646 U JP H0472646U JP 1990114846 U JP1990114846 U JP 1990114846U JP 11484690 U JP11484690 U JP 11484690U JP H0472646 U JPH0472646 U JP H0472646U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- terminal
- connection conductor
- internal connection
- external lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990114846U JPH0472646U (cs) | 1990-11-01 | 1990-11-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990114846U JPH0472646U (cs) | 1990-11-01 | 1990-11-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0472646U true JPH0472646U (cs) | 1992-06-26 |
Family
ID=31862566
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990114846U Pending JPH0472646U (cs) | 1990-11-01 | 1990-11-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0472646U (cs) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007266608A (ja) * | 2006-03-29 | 2007-10-11 | Infineon Technologies Ag | 半導体モジュール |
-
1990
- 1990-11-01 JP JP1990114846U patent/JPH0472646U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007266608A (ja) * | 2006-03-29 | 2007-10-11 | Infineon Technologies Ag | 半導体モジュール |