JPH0472560U - - Google Patents
Info
- Publication number
- JPH0472560U JPH0472560U JP11474190U JP11474190U JPH0472560U JP H0472560 U JPH0472560 U JP H0472560U JP 11474190 U JP11474190 U JP 11474190U JP 11474190 U JP11474190 U JP 11474190U JP H0472560 U JPH0472560 U JP H0472560U
- Authority
- JP
- Japan
- Prior art keywords
- connecting portion
- reflow
- circuit board
- printed circuit
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 238000005476 soldering Methods 0.000 claims description 2
- 230000003014 reinforcing effect Effects 0.000 claims 2
- 230000002787 reinforcement Effects 0.000 description 2
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11474190U JPH0472560U (xx) | 1990-11-02 | 1990-11-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11474190U JPH0472560U (xx) | 1990-11-02 | 1990-11-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0472560U true JPH0472560U (xx) | 1992-06-25 |
Family
ID=31862453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11474190U Pending JPH0472560U (xx) | 1990-11-02 | 1990-11-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0472560U (xx) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011159446A (ja) * | 2010-01-29 | 2011-08-18 | Omron Corp | 実装部品、電子機器および実装方法 |
-
1990
- 1990-11-02 JP JP11474190U patent/JPH0472560U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011159446A (ja) * | 2010-01-29 | 2011-08-18 | Omron Corp | 実装部品、電子機器および実装方法 |
| US8641460B2 (en) | 2010-01-29 | 2014-02-04 | Omron Corporation | Mounting component, electronic device, and mounting method |