JPH0472560U - - Google Patents

Info

Publication number
JPH0472560U
JPH0472560U JP11474190U JP11474190U JPH0472560U JP H0472560 U JPH0472560 U JP H0472560U JP 11474190 U JP11474190 U JP 11474190U JP 11474190 U JP11474190 U JP 11474190U JP H0472560 U JPH0472560 U JP H0472560U
Authority
JP
Japan
Prior art keywords
connecting portion
reflow
circuit board
printed circuit
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11474190U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11474190U priority Critical patent/JPH0472560U/ja
Publication of JPH0472560U publication Critical patent/JPH0472560U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Multi-Conductor Connections (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP11474190U 1990-11-02 1990-11-02 Pending JPH0472560U (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11474190U JPH0472560U (ko) 1990-11-02 1990-11-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11474190U JPH0472560U (ko) 1990-11-02 1990-11-02

Publications (1)

Publication Number Publication Date
JPH0472560U true JPH0472560U (ko) 1992-06-25

Family

ID=31862453

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11474190U Pending JPH0472560U (ko) 1990-11-02 1990-11-02

Country Status (1)

Country Link
JP (1) JPH0472560U (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011159446A (ja) * 2010-01-29 2011-08-18 Omron Corp 実装部品、電子機器および実装方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011159446A (ja) * 2010-01-29 2011-08-18 Omron Corp 実装部品、電子機器および実装方法
US8641460B2 (en) 2010-01-29 2014-02-04 Omron Corporation Mounting component, electronic device, and mounting method

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