JPH0471188A - High frequency heating device - Google Patents

High frequency heating device

Info

Publication number
JPH0471188A
JPH0471188A JP18045790A JP18045790A JPH0471188A JP H0471188 A JPH0471188 A JP H0471188A JP 18045790 A JP18045790 A JP 18045790A JP 18045790 A JP18045790 A JP 18045790A JP H0471188 A JPH0471188 A JP H0471188A
Authority
JP
Japan
Prior art keywords
antenna
food
printed circuit
circuit board
heating device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18045790A
Other languages
Japanese (ja)
Inventor
Koji Yoshino
浩二 吉野
Masaaki Yamaguchi
公明 山口
Takashi Kashiwagi
隆 柏木
Masato Yota
正人 要田
Shinichi Sakai
伸一 酒井
Tomomi Moriyama
森山 智美
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP18045790A priority Critical patent/JPH0471188A/en
Publication of JPH0471188A publication Critical patent/JPH0471188A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To eliminate dispersion resulting from through hole, enhance the accuracy in matching, and have thawing stably at all times by forming an antenna detection circuit on the same plane of a printed circuit board. CONSTITUTION:An antenna 9 is formed on the oversurface of a printed circuit board 8 as extension of a wiring pattern 10c, and the reflex electric waves reflected by food 1 and having penetrated the exposed part 21a of the base board 8 are sensed. Because the exposed part 21a on the rear side of the base board 8 and the antenna 9 on its front side can be formed precisely both through etching process, the sensing accuracy is enhanced to a great extent to enable precision control.

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は、冷凍食品あるいは常温食品を温める高周波加
熱装置に関し、特に食品の有無や解凍状態等を自動的に
検知する高周波加熱装置に関する(従来の技術) 従来のこの種の高周波加熱装置の解凍検知方法について
説明する。
Detailed Description of the Invention (Field of Industrial Application) The present invention relates to a high-frequency heating device for heating frozen foods or room-temperature foods, and particularly relates to a high-frequency heating device that automatically detects the presence or absence of food and the thawing state (conventional). (Technology) A conventional thawing detection method for this type of high-frequency heating device will be explained.

手動による高周波加熱装置は、タイムオートと呼んで、
予め食品重量毎に加熱時間を設定しておき、キーを操作
して食品重量を入力しその重量に応じた時間加熱するも
のである。
The manual high-frequency heating device is called Time Auto.
A heating time is set in advance for each food weight, and the food is heated for a time corresponding to the weight by inputting the food weight by operating a key.

また、全自動高周波加熱装置は、重量センサを備え、食
品重量を自動的に検出し、重量に応じて予め設定された
時間加熱するものである。従って、タイムオートに比べ
て重量のキー人力操作が不要となる。
Further, the fully automatic high-frequency heating device is equipped with a weight sensor, automatically detects the weight of food, and heats the food for a preset time depending on the weight. Therefore, compared to time auto, manual operation of heavy keys is not required.

さらに、特開昭56−159087号公報に示されたよ
うに、加熱室からの反射電力量によって食品の状態変化
を検出し、自動的に最適加熱する高周波加熱装置がある
Furthermore, as disclosed in Japanese Patent Application Laid-Open No. 56-159087, there is a high-frequency heating device that detects a change in the state of food based on the amount of reflected power from a heating chamber and automatically heats the food optimally.

この種の従来の高周波加熱装置について、第3図ないし
第9図により説明する。
This type of conventional high frequency heating device will be explained with reference to FIGS. 3 to 9.

第3図は、従来の高周波加熱装置の構成を示す模型的断
面図で、高周波加熱装置は、加熱対象となる食品1を載
せる、電動機2で駆動されるターンテーブル3を設置し
た加熱室4と、加熱室4の側壁に配置した高周波放射装
置5と、上記の加熱室4の天井面に形成されたスリット
4aの上部に配置され、上下に分かれた金属製のシール
ド箱6および7の間に収納した、プリント基板8の下面
および上面に形成したアンテナ9およびその検波回路1
0からなる検波部と、上記の検波回路10とリード線I
】で接続され、その検出データによって、上記のターン
テーブル3の電動機2、高周波放射装置5および冷却用
ファン12を駆動する制御器13とから構成されている
。なお、上記のスリット4aは、下部シールド箱7に収
容されているアンテナ9を加熱室4内の食品かすや蒸気
等による汚れから防ぐため、樹脂製のスリットカバー1
4で蓋をしである。
FIG. 3 is a schematic cross-sectional view showing the configuration of a conventional high-frequency heating device. , between a high-frequency radiation device 5 placed on the side wall of the heating chamber 4 and metal shield boxes 6 and 7 placed above the slit 4a formed in the ceiling of the heating chamber 4 and divided into upper and lower parts. Antenna 9 and its detection circuit 1 formed on the lower and upper surfaces of the housed printed circuit board 8
0, the above-mentioned detection circuit 10, and lead wire I.
] and a controller 13 that drives the electric motor 2 of the turntable 3, the high-frequency radiator 5, and the cooling fan 12 according to the detected data. The above slit 4a is provided with a resin slit cover 1 in order to prevent the antenna 9 housed in the lower shield box 7 from being contaminated by food particles, steam, etc. in the heating chamber 4.
4. Close the lid.

第4図は、上述の検波部の分解斜視図、第5図はプリン
ト基板8の平面図、第6図はその回路図である。
FIG. 4 is an exploded perspective view of the above-mentioned wave detection section, FIG. 5 is a plan view of the printed circuit board 8, and FIG. 6 is a circuit diagram thereof.

第4図において、加熱室4の天井面は、これに形成され
たスリット4aの両側と両端のそれぞれの近傍に、位置
決め用丸孔4bと取付は用角孔4cがそれぞれ設けられ
ている。下部シールド箱7は、底面に上記のスリット4
aより幅、長さが共に大きい角孔7a、その両側に上記
の位置決め用丸孔4bに対応する位置決め用丸孔7b、
および上記の取付は用角孔4cの内側端と一致する切欠
き7Cが形成されており、また、底面四方の立上り壁7
dには、上記の切欠き7Cに連続する通風窓7eが設け
られ、その上端にそれぞれ外側に案内縁のある取付は用
棚部7fが形成され、さらにそのほぼ中央部にねじ孔7
gが設けられている。上部シールド箱6は、天井面およ
び側壁面にそれぞれ複数の通風窓6aを打抜き加工し、
その四辺の張出し部6bに、上記のねじ孔7gに対応す
るビス孔6Cが設けられている。プリント基板8につい
ては、詳しく後述するので、簡単に説明すると、下面に
アンテナ9、上面に検波回路10がそれぞれ形成されて
いる。基板数14け板15は、金属板を打抜き成形した
もので、中央に、上記のアンテナ9に沿った平行の2辺
を有する5角孔15a、その両側に2箇所ずつ設けたは
んだ付は用孔15bおよび上記のビス孔6cに対応する
4個のビス孔15cが設けられている。スリットカバー
14の上面には、上記の位置決め用丸孔4bおよび7b
に挿通する案内突起+4aと、取付は用角孔4Cに挿通
し、係合爪14bを下部シールド箱7の切欠き7Cに係
合させて固定する係合突起14cが形成されている。4
本のビス16は、上下部シールド箱6および7の中にプ
リント基板8をはんだ付けした基板取付は板15を取り
付けるものである。なお、上記の上下部シールド箱6お
よび7にそれぞれ設けた通風窓6aおよび7eは、各辺
の長さを加熱高周波の174波長以下として、漏波を防
ぐと同時に、冷却用ファン12の冷却風の一部を取り入
れることができるようになっている。
In FIG. 4, the ceiling surface of the heating chamber 4 is provided with round holes 4b for positioning and square holes 4c for mounting on both sides and near both ends of a slit 4a formed therein. The lower shield box 7 has the above-mentioned slit 4 on the bottom.
A square hole 7a whose width and length are both larger than a, a positioning round hole 7b corresponding to the positioning round hole 4b on both sides thereof,
In the above installation, a notch 7C is formed that coincides with the inner end of the square hole 4c, and the four rising walls 7 of the bottom surface are formed.
d is provided with a ventilation window 7e continuous to the above-mentioned notch 7C, and at its upper end is formed a mounting shelf 7f with a guide edge on the outside, and furthermore, a screw hole 7 is formed approximately in the center thereof.
g is provided. The upper shield box 6 has a plurality of ventilation windows 6a punched out on the ceiling surface and side wall surface, respectively.
Screw holes 6C corresponding to the above-mentioned screw holes 7g are provided in the projecting portions 6b on the four sides. The printed circuit board 8 will be described in detail later, so to briefly describe it, an antenna 9 is formed on the bottom surface, and a detection circuit 10 is formed on the top surface. The board 15, which has 14 boards, is made by punching and forming a metal plate, and has a pentagonal hole 15a in the center with two parallel sides along the antenna 9, and two holes on each side for soldering. Four screw holes 15c are provided corresponding to the hole 15b and the screw hole 6c described above. The upper surface of the slit cover 14 has the above-mentioned positioning round holes 4b and 7b.
A guide protrusion +4a that is inserted into the lower shield box 7, and an engagement protrusion 14c that is inserted into the square hole 4C and that engages and fixes the engagement claw 14b in the notch 7C of the lower shield box 7. 4
The screws 16 are used to attach the board 15 to which the printed circuit board 8 is soldered into the upper and lower shield boxes 6 and 7. The ventilation windows 6a and 7e provided in the upper and lower shield boxes 6 and 7, respectively, have the length of each side set to 174 wavelengths or less of the heating high frequency to prevent wave leakage and at the same time prevent cooling air from the cooling fan 12. It is now possible to incorporate some of the

また、下部シールド箱7では、加熱室4からの伝導熱量
を低減して、プリント基板8の過熱を防ぐ役目も果す。
The lower shield box 7 also serves to reduce the amount of heat conducted from the heating chamber 4 and prevent the printed circuit board 8 from overheating.

第6図に移って、アンテナ9から得られた電力は、検波
ダイオード17で検波され、キャパシタンス成分18で
積分されて、低域通過フィルタI9を通り、出力端子1
0aからリード線11に、検波回路出力V。El?とし
て出力される。なお、アンテナ9から、検波ダイオード
17と並列に接続された低域通過フィルタ20を介して
接地端子10bからリード線Itに接続される。
Moving on to FIG. 6, the power obtained from the antenna 9 is detected by the detection diode 17, integrated by the capacitance component 18, passed through the low-pass filter I9, and then passed through the output terminal 1.
Detector circuit output V from 0a to lead wire 11. El? is output as Note that the antenna 9 is connected to the ground terminal 10b to the lead wire It via a low-pass filter 20 connected in parallel with the detection diode 17.

第5図に移って、プリント基板8は、その裏面全面に銅
箔を張った後、エツチングを施して、アンテナ9とこれ
を囲むアンテナ9に平行な長辺を有する5角の基板露呈
部21aを形成し、その表面には、上記の銅箔21とと
もに積分用キャパシタンス成分18、および2個の低域
通過フィルタ19と20を形成するマイクロストリップ
ラインを含む配線パターン10cを形成し、その上に検
波ダイオード17およびその他の抵抗、コンデンサを実
装する。
Turning to FIG. 5, the printed circuit board 8 is coated with copper foil over its entire back surface, and then etched to form an antenna 9 and a pentagonal exposed board portion 21a surrounding the antenna 9 with long sides parallel to the antenna 9. A wiring pattern 10c including a microstrip line forming an integral capacitance component 18 and two low-pass filters 19 and 20 together with the copper foil 21 is formed on the surface thereof, and a wiring pattern 10c is formed on the surface thereof. Mount the detection diode 17 and other resistors and capacitors.

また、表面の配線パターン10cと、裏面の銅箔21お
よびアンテナ9は、それぞれスルーホール22と23お
よび24で接続されている。
Further, the wiring pattern 10c on the front surface, the copper foil 21 and the antenna 9 on the back surface are connected through through holes 22, 23 and 24, respectively.

なお、プリント基板8は、−点鎖線の円で示した裏面の
4箇所の銅箔露呈部21b、実線の矩形で示した表面の
複数箇所の配線パターン露呈部10dを除き、全面に絶
縁膜が形成されている。
Note that the printed circuit board 8 has an insulating film over the entire surface, except for four exposed copper foil portions 21b on the back surface indicated by circles with dashed lines and multiple exposed wiring pattern portions 10d on the front surface indicated as rectangles with solid lines. It is formed.

第4図に戻るで1以上のような構成部品を組み立てるに
は、まず、プリント基板8を、その銅箔露呈部21bと
はんだ付は用孔15bを用い、基板取付は板15にはん
だ付けする。次に、下部シールド箱7の取付は用棚部7
fに上記の基板取付は板15および上部シールド箱6を
重ねて載せ、ビス16で固定する。次に、スリットカバ
ー14の案内突起14aおよび係合突起+4cを、加熱
室4の内部から、位置決め用丸孔4bおよび取付は用角
孔4Cに合わせて押し込むと、係合爪14bの働きで固
定される。
Returning to FIG. 4, in order to assemble one or more components, first, solder the printed circuit board 8 to the copper foil exposed portion 21b and the board 15 using the holes 15b to attach the board. . Next, install the lower shield box 7 on the shelf 7.
To attach the above board to f, place the plate 15 and upper shield box 6 one on top of the other, and fix with screws 16. Next, when the guide protrusion 14a and the engagement protrusion +4c of the slit cover 14 are pushed in from inside the heating chamber 4, aligning them with the positioning round hole 4b and the mounting square hole 4C, they are fixed by the action of the engagement claw 14b. be done.

次に、組み立ての終了した下部シールド箱7の位置決め
用丸孔7bと切欠き7Cを、スリットカバー14の案内
突起14aおよび係合突起14cに位置合わせし、加熱
室4の内部からスリットカバー14を支えながら押し込
むと、係合爪14bが切欠き7Cと係合して固定される
Next, the positioning round hole 7b and notch 7C of the assembled lower shield box 7 are aligned with the guide protrusion 14a and the engagement protrusion 14c of the slit cover 14, and the slit cover 14 is removed from the inside of the heating chamber 4. When pushed in while supporting, the engaging claw 14b engages with the notch 7C and is fixed.

以上のように構成された高周波加熱装置の動作を説明す
る。
The operation of the high frequency heating device configured as above will be explained.

加熱室4のターンテーブル3に載せた食品1に、高周波
放射装置5から電波が放射されると、食品1の状態によ
り反射波を含む高周波の一部が、樹脂製のスリットカバ
ー14を抜け、加熱室4の天井面に開けられたスリット
4aを通り、プリント基板8の下面に形成されたアンテ
ナ9で捕えられ、検波回路lOで検波積分されたのち検
波出力としてリード線11から制御器13に送られる。
When radio waves are emitted from the high-frequency radiator 5 to the food 1 placed on the turntable 3 in the heating chamber 4, some of the high-frequency waves, including reflected waves, pass through the resin slit cover 14 depending on the condition of the food 1. It passes through a slit 4a made in the ceiling of the heating chamber 4, is captured by an antenna 9 formed on the bottom surface of a printed circuit board 8, is detected and integrated by a detection circuit IO, and is then sent from a lead wire 11 to a controller 13 as a detection output. Sent.

制御器13は、検波出力から食品の状態を知り、最適解
凍時間を判定して高周波放射装置5や冷却用ファン12
.ターンテーブル3の電動機2を制御する。
The controller 13 learns the condition of the food from the detection output, determines the optimal thawing time, and controls the high-frequency radiation device 5 and the cooling fan 12.
.. The electric motor 2 of the turntable 3 is controlled.

次に、加熱制御の方法について、第7図ないし第9図に
より説明する。
Next, a heating control method will be explained with reference to FIGS. 7 to 9.

第7図は、検波回路出力v0゜、の時間変化を示す特性
図である。高周波加熱装置のターンテーブル3が一回転
する時間し?、1間を幾つかの区間tt2・・・に分割
し、各々の区間での最大値v、1゜■02等を求める。
FIG. 7 is a characteristic diagram showing the time change of the detection circuit output v0°. How long does it take for the turntable 3 of the high frequency heating device to rotate once? , 1 is divided into several sections tt2..., and the maximum value v, 1°■02, etc. in each section is determined.

この時vt1は、第8図に示すように、食品Iの重量m
に対応して変化するので、逆に■、1から重量mを求め
ることができる。また、V 、、 −V 、は、第9図
に示すように、おおよそ食品の初期温度に対応している
ため、逆にV。
At this time, vt1 is the weight m of food I, as shown in FIG.
Since it changes in accordance with , the weight m can be calculated from (1) and (1). Also, as shown in FIG. 9, V, , -V roughly corresponds to the initial temperature of the food, so V.

V、から初期温度Tを推定できる。以上の方法で。The initial temperature T can be estimated from V. In the above method.

食品1の初期状態を知ることができて、最適解凍時間が
判定できる。
The initial state of the food 1 can be known and the optimal thawing time can be determined.

(発明が解決しようとする課題) しかしながら、上述のタイムオートや重量センサによる
方法は、食品1の温度、形状、置き方。
(Problems to be Solved by the Invention) However, the above-mentioned methods using time autos and weight sensors are difficult to solve due to the temperature, shape, and placement of the food 1.

成分等に関係なく、一定時間の加熱で解凍するため、仕
上がり状態が大きくばらつき、例えば、買い物から持ち
帰ったそのままの冷凍食品は、初期温度が高いので重量
で解凍時間を決めると、煮えてしまったり、また、冷却
能力の強い冷凍庫に長期保存されていて初期温度の低い
食品では全く未解凍であったりして、使い勝手が悪いと
いう問題があった。
Because the food is thawed by heating for a certain amount of time, regardless of the ingredients, the finished product will vary widely. For example, frozen food brought home from shopping will have a high initial temperature, so if you decide the thawing time based on weight, it may end up boiling. In addition, there is a problem in that food that has been stored for a long time in a freezer with a strong cooling capacity and whose initial temperature is low may not be thawed at all, making it difficult to use.

また、反射電圧を用いると、理論的には初期反射電圧V
t1で重量mが検出できるだけでなく、反射電圧の時間
変化等を利用すれば食品の初期温度や置き方まで推測で
きる筈であるが、実際には反射電圧をとらえるアンテナ
9の構成や検波回路1゜の構成或いは両者の整合状態に
より、検波出力がばらつくという問題があった。
In addition, if the reflected voltage is used, theoretically the initial reflected voltage V
Not only can the weight m be detected at t1, but it should also be possible to estimate the initial temperature of the food and how it has been placed by using changes in the reflected voltage over time, etc. However, in reality, the configuration of the antenna 9 that captures the reflected voltage and the detection circuit 1 There is a problem in that the detection output varies depending on the configuration of .degree. or the matching state of both.

特に、検波回路10はノイズを避けるために電波があた
らないプリント基板8の上面に、アンテナ9には電波が
直接あたるように下面に、それぞれ構成するため、アン
テナ9と検波回路10はスルーホール24を介して接続
されている。従って、スルーホール24の孔径1位置、
めっき厚等の不安定要素によって、ばらつきが大きいと
いう問題があった。 本発明は上記の問題を解決するも
ので、反射電圧を正確に取出し、食品の解凍精度のよい
高周波加熱装置を提供するものである。
In particular, the detection circuit 10 is configured on the top surface of the printed circuit board 8, which is not exposed to radio waves to avoid noise, and the bottom surface is configured so that the antenna 9 is directly exposed to radio waves. connected via. Therefore, the hole diameter 1 position of the through hole 24,
There was a problem of large variations due to unstable factors such as plating thickness. The present invention solves the above problems and provides a high-frequency heating device that accurately extracts reflected voltage and defrosts foods with high precision.

(課題を解決するための手段) 上記の課題を解決するため、本発明は、アンテナと検波
回路をプリント基板の上面上に形成するものである。
(Means for Solving the Problems) In order to solve the above problems, the present invention forms an antenna and a detection circuit on the upper surface of a printed circuit board.

(作 用) 上記の構成により、アンテナ9による検知レベルはアン
テナ9の長さと銅箔露呈部21aの大きさによって決ま
り、エツチング精度が出せれば極めて安定な検知ができ
るので、精度の良い解凍検知が実現される。
(Function) With the above configuration, the detection level by the antenna 9 is determined by the length of the antenna 9 and the size of the copper foil exposed portion 21a, and if the etching accuracy is achieved, extremely stable detection can be achieved, so accurate thawing detection is possible. Realized.

(実施例) 本発明の一実施例を第1図および第2図により説明する
(Example) An example of the present invention will be described with reference to FIGS. 1 and 2.

第1図は本発明の一実施例を示す高周波加熱装置の模型
的断面図、第2図は本発明によるプリント基板の平面図
である。
FIG. 1 is a schematic cross-sectional view of a high-frequency heating device showing an embodiment of the present invention, and FIG. 2 is a plan view of a printed circuit board according to the present invention.

第2図において、本実施例のプリント基板8が第5図に
示した従来例と異なる点はアンテナ9を配線パターンl
ocの延長として、プリント基板8の上面に形成した点
と、第1図に示すように、食品1から反射されプリント
基板8の基板露呈部21aを透過してきた反射電波を検
出する点である。
In FIG. 2, the printed circuit board 8 of this embodiment is different from the conventional example shown in FIG.
As an extension of oc, there are two points: a point formed on the top surface of the printed circuit board 8, and a point at which reflected radio waves reflected from the food 1 and transmitted through the substrate exposed portion 21a of the printed circuit board 8 are detected, as shown in FIG.

その他は従来例と変らないので、同じ構成部品には同一
符号を付して、その説明を省略する。また、その食品1
の重量検出、加工時間の制御方法も変らないので、その
説明を省略するが、プリント基板8の裏面の基板露呈部
21aおよび表面のアンテナ9は、共にエツチング加工
によって精度よく形成できるので、検出精度が大幅に向
上し精度の高い制御が可能となる。
Since the rest is the same as the conventional example, the same components are given the same reference numerals and their explanations will be omitted. Also, the food 1
Since the weight detection and processing time control methods are also the same, their explanations will be omitted. However, since both the board exposed portion 21a on the back side of the printed circuit board 8 and the antenna 9 on the front side can be formed with high precision by etching processing, the detection accuracy can be improved. This greatly improves control and enables highly accurate control.

(発明の効果) 以上説明したように、本発明によれば、アンテナと検波
回路をプリント基板の同一面上で構成するので、スルー
ホールに起因するばらつきが排除され、整合精度が上が
り、正確に検波できるようになり常に安定した解凍がで
きる高周波加熱装置が得られる。またアンテナが汚れな
いので、経時変化が少なく、性能の安定した信頼性の高
い高周波加熱装置が得られる。
(Effects of the Invention) As explained above, according to the present invention, since the antenna and the detection circuit are configured on the same surface of the printed circuit board, variations caused by through holes are eliminated, matching precision is increased, and accurate It is possible to obtain a high-frequency heating device that can detect waves and constantly perform stable defrosting. Furthermore, since the antenna is not contaminated, a highly reliable high-frequency heating device with stable performance and little change over time can be obtained.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明による高周波加熱装置を示す模型的断面
図、第2図はそのプリント基板の平面図、第3図は従来
の高周波加熱装置の模型的断面図、第4図は同検波部の
分解斜視図、第5図は同プリント基板の平面図、第6図
は同検波回路図、第7図は同検波回路出力V。0.の時
間変化を示す特性図、第8図は同検波回路出力v、1と
食品重量mの特性図、第9図は同検波回路出力V tt
  V (、と食品の初期温度Tの特性図である。 l ・・・食品、 2 ・・・電動機、 3 ・・・タ
ーンテーブル、 4 ・・・加熱室、 4a・・スリッ
ト、 4b、7b・・・位置決め用丸孔、4c・・・取
付は用角孔、 5 ・・・高周波放射装置、 6 ・・
・上部シールド箱、 6a、  7e・・・通風窓、 
6b・・・張出し部、 6c。 +5c・・・ビス孔、 7 ・・・下部シールド箱、7
a・・・角孔、 7c・・・切欠き、 7d・・・立上
り壁、 7f・・・取付は用棚部、 7g・・・ねじ孔
、 8 ・・・プリント基板、 9・・・アンテナ、1
0・・・検波回路、loa・・・出力端子、10b・・
・接地端子、lOc・・・配線パターン、lod・・・
配線パターン露呈部、11 ・・・ リード線、12・
・・冷却用ファン、13・・・制御器、14・・・スリ
ットカバー 14a・・・案内突起、14b・・・係合
爪、+4c・・・係合突起、15・・・基板取付は板、
15a・・・ 5角孔、15b・・・はんだ付は用孔、
 j6・・・ ビス、 I7・・・検波ダイオード、 
18・・・積分用キャパシタンス成分、 19.20・
・・低域通過フィルタ、21・・・銅箔、21a・・・
基板露呈部、21b・・・銀箔露呈部、22.23.2
4・・・スルーホール。
FIG. 1 is a schematic cross-sectional view showing a high-frequency heating device according to the present invention, FIG. 2 is a plan view of its printed circuit board, FIG. 3 is a schematic cross-sectional view of a conventional high-frequency heating device, and FIG. 4 is a detection section of the same. 5 is a plan view of the printed circuit board, FIG. 6 is a diagram of the detection circuit, and FIG. 7 is the output V of the detection circuit. 0. 8 is a characteristic diagram showing the time change of the detection circuit output v, 1 and the food weight m, and FIG. 9 is a characteristic diagram showing the detection circuit output V tt
It is a characteristic diagram of the initial temperature T of food. ...Round hole for positioning, 4c...Square hole for mounting, 5...High frequency radiator, 6...
・Upper shield box, 6a, 7e...ventilation window,
6b... overhang, 6c. +5c...screw hole, 7...lower shield box, 7
a... Square hole, 7c... Notch, 7d... Standing wall, 7f... Mounting on shelf, 7g... Screw hole, 8... Printed circuit board, 9... Antenna ,1
0...Detection circuit, loa...Output terminal, 10b...
・Ground terminal, lOc...wiring pattern, lod...
Wiring pattern exposed part, 11...Lead wire, 12...
... Cooling fan, 13 ... Controller, 14 ... Slit cover 14a ... Guide projection, 14b ... Engagement claw, +4c ... Engagement projection, 15 ... Board mounting plate ,
15a... pentagonal hole, 15b... hole for soldering,
j6... screw, I7... detection diode,
18... Integral capacitance component, 19.20.
...Low pass filter, 21...Copper foil, 21a...
Substrate exposed part, 21b... Silver foil exposed part, 22.23.2
4...Through hole.

Claims (2)

【特許請求の範囲】[Claims] (1)食品を載せるターンテーブルを設けた加熱室と、
上記食品に電磁波を放射して加熱する高周波放射装置と
、プリント基板上に形成された、上記食品の反射波の一
部を検出するアンテナおよびその検波回路と、検波回路
出力により各種機器動作を制御する制御器とからなる高
周波加熱装置において、アンテナを検波回路と同一面上
で形成したことを特徴とする高周波加熱装置。
(1) A heating chamber equipped with a turntable on which food is placed;
A high-frequency radiator that radiates electromagnetic waves to heat the food, an antenna formed on a printed circuit board that detects some of the waves reflected from the food, and its detection circuit, and controls various equipment operations using the output of the detection circuit. 1. A high-frequency heating device comprising a controller and a controller, characterized in that the antenna is formed on the same surface as the detection circuit.
(2)プリント基板のアンテナおよび検波回路形成面を
上記加熱室と反対側の面に配置したことを特徴とする請
求項(1)記載の高周波加熱装置。
(2) The high-frequency heating device according to claim (1), wherein the antenna and detection circuit forming surface of the printed circuit board is disposed on a surface opposite to the heating chamber.
JP18045790A 1990-07-10 1990-07-10 High frequency heating device Pending JPH0471188A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18045790A JPH0471188A (en) 1990-07-10 1990-07-10 High frequency heating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18045790A JPH0471188A (en) 1990-07-10 1990-07-10 High frequency heating device

Publications (1)

Publication Number Publication Date
JPH0471188A true JPH0471188A (en) 1992-03-05

Family

ID=16083561

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18045790A Pending JPH0471188A (en) 1990-07-10 1990-07-10 High frequency heating device

Country Status (1)

Country Link
JP (1) JPH0471188A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022058998A1 (en) * 2020-09-15 2022-03-24 Goji Limited Rf power module with a connectorless rf radiating element

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61201179A (en) * 1985-03-04 1986-09-05 New Japan Radio Co Ltd Constitution of response tag
JPH01286285A (en) * 1988-05-13 1989-11-17 Matsushita Electric Ind Co Ltd High frequency heating device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61201179A (en) * 1985-03-04 1986-09-05 New Japan Radio Co Ltd Constitution of response tag
JPH01286285A (en) * 1988-05-13 1989-11-17 Matsushita Electric Ind Co Ltd High frequency heating device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022058998A1 (en) * 2020-09-15 2022-03-24 Goji Limited Rf power module with a connectorless rf radiating element

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