JPH047114B2 - - Google Patents

Info

Publication number
JPH047114B2
JPH047114B2 JP58021288A JP2128883A JPH047114B2 JP H047114 B2 JPH047114 B2 JP H047114B2 JP 58021288 A JP58021288 A JP 58021288A JP 2128883 A JP2128883 A JP 2128883A JP H047114 B2 JPH047114 B2 JP H047114B2
Authority
JP
Japan
Prior art keywords
motor
wiring board
warpage
stator
comparative example
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58021288A
Other languages
Japanese (ja)
Other versions
JPS59147481A (en
Inventor
Koichi Inagaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP2128883A priority Critical patent/JPS59147481A/en
Publication of JPS59147481A publication Critical patent/JPS59147481A/en
Publication of JPH047114B2 publication Critical patent/JPH047114B2/ja
Granted legal-status Critical Current

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  • Brushless Motors (AREA)
  • Structure Of Printed Boards (AREA)

Description

【発明の詳細な説明】 産業上の利用分野 本発明は新規なモータ用ステータ取付配線基板
に関し、特に反りが少なく従つてモータのロータ
とのギヤツプを小さく且つ均一にすることができ
る新規なモータ用ステータ取付配線基板を提供し
ようとするものである。
DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a new motor stator mounting wiring board, and particularly to a new motor stator mounting wiring board that has less warpage and can make the gap with the motor rotor small and uniform. The present invention aims to provide a stator mounting wiring board.

背景技術及びその問題点 ビデオテープレコーダ等の電子装置に使用され
るモータにはステータを構成する複数のコイルを
プリント配線基板上に取付け、更に該プリント配
線基板にステータを回転自在に組付けるようにし
た扁平な形状を有するモータがある。第1図及び
第2図はそのような扁平モータ用ステータ取付配
線基板の一例を示すものであり、配線基板1の一
半部1aがモータ用ステータ取付領域とされ、他
半部1bが扁平モータ制御用電子回路形成領域と
されており、ステータ取付領域1aの表側にはス
テータ2を構成するコイル3,3、…の端子4,
4,…が接続される配線膜5,5,…が形成さ
れ、そして、そのコイル3,3,…がステータ取
付領域1a表面上に接着剤等によつて固着されて
いる。そのコイル3,3,…の端子4,4,…と
配線膜5,5,…とは半田付けによつて接続され
ている。又、扁平モータ制御用電子回路形成領域
1bの表側には扁平モータ制御用電子回路を構成
する各種部品6,6,…が取付けられており、プ
リント配線基板の底面図である第2図に示すよう
に電子回路形式領域1bの裏側の面には電子部品
6,6,…間を電気的に接続して電子回路を構成
する多数の配線膜7,7,…が形成されている。
尚、8,8,…はこのプリント配線基板1を図示
しないサブシヤーシに取付けるねじを通す孔であ
る。そのサブシヤーシには軸受を有し1.2mmの厚
さの鉄板からなるヨークが設けられている。又、
9は図示しないヨークの軸受が嵌る軸受嵌合孔で
ある。
BACKGROUND ART AND PROBLEMS The motor used in electronic devices such as video tape recorders has a plurality of coils constituting a stator mounted on a printed wiring board, and the stator is rotatably assembled on the printed wiring board. There is a motor that has a flat shape. Figures 1 and 2 show an example of such a stator mounting wiring board for a flat motor, where one half 1a of the wiring board 1 is used as a stator mounting area for the motor, and the other half 1b is used for controlling the flat motor. Terminals 4 of the coils 3, 3, ... that constitute the stator 2 are located on the front side of the stator mounting area 1a.
Wiring films 5, 5, . . . to which the coils 4, . . . are connected are formed, and the coils 3, 3, . The terminals 4, 4, . . . of the coils 3, 3, . . . and the wiring films 5, 5, . . . are connected by soldering. Further, on the front side of the flat motor control electronic circuit formation area 1b, various parts 6, 6, ... constituting the flat motor control electronic circuit are attached, as shown in FIG. 2, which is a bottom view of the printed wiring board. As shown, a large number of wiring films 7, 7, . . . , which electrically connect the electronic components 6, 6, .
Note that 8, 8, . . . are holes through which screws for attaching the printed wiring board 1 to a sub-chassis (not shown) are passed. The sub-chassis is equipped with a yoke made of a 1.2mm thick iron plate with bearings. or,
9 is a bearing fitting hole into which a bearing of a yoke (not shown) is fitted.

ところで、このようなプリント配線基板1は電
子部品6,6,…及びコイル3,3,…の組付後
裏面が半田デイツプされたり、あるいはプリント
配線基板1上に塗布した樹脂を硬化するための紫
外線照射処理が施されたりし、その際に熱を受け
る。するとその熱によつてプリント配線基板1が
反つてしまうという問題があつた。ちなみにこの
反りは具体的にはプリント配線基板1の中央部が
表側に凸曲するような反りとなる。そして、この
反りの発生は扁平モータ組立後における基板側と
ロータとの接触の原因となる可能性があり好まし
くない。そこでその接触を惧れるあまり基板側と
ロータとの感隔を大きくすると性能が悪くなつて
しまう。
By the way, after the electronic components 6, 6, ... and coils 3, 3, ... are assembled, the back surface of such a printed wiring board 1 is dip-dipped with solder, or the printed wiring board 1 is coated with a resin coated to harden it. It is sometimes subjected to ultraviolet irradiation treatment and receives heat during that process. Then, there was a problem that the printed wiring board 1 would warp due to the heat. Incidentally, this warpage is specifically such that the central portion of the printed wiring board 1 is curved convexly toward the front side. The occurrence of this warpage may cause contact between the substrate side and the rotor after the flat motor is assembled, which is undesirable. Therefore, if the distance between the substrate side and the rotor is increased because of the fear of such contact, the performance will deteriorate.

発明の目的 しかして、本発明は半田デイツプ等に伴つて受
ける熱によつて生じる反りを少なくした新規なモ
ータ用ステータ取付配線基板を提供しようとする
ものである。
OBJECTS OF THE INVENTION It is therefore an object of the present invention to provide a novel stator mounting wiring board for a motor that reduces warping caused by heat received due to solder dips and the like.

発明の概要 上記目的を達成するための本発明モータ用ステ
ータ取付配線基板の構成は、表面の一部に電子回
路を構成する電子部品が組付けられ、該電子部品
組付部の裏面に電子回路の配線を構成する導体膜
が形成され、表面の他部にモータ用ステータが取
付けられるモータ用ステータ取付配線基板であつ
て、モータ用ステータが取付けられる部分の裏側
に1又は複数の反り防止用導体膜を形成してなる
ことを特徴とするものであり、モータ用ステータ
が取付けられる部分の裏側に形成した反り防止用
導体膜によつて基板が反るのを有効に防止するこ
とができる。
Summary of the Invention In order to achieve the above object, the stator mounting wiring board for a motor of the present invention has a structure in which electronic components constituting an electronic circuit are assembled on a part of the surface, and an electronic circuit is mounted on the back surface of the electronic component assembly portion. A motor stator mounting wiring board on which a conductor film constituting the wiring is formed, and a motor stator is mounted on the other part of the surface, and one or more warp prevention conductors are provided on the back side of the part where the motor stator is mounted. It is characterized by forming a film, and the warp prevention conductor film formed on the back side of the part where the motor stator is attached can effectively prevent the board from warping.

実施例 以下に、本発明モータ用ステータ取付配線基板
を添付図面に示した実施例に従つて詳細に説明す
る。
Embodiments Hereinafter, the stator mounting wiring board for a motor of the present invention will be described in detail according to embodiments shown in the accompanying drawings.

第3図は本発明モータ用ステータ取付配線基板
の実施の一例1−1の底面図である。このモータ
用ステータ取付配線基板1−1は第1図及び第2
図に示すものとはその裏面の形状特にステータ取
付領域1aの形状が異なるにすぎず、他の点では
全く共通している。従つて、本実施例1−1の説
明にあたりその共通点の詳細な説明を省略し、相
違点のある底面を示す第3図に従つて相違点のみ
を説明する。
FIG. 3 is a bottom view of an example 1-1 of the stator mounting wiring board for a motor according to the present invention. This motor stator mounting wiring board 1-1 is shown in Figures 1 and 2.
The only difference from the one shown in the figure is the shape of the back surface, particularly the shape of the stator attachment area 1a, and the other points are completely the same. Therefore, in describing this embodiment 1-1, a detailed explanation of the common features will be omitted, and only the differences will be explained with reference to FIG. 3 showing the bottom surface with the differences.

第3図において、10,10,…,11はモー
タ用ステータ取付配線基板1のモータ用ステータ
取付領域1aの裏面に形成された導体膜であり、
電子回路形成領域1bの裏面に形成された配線膜
7,7,…と同じ材料によつて同時に形成される
が、電子回路の配線としての機能を有しない点で
配線膜7,7,…とは果す機能が全く異なる。即
ち、その導体膜10,10、…,11は電子回路
を構成するものではなく基板1−1の反りを防止
するためのものである。反り防止用導体膜10,
10,…は軸受嵌合孔9を中心とする同心円状に
形成されている。従つて、反り防止用導体膜1
0,10,…はモータ組立後においてはモータの
回転軸線を中心とする同心円となる。反り防止用
導体膜11はステータ取付領域1aの周縁に沿つ
て形成されている。この配線基板1−1の厚さ
は、1.0mm、ステータ取付領域1aの幅Wが60mm、
長さlも60mmである。
In FIG. 3, 10, 10, ..., 11 are conductive films formed on the back surface of the motor stator mounting area 1a of the motor stator mounting wiring board 1,
The wiring films 7, 7, . . . formed on the back surface of the electronic circuit forming area 1b are formed at the same time using the same material, but they are different from the wiring films 7, 7, . have completely different functions. That is, the conductor films 10, 10, . . . , 11 do not constitute an electronic circuit, but are used to prevent the substrate 1-1 from warping. Conductor film 10 for preventing warpage,
10, . . . are formed concentrically with the bearing fitting hole 9 as the center. Therefore, the warpage prevention conductor film 1
0, 10, . . . become concentric circles centered on the rotational axis of the motor after the motor is assembled. The warpage prevention conductor film 11 is formed along the periphery of the stator attachment area 1a. The thickness of this wiring board 1-1 is 1.0 mm, the width W of the stator mounting area 1a is 60 mm,
The length l is also 60 mm.

このような導体膜10,10,…,11をステ
ータ取付領域1aの裏面に設けたモータ用ステー
タ取付配線基板1−1は反り量が少なく、又、モ
ータ回転時に導体膜10,10,…,11内に流
れるうず電流による損失も小さい。そこで、次
に、この点を種々の比較例と比べながら述べるこ
とにする。尚、第4図A乃至Cは各別の比較例1
−2、1−3、1−4の要部を示すものである。
The motor stator mounting wiring board 1-1 in which such conductor films 10, 10, ..., 11 are provided on the back surface of the stator mounting area 1a has a small amount of warpage, and the conductor films 10, 10, ..., 11 are not warped when the motor rotates. The loss due to the eddy current flowing in 11 is also small. Therefore, this point will be discussed next while comparing with various comparative examples. In addition, FIGS. 4A to C are each comparative example 1.
-2, 1-3, and 1-4.

第4図Aはステータ取付領域1aの裏面に全面
的に反り防止用導体膜12を形成した比較例1−
2を示す。同図Bはステータ取付領域1a裏面の
軸受嵌合孔9内縁部にリング状の反り防止用導体
膜13を形成し、ステータ取付領域1aの周縁部
に沿つて反り防止用導体膜11を形成し、更にそ
の反り防止用導体膜13から11へ放射状に延び
る多数の反り防止用導体膜14,14,…を形成
してなる比較例1−3を示すものである。又、同
図Cは軸受嵌合孔9内縁部にリング状の反り防止
用導体膜13を設け、ステータ取付領域1a周縁
部に反り防止用導体膜11を設けてなる比較例1
−4を示すものである。この比較例1−4はいわ
ば第4図Bに示す比較例1−3から放射状に延び
る反り防止用導体膜14,14,…を除いてなる
ものである。尚、この第4図A〜Cはプリント配
線基板1のステータ取付領域1aの裏面のみを示
すものである。又、そのステータ取付領域1aの
大きさは第3図に示す本願発明の実施の一例1−
1のそれと全く同じである。
FIG. 4A shows a comparative example 1- in which a conductor film 12 for preventing warpage is formed entirely on the back surface of the stator mounting area 1a.
2 is shown. In Figure B, a ring-shaped warpage prevention conductor film 13 is formed on the inner edge of the bearing fitting hole 9 on the back side of the stator attachment area 1a, and a warpage prevention conductor film 11 is formed along the peripheral edge of the stator attachment area 1a. , Comparative Example 1-3 is shown in which a large number of warp-preventing conductor films 14, 14, . In addition, FIG. C shows comparative example 1 in which a ring-shaped warpage prevention conductor film 13 is provided on the inner edge of the bearing fitting hole 9, and a warpage prevention conductor film 11 is provided on the peripheral edge of the stator mounting area 1a.
-4. This Comparative Example 1-4 is, so to speak, the same as Comparative Example 1-3 shown in FIG. 4B except that the radially extending conductor films 14, 14, . . . for preventing warpage are removed. Note that FIGS. 4A to 4C only show the back side of the stator mounting area 1a of the printed wiring board 1. Further, the size of the stator mounting area 1a is as shown in FIG.
It is exactly the same as that of 1.

第5図は本願発明の実施の一例1−1と上記各
比較例1−2〜1−4についての反り量を示す棒
グラフであり、同図Aは半田デイツプ処理前にお
ける逆反り量を示す。ここで、逆反り量とは基板
1が同図Aの上方部に示すように中央部が裏側へ
凹むような反りを指す。即ち、一般にプリント配
線基板1は半田デイツプ処理等をする前の段階に
おいては逆反りが生じている。そして、半田デイ
ツプ処理等によつて熱を受けると中央部が表側へ
隆起するような反り(第5図Bの右上方部に示
す)が発生する。ところで半田デイツプ等の処理
前に発生している逆反りの量とその半田デイツプ
処理等に伴つて発生する反りの量とを比較すると
後者の方が大きく、そのためプリント配線基板1
は最終的には中央部が隆起するように反つた状態
になるのが普通である。そのため、半田デイツプ
処理等をする前に逆反りが生じているプリント配
線基板1に対して逆反り量を若干多くする反り矯
正を施して最終的に反りの量が少なくなるように
することがある。そして、この第5図Aは、本願
発明の実施の一例1−1と各比較例1−2〜1−
4についての反り矯正をしなかつたもの(普通の
棒で示す)と、反り矯正をしたもの(ハツチング
の入つた棒で示す)との半田デイツプ処理前に生
じている逆反りの反り量を示すものである。この
図から明らかなように、第3図に示す本願発明の
実施の一例1−1と第4図Aに示す比較例1−2
は逆反り量が比較的多く、第4図B,Cに示す比
較例1−3、1−4は逆反り量が比較的少ない。
FIG. 5 is a bar graph showing the amount of warpage for Example 1-1 of the present invention and each of the above-mentioned Comparative Examples 1-2 to 1-4, and FIG. 5A shows the amount of reverse warpage before solder dip treatment. Here, the amount of reverse warpage refers to the warpage in which the center portion of the substrate 1 is recessed toward the back side, as shown in the upper part of FIG. That is, in general, the printed wiring board 1 is reversely warped before it is subjected to solder dip treatment or the like. Then, when it is heated by a solder dip treatment or the like, a warpage occurs in which the center part bulges toward the front side (as shown in the upper right part of FIG. 5B). By the way, when comparing the amount of reverse warpage that occurs before processing the solder dip, etc. with the amount of warpage that occurs due to the solder dip processing, etc., the latter is larger, and therefore the printed wiring board 1
Eventually, it is normal for the center to become warped with a bulge. Therefore, before performing solder dip treatment, etc., warpage correction may be applied to the printed wiring board 1 where reverse warpage has occurred to slightly increase the amount of reverse warp, so that the amount of warpage is finally reduced. . FIG. 5A shows an example 1-1 of the implementation of the present invention and comparative examples 1-2 to 1-1.
4 shows the amount of reverse warpage that occurs before the solder dip treatment for those that have not been corrected (indicated by a normal bar) and those that have been corrected (indicated by a hatched bar). It is something. As is clear from this figure, Example 1-1 of the implementation of the present invention shown in FIG. 3 and Comparative Example 1-2 shown in FIG. 4A.
The amount of reverse warpage is relatively large, and the amount of reverse warp is relatively small in Comparative Examples 1-3 and 1-4 shown in FIGS. 4B and 4C.

第5図Bは、同図Aの本願発明の実施の一例や
各比較例と同じもの1−2〜1〜4についての半
田デイツプ処理後における反り量を示すものであ
る。この図から明らかなように反り矯正をしなく
ても反り量を0.3mm以下にすることができ、反り
矯正をすれば反り量を0.2mm以下にすることがで
きる。特に第3図に示す本願発明の実施の一例1
−1によれば反り矯正をするしないに拘らず反り
量を0.1mmよりも小さくすることができ、第4図
Aに示す比較例1−2によれば反り量を略0にす
ることができる。
FIG. 5B shows the amount of warpage after the solder dip treatment for the same examples 1-2 to 1 to 4 as the embodiment of the present invention and each comparative example shown in FIG. 5A. As is clear from this figure, the amount of warpage can be reduced to 0.3 mm or less without warp correction, and the amount of warp can be reduced to 0.2 mm or less with warp correction. Particularly, an example 1 of implementing the claimed invention shown in FIG.
According to Comparative Example 1-1, the amount of warpage can be reduced to less than 0.1 mm regardless of whether or not warp correction is performed, and according to Comparative Example 1-2 shown in Figure 4A, the amount of warpage can be reduced to approximately 0. .

反り量を小さくすることができるという点では
第4図Aに示すようなステータ取付領域1aの裏
側全面に反り防止用導体膜12を形成した比較例
1−2が最も優れており、第3図に示すような同
心円状の反り防止用導体膜10,10,…を形成
した本願発明の実施の一例1−1がそれに次いで
優れているといえる。しかしながら、比較例1−
2は扁平モータの回転によつて導体膜12にうず
電流が流れうず電流損を生じるという面があり、
単に反り量が少ないという点だけに着目して第4
図Aに示す比較例1−2を最も好ましいと即断す
ることはできない。
In terms of being able to reduce the amount of warpage, Comparative Example 1-2 in which a conductor film 12 for warping prevention was formed on the entire back side of the stator mounting area 1a as shown in FIG. 4A is the best, and as shown in FIG. It can be said that Example 1-1 of the present invention in which concentric conductor films 10, 10, . . . for preventing warpage are formed as shown in FIG. However, Comparative Example 1-
2 has the aspect that eddy current flows through the conductor film 12 due to the rotation of the flat motor, causing eddy current loss.
Focusing solely on the fact that the amount of warpage is small, the fourth
Comparative Example 1-2 shown in Figure A cannot be immediately determined to be the most preferable.

第6図は本願発明の実施の一例と各比較例につ
いての扁平モータの無負荷時における電流と回転
数とを示すものである。この図から明らかなよう
に、本願発明の実施の一例1−1と比較例1−2
とを比較すれば、無負荷電流については本願発明
の実施の一例1−1の方が比較例1−2よりも少
なく、又、無負荷時の回転数については本願発明
の実施の一例1−1の方が比較例1−2よりも大
きい。従つて、電気的特性の面からは第3図に示
す本願発明の実施の一例1−1の方が優れている
といえるのである。
FIG. 6 shows the current and rotational speed of the flat motor at no load for an example of implementation of the present invention and each comparative example. As is clear from this figure, Example 1-1 of the implementation of the present invention and Comparative Example 1-2
Comparing these, the no-load current in Example 1-1 of the implementation of the present invention is smaller than that of Comparative Example 1-2, and the rotation speed at no-load is lower than that of Example 1-1 of the implementation of the present invention. 1 is larger than Comparative Example 1-2. Therefore, it can be said that Example 1-1 of the present invention shown in FIG. 3 is superior in terms of electrical characteristics.

尚、この本願発明の実施の一例1−1は第4図
Bに示す比較例1−3と比較しても無負荷電流が
低く、無負荷での回転数が大きいので優れてい
る。又、第4図Cに示す比較例1−4と比較する
と、無負荷電流に関してはほとんど差異がなく、
無負荷時の回転数については本願発明の実施の一
例1−1の方が大きく優れている。この第6図が
示す本願発明の実施の一例1−1と比較例1−2
との特性の顕著な差異は反り防止用導体膜10,
12内におけるうず電流がモータの特性に大きく
影響することを物語つている。すなわち、第4図
Aに示す比較例1−2においてはステータ取付領
域1aの裏面全面に導体膜12が形成されてお
り、導体膜12にはうず電流が流れるループがほ
とんど拘束を受けることなく形成され得るのに対
して、第3図に示す本願発明の実施の一例1−1
においては同心円状の導体膜10,10,…が形
成されているので第3図の破線に示すようなうず
電流ecの流れる経路が形成される余地がほとんど
ない。従つて、うず電流損の発生量が顕著に異な
る筈であり、第6図の本願発明の実施の一例1−
1と比較例1−2との特性の差はそのうず電流損
の差の存在を裏付けているといえる。このよう
に、反り防止用導体膜はモータの特性に影響を与
えるものであり、又、モータ用ステータ取付配線
基板1においては反りが小さいことも重要である
がモータの電気的特性ができるだけ良好であるこ
とも要求される。以上のことから総合的に判断し
て第3図に示す本願発明の実施の一例1−1が最
も好ましいといえる。
Incidentally, even when compared with Comparative Example 1-3 shown in FIG. 4B, Example 1-1 of the present invention is superior in that it has a low no-load current and a large number of revolutions under no-load. Moreover, when compared with Comparative Example 1-4 shown in FIG. 4C, there is almost no difference in no-load current;
Regarding the number of revolutions under no load, Example 1-1 of the embodiment of the present invention is significantly superior. Example 1-1 and Comparative Example 1-2 of the present invention shown in FIG.
The remarkable difference in characteristics between the warpage prevention conductor film 10 and
This shows that the eddy current in the motor 12 greatly affects the characteristics of the motor. That is, in Comparative Example 1-2 shown in FIG. 4A, the conductor film 12 is formed on the entire back surface of the stator attachment area 1a, and the loop through which the eddy current flows is formed in the conductor film 12 with almost no restraint. Example 1-1 of implementing the present invention shown in FIG.
Since the conductor films 10, 10, . . . are formed in concentric circles, there is almost no room for forming a path for the eddy current ec to flow as shown by the broken line in FIG. Therefore, the amount of eddy current loss generated should be significantly different from Example 1- of the implementation of the present invention shown in FIG.
It can be said that the difference in characteristics between Comparative Example 1 and Comparative Example 1-2 supports the existence of the difference in eddy current loss. In this way, the conductor film for preventing warpage affects the characteristics of the motor, and while it is important that the warp be small in the motor stator mounting wiring board 1, it is also important to ensure that the electrical characteristics of the motor are as good as possible. Certain things are also required. Comprehensively judging from the above, it can be said that Example 1-1 of the embodiment of the present invention shown in FIG. 3 is the most preferable.

効 果 以上に述べたように、本発明モータ用ステータ
取付配線基板は、表面の一部に電子回路を構成す
る電子部品が組付けられ、該電子部品組付部の裏
面に電子回路の配線を構成する導体膜が形成さ
れ、表面の他部に複数のステータコイルが1つの
円上に配置されて成るモータ用ステータが取付け
られるモータ用ステータ取付配線基板であつて、
モータ用ステータが取付けられる部分の裏面に複
数の反り防止用導体膜を同心円状に形成してなる
ことを特徴とするものである。従つて、本発明に
よればモータ用ステータが取つ付けられる部分の
裏側に形成した反り防止用導体膜によつて基板が
反るのを有効に防止することができ、延いてはロ
ータが基板側と接触する惧れがなくなり、ギヤツ
プをより少なくすることができる。換言すれば反
りが少なく従つてロータとのギヤツプを小さく且
つ均一にすることができる新規なモータ用ステー
タ取付配線基板を提供することができる。
Effects As described above, in the stator mounting wiring board for a motor of the present invention, electronic components constituting an electronic circuit are assembled on a part of the surface, and wiring for the electronic circuit is mounted on the back surface of the electronic component assembly part. A motor stator mounting wiring board on which a motor stator having a plurality of stator coils arranged in a circle on the other part of the surface is attached, on which a conductive film is formed,
It is characterized in that a plurality of warp-preventing conductor films are formed concentrically on the back surface of the part where the motor stator is attached. Therefore, according to the present invention, it is possible to effectively prevent the board from warping by the warp-preventing conductive film formed on the back side of the part to which the motor stator is attached, and as a result, the rotor can be prevented from warping. There is no risk of contact with the sides, and gaps can be further reduced. In other words, it is possible to provide a novel stator mounting wiring board for a motor that has less warpage and can therefore make the gap with the rotor small and uniform.

しかも、複数の反り防止用導体膜を同心円状に
形成しているので、反りを防止できるだけでなく
大きなうず電流損が生じないようにもすることが
できる。しかして、本願発明によればモータの特
性を低下させることなくロータと基板側との接触
を防止することが可能になるのである。
Moreover, since the plurality of warp-preventing conductor films are formed concentrically, it is possible not only to prevent warpage but also to prevent large eddy current loss from occurring. Therefore, according to the present invention, it is possible to prevent contact between the rotor and the substrate side without degrading the characteristics of the motor.

【図面の簡単な説明】[Brief explanation of drawings]

第1図はモータ用ステータ取付配線基板の斜視
図、第2図は従来例を示す底面図、第3図は本発
明モータ用ステータ取付配線基板実施の一例を示
す底面図、第4図A〜Cは各別の比較例の要部を
示す底面図、第5図Aは本願発明の実施例の一例
と各比較例の半田デイツプ前における逆反り量を
示すグラフ、同図Bは同じく半田デイツプ後にお
ける反り量を示すグラフ、第6図は本願発明の実
施の一例と各比較例のモータの無負荷電流及び無
負荷時の回転数を示すグラフである。 符号の説明、1−1〜1−4……モータ用ステ
ータ取付配線基板、2……モータ用ステータ、3
……ステータコイル、10,11,12,13…
…反り防止用導体膜。
Fig. 1 is a perspective view of a stator mounting wiring board for a motor, Fig. 2 is a bottom view showing a conventional example, Fig. 3 is a bottom view showing an example of implementation of the stator mounting wiring board for a motor of the present invention, and Figs. C is a bottom view showing the main parts of each comparative example, FIG. FIG. 6 is a graph showing the amount of warpage afterward, and FIG. 6 is a graph showing the no-load current and the number of rotations at no-load of the motor of an example of the implementation of the present invention and each comparative example. Explanation of symbols, 1-1 to 1-4...Motor stator mounting wiring board, 2...Motor stator, 3
...Stator coil, 10, 11, 12, 13...
...Conductor film for warping prevention.

Claims (1)

【特許請求の範囲】[Claims] 1 表面の一部に電子回路を構成する電子部品が
組付けられ、該電子部品組付部の裏面に電子回路
の配線を構成する導体膜が形成され、表面の他部
に複数のステータコイルが1つの円上に配置され
て成るモータ用ステータが取付けられるモータ用
ステータ取付配線基板であつて、モータ用ステー
タが取付けられる部分の裏面に複数の反り防止用
導体膜を同心円状に形成してなることを特徴とす
るモータ用ステータ取付配線基板。
1. Electronic components constituting an electronic circuit are assembled on a part of the surface, a conductor film constituting the wiring of the electronic circuit is formed on the back surface of the electronic component assembly part, and a plurality of stator coils are formed on the other part of the surface. A motor stator mounting wiring board to which a motor stator arranged on a single circle is attached, which has a plurality of warp-preventing conductor films formed concentrically on the back surface of the part to which the motor stator is attached. A stator mounting wiring board for a motor, characterized by:
JP2128883A 1983-02-10 1983-02-10 Circuit board for mounting stator for motor Granted JPS59147481A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2128883A JPS59147481A (en) 1983-02-10 1983-02-10 Circuit board for mounting stator for motor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2128883A JPS59147481A (en) 1983-02-10 1983-02-10 Circuit board for mounting stator for motor

Publications (2)

Publication Number Publication Date
JPS59147481A JPS59147481A (en) 1984-08-23
JPH047114B2 true JPH047114B2 (en) 1992-02-07

Family

ID=12050941

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2128883A Granted JPS59147481A (en) 1983-02-10 1983-02-10 Circuit board for mounting stator for motor

Country Status (1)

Country Link
JP (1) JPS59147481A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61106053A (en) * 1984-10-30 1986-05-24 Sanyo Electric Co Ltd Brushless motor
JPS61280697A (en) * 1985-05-17 1986-12-11 三洋電機株式会社 Hybrid integrated circuit board
JPS62293959A (en) * 1986-06-11 1987-12-21 Tamagawa Seiki Co Ltd Brushless dc motor
JP2006083760A (en) * 2004-09-16 2006-03-30 Aisan Ind Co Ltd Electronic controller and electric pump

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5526030A (en) * 1978-08-14 1980-02-25 Hitachi Ltd Flat armature coil

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54179460U (en) * 1978-06-08 1979-12-19
JPS56172972U (en) * 1980-05-22 1981-12-21
JPS57154172U (en) * 1981-03-24 1982-09-28

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5526030A (en) * 1978-08-14 1980-02-25 Hitachi Ltd Flat armature coil

Also Published As

Publication number Publication date
JPS59147481A (en) 1984-08-23

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