JPH0470760U - - Google Patents
Info
- Publication number
- JPH0470760U JPH0470760U JP11309290U JP11309290U JPH0470760U JP H0470760 U JPH0470760 U JP H0470760U JP 11309290 U JP11309290 U JP 11309290U JP 11309290 U JP11309290 U JP 11309290U JP H0470760 U JPH0470760 U JP H0470760U
- Authority
- JP
- Japan
- Prior art keywords
- electronic components
- insulating substrate
- back surface
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 2
- 239000004020 conductor Substances 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11309290U JPH0470760U (fi) | 1990-10-30 | 1990-10-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11309290U JPH0470760U (fi) | 1990-10-30 | 1990-10-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0470760U true JPH0470760U (fi) | 1992-06-23 |
Family
ID=31860640
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11309290U Pending JPH0470760U (fi) | 1990-10-30 | 1990-10-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0470760U (fi) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011046134A1 (ja) * | 2009-10-13 | 2011-04-21 | カルソニックカンセイ株式会社 | 多層基板の放熱構造 |
-
1990
- 1990-10-30 JP JP11309290U patent/JPH0470760U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011046134A1 (ja) * | 2009-10-13 | 2011-04-21 | カルソニックカンセイ株式会社 | 多層基板の放熱構造 |
| JP2011086663A (ja) * | 2009-10-13 | 2011-04-28 | Calsonic Kansei Corp | 多層基板の放熱構造 |