JPH0470740U - - Google Patents

Info

Publication number
JPH0470740U
JPH0470740U JP11360390U JP11360390U JPH0470740U JP H0470740 U JPH0470740 U JP H0470740U JP 11360390 U JP11360390 U JP 11360390U JP 11360390 U JP11360390 U JP 11360390U JP H0470740 U JPH0470740 U JP H0470740U
Authority
JP
Japan
Prior art keywords
lead frame
molded lead
separation
gap
showing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11360390U
Other languages
Japanese (ja)
Other versions
JPH0642335Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11360390U priority Critical patent/JPH0642335Y2/en
Publication of JPH0470740U publication Critical patent/JPH0470740U/ja
Application granted granted Critical
Publication of JPH0642335Y2 publication Critical patent/JPH0642335Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案にかかるモールド済リードフレ
ーム分離機構を示す要部概略平面図、第2図はマ
ーキング装置全体の構成を示す概略斜視図、第3
図はモールド済リードフレーム1と分離板2a,
2b,2c,2dと押え板4とベアリング80の
配置関係を示す概略側面図、第4図は押え板4と
これを支持する支持機構40を示す側面図、第5
図はモールド済リードフレーム1と押え板4の当
接状態を示す概略正面図、第6図はモールド済リ
ードフレーム1が押え板4を所定距離lだけ押し
上げたときの状態を示す概略側面図、第7図は分
離板2a,2b,2c,2dの動作を示す概略平
面図、第8図、第9図は従来のモールド済リード
フレーム分離機構の要部を示す概略正面図である
。 図中、1……モールド済リードフレーム、2a
,2b,2c,2d……分離板、3a,3b……
分離板駆動機構、4……押え板、である。
FIG. 1 is a schematic plan view of main parts showing a molded lead frame separation mechanism according to the present invention, FIG. 2 is a schematic perspective view showing the overall configuration of the marking device, and FIG.
The figure shows a molded lead frame 1, a separation plate 2a,
2b, 2c, 2d, a schematic side view showing the arrangement relationship between the holding plate 4 and the bearing 80, FIG. 4 is a side view showing the holding plate 4 and the support mechanism 40 that supports it, and FIG.
The figure is a schematic front view showing the contact state between the molded lead frame 1 and the presser plate 4, and FIG. 6 is a schematic side view showing the state when the molded lead frame 1 pushes the presser plate 4 up by a predetermined distance l. FIG. 7 is a schematic plan view showing the operation of the separation plates 2a, 2b, 2c, and 2d, and FIGS. 8 and 9 are schematic front views showing the main parts of a conventional molded lead frame separation mechanism. In the figure, 1...molded lead frame, 2a
, 2b, 2c, 2d... separation plate, 3a, 3b...
Separation plate drive mechanism, 4...pressing plate.

Claims (1)

【実用新案登録請求の範囲】 積み重ねられたモールド済リードフレームの両
側にそれぞれ略ハ字状に配設された4枚の分離板
と、 該4枚の分離板の対向する内側の端部を最上段
のモールド済リードフレームとその下のモールド
済リードフレームの隙間に挿入した後に該4枚の
分離板の外側の端部を該隙間に挿入せしめる分離
板駆動機構と、 最上段のモールド済リードフレームの上面に所
定の弾発力で当接する押え板を具備することを特
徴とするモールド済リードフレーム分離機構。
[Scope of Claim for Utility Model Registration] Four separating plates arranged in a substantially V-shape on both sides of stacked molded lead frames, and the opposing inner ends of the four separating plates being a separation plate drive mechanism that inserts the outer ends of the four separation plates into the gap after being inserted into the gap between the upper molded lead frame and the lower molded lead frame; and the uppermost molded lead frame. 1. A molded lead frame separation mechanism, comprising a presser plate that abuts against the upper surface of the molded lead frame with a predetermined elastic force.
JP11360390U 1990-10-30 1990-10-30 Molded lead frame separation mechanism Expired - Lifetime JPH0642335Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11360390U JPH0642335Y2 (en) 1990-10-30 1990-10-30 Molded lead frame separation mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11360390U JPH0642335Y2 (en) 1990-10-30 1990-10-30 Molded lead frame separation mechanism

Publications (2)

Publication Number Publication Date
JPH0470740U true JPH0470740U (en) 1992-06-23
JPH0642335Y2 JPH0642335Y2 (en) 1994-11-02

Family

ID=31861210

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11360390U Expired - Lifetime JPH0642335Y2 (en) 1990-10-30 1990-10-30 Molded lead frame separation mechanism

Country Status (1)

Country Link
JP (1) JPH0642335Y2 (en)

Also Published As

Publication number Publication date
JPH0642335Y2 (en) 1994-11-02

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