JPH0469594B2 - - Google Patents
Info
- Publication number
- JPH0469594B2 JPH0469594B2 JP9773786A JP9773786A JPH0469594B2 JP H0469594 B2 JPH0469594 B2 JP H0469594B2 JP 9773786 A JP9773786 A JP 9773786A JP 9773786 A JP9773786 A JP 9773786A JP H0469594 B2 JPH0469594 B2 JP H0469594B2
- Authority
- JP
- Japan
- Prior art keywords
- alumina ceramics
- copper plate
- plate
- ceramics
- alumina
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 49
- 239000000919 ceramic Substances 0.000 claims description 49
- 229910052802 copper Inorganic materials 0.000 claims description 40
- 239000010949 copper Substances 0.000 claims description 40
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 37
- 229910052751 metal Inorganic materials 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 9
- 230000008646 thermal stress Effects 0.000 description 15
- 229910000833 kovar Inorganic materials 0.000 description 11
- 230000035882 stress Effects 0.000 description 7
- 238000001816 cooling Methods 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- KGWWEXORQXHJJQ-UHFFFAOYSA-N [Fe].[Co].[Ni] Chemical compound [Fe].[Co].[Ni] KGWWEXORQXHJJQ-UHFFFAOYSA-N 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- IUYOGGFTLHZHEG-UHFFFAOYSA-N copper titanium Chemical compound [Ti].[Cu] IUYOGGFTLHZHEG-UHFFFAOYSA-N 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- -1 steel by brazing Chemical class 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Landscapes
- Pressure Welding/Diffusion-Bonding (AREA)
- Ceramic Products (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9773786A JPS62252376A (ja) | 1986-04-25 | 1986-04-25 | アルミナセラミツクスと銅板との接合方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9773786A JPS62252376A (ja) | 1986-04-25 | 1986-04-25 | アルミナセラミツクスと銅板との接合方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62252376A JPS62252376A (ja) | 1987-11-04 |
| JPH0469594B2 true JPH0469594B2 (fr) | 1992-11-06 |
Family
ID=14200207
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9773786A Granted JPS62252376A (ja) | 1986-04-25 | 1986-04-25 | アルミナセラミツクスと銅板との接合方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62252376A (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20180067061A (ko) * | 2016-12-12 | 2018-06-20 | 이기원 | 광학 및 진동에 의해 위치가 정렬되어 커넥터와 접촉되는 검사용 소켓 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2507614B2 (ja) * | 1989-07-15 | 1996-06-12 | 日本碍子株式会社 | セラミック部品と金属部品との加圧接合方法 |
-
1986
- 1986-04-25 JP JP9773786A patent/JPS62252376A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20180067061A (ko) * | 2016-12-12 | 2018-06-20 | 이기원 | 광학 및 진동에 의해 위치가 정렬되어 커넥터와 접촉되는 검사용 소켓 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62252376A (ja) | 1987-11-04 |
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