JPH046940Y2 - - Google Patents
Info
- Publication number
- JPH046940Y2 JPH046940Y2 JP1986200092U JP20009286U JPH046940Y2 JP H046940 Y2 JPH046940 Y2 JP H046940Y2 JP 1986200092 U JP1986200092 U JP 1986200092U JP 20009286 U JP20009286 U JP 20009286U JP H046940 Y2 JPH046940 Y2 JP H046940Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed
- mask
- holes
- layer
- printing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 24
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 22
- 238000007639 printing Methods 0.000 claims description 17
- 229910052759 nickel Inorganic materials 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 101100269850 Caenorhabditis elegans mask-1 gene Proteins 0.000 description 8
- 238000007650 screen-printing Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Screen Printers (AREA)
- Manufacture Or Reproduction Of Printing Formes (AREA)
- Printing Plates And Materials Therefor (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【考案の詳細な説明】
（産業上の利用分野）
本考案は、例えばプリント基板に半田印刷を行
う際、半田印刷膜厚を制御できるようにした半田
印刷膜厚制御用スクリーン印刷メタルマスクに関
する。[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to a screen-printed metal mask for controlling the thickness of a solder printing film, which allows the thickness of the solder printing film to be controlled, for example, when performing solder printing on a printed circuit board.
（従来技術）
従来、プリント基板に半田を点付するにはデス
ペンサーにより一点一点スポツト点付するか、ス
クリーン印刷メタルマスクを用い半田ペーストを
印刷していた。(Prior Art) Conventionally, in order to apply solder to a printed circuit board, the solder paste was applied one by one using a dispenser, or the solder paste was printed using a screen printing metal mask.
（考案が解決しようとする問題点）
ところで前記従来技術に於て、デスペンサーを
用いた場合、一点一点半田をスポツトして行くた
め作業時間が極めて長くなり、又調整により半田
量を制御できるが付着量が不安定となり、付着位
置も不正確で不良品が生じ易いという問題点があ
つた。(Problems to be solved by the invention) By the way, in the above-mentioned conventional technology, when a dispenser is used, the work time is extremely long because the solder is spotted one by one, and the amount of solder cannot be controlled by adjustment. However, there were problems in that the amount of adhesion was unstable, the position of adhesion was inaccurate, and defective products were likely to be produced.
又、従来のスクリーン印刷メタルマスクを用い
た場合は印刷半田膜厚を制御できないという問題
点があつた。 Furthermore, when a conventional screen-printed metal mask was used, there was a problem in that the thickness of the printed solder film could not be controlled.
（問題点を解決するための手段）
本考案は上記問題点に着目してなされたもの
で、銅板両面にニツケル層を形成した３層式スク
リーン印刷基板に印刷透孔を形成したスクリーン
印刷メタルマスクに於て、印刷半田膜厚を厚くす
る基本マスクの印刷透孔部の上部ニツケル層又は
上部ニツケル層と中間銅板層を切欠し、該切欠部
に切欠部の深さより厚く基本マスク切欠部印刷透
孔と同じパターンの印刷透孔を形成した重ねマス
クを嵌合固定したことを特徴とするものである。(Means for Solving the Problems) The present invention was made with attention to the above problems, and is a screen-printed metal mask in which printed holes are formed on a three-layer screen-printed board with nickel layers formed on both sides of a copper plate. In this method, the upper nickel layer or the upper nickel layer and the intermediate copper plate layer of the printing hole part of the basic mask that increases the thickness of the printed solder film is cut out, and the basic mask cutout part printing transparent layer is added to the cutout part to a thickness greater than the depth of the cutout part. It is characterized by fitting and fixing an overlapping mask in which printed through holes with the same pattern as the holes are formed.
以下、図示した実施例に基づいて具体的に説明
する。１は銅板１ａの両面にニツケル層１ｂ，１
ｃを形成した厚さ100μ〜500μの基本マスクで、
コンデンサー等大きいものを確実に半田付するた
め印刷半田膜厚を厚くする必要のある印刷透孔２
の上部層１ｂをエツチングにより４角状に切欠し
て切欠部３を形成している。４は基本マスク１と
同じ３層式の重ねマスクで前記切欠部３に嵌合す
る形状になつており、基本マスク１の切欠部３の
印刷透孔２と同じパターンの印刷透孔５を形成し
てある。 Hereinafter, a detailed explanation will be given based on the illustrated embodiment. 1 has nickel layers 1b and 1 on both sides of a copper plate 1a.
A basic mask with a thickness of 100μ to 500μ formed with c.
Printed through hole 2 that requires a thick printed solder film to reliably solder large items such as capacitors
The upper layer 1b is etched to form a quadrangular notch to form a notch 3. Reference numeral 4 denotes a three-layer layered mask similar to the basic mask 1, which has a shape that fits into the notch 3, and has printed holes 5 having the same pattern as the printed holes 2 in the notch 3 of the basic mask 1. It has been done.
使用時は第３図の如く、基本マスク１の切欠部
３に重ねマスク４を嵌合し、接着剤等で固定す
る。この時、基本マスク１の印刷透孔２と重ねマ
スク４の印刷透孔５と切欠部３とは横方向にすれ
ることなく外周が正確に合致して位置するように
なる。このスクリーン印刷メタルマスクを使用す
ると、重ねマスク４は基本マスク１の上面より２
層分上方に突出している。基本マスク１及び重ね
マスク４の上に半田ペーストをスキージーにより
刷り込むと、印刷透孔２，５の部分は正確に合致
しているので印刷透孔５より半田ペーストは印刷
透孔２に円滑に流れ、基本マスク１の印刷透孔２
より半田ペーストが多く充填されているので、ス
キージーにより基本マスク１と重ねマスク４とが
押されて元に戻る時、プリント基板の印刷透孔２
部分には印刷半田膜厚が基本マスク１より厚く印
刷される。基本マスクの切欠部は上層部と中間部
を切欠してもよく重ねマスクの厚みも２層にして
もよい。 When in use, as shown in FIG. 3, the overlapping mask 4 is fitted into the notch 3 of the basic mask 1 and fixed with adhesive or the like. At this time, the printed holes 2 of the basic mask 1, the printed holes 5 of the stacked mask 4, and the notches 3 are positioned so that their outer peripheries precisely match without being rubbed in the lateral direction. When using this screen-printed metal mask, the overlapping mask 4 is 2
It protrudes upward in layers. When solder paste is imprinted onto the basic mask 1 and the overlapping mask 4 using a squeegee, the printing holes 2 and 5 match exactly, so the solder paste flows smoothly from the printing hole 5 to the printing hole 2. , printing hole 2 of basic mask 1
Since the solder paste is filled with more solder paste, when the basic mask 1 and the overlapping mask 4 are pushed by the squeegee and returned to their original positions, the printed through holes 2 of the printed circuit board are filled with more solder paste.
The printed solder film thickness is printed on the portions to be thicker than that of the basic mask 1. The cutout portion of the basic mask may be formed by cutting out the upper layer portion and the middle portion, and the stacked mask may have a thickness of two layers.
（効果）
本考案によると、銅板両面にニツケル層を形成
した３層式スクリーン印刷基板に印刷透孔を形成
したスクリーン印刷メタルマスクに於て、印刷半
田膜厚を厚くする基本マスクの印刷透孔部の上部
ニツケル層又は上部ニツケル層と中間銅板層を切
欠し、該切欠部に切欠部の深さより厚く基本マス
ク切欠部印刷透孔と同じパターンの印刷透孔を形
成した重ねマスクを嵌合固定してあるので、基本
マスクの印刷透孔と重ねマスクの印刷透孔とを横
にずれることなく数μの誤差で正確に合致して位
置させることができ、半田ペーストは上記２つの
印刷透孔内を円滑に流れ、スクリーン印刷により
必要部分の印刷半田膜厚を必要な厚さに制御で
き、作業性が著しく向上し、半田付着量の制御と
付着位置を正確に行うことができ製品の安定化を
計ることができる。(Effects) According to the present invention, in a screen printing metal mask in which printing holes are formed on a three-layer screen printing board with nickel layers formed on both sides of a copper plate, the printing holes in the basic mask increase the thickness of the printed solder film. Cut out the upper nickel layer or the upper nickel layer and the intermediate copper plate layer, and fit and fix in the cutout a layered mask with printing holes that are thicker than the depth of the cutout and have the same pattern as the printing holes in the basic mask cutout. As a result, the printed holes in the basic mask and the printed holes in the overlapping mask can be aligned and positioned accurately with an error of a few microns without shifting laterally, and the solder paste can be placed between the two printed holes mentioned above. Screen printing allows you to control the thickness of the printed solder film in the necessary areas to the required thickness, significantly improving work efficiency, and making it possible to control the amount of solder adhesion and the position of adhesion accurately, resulting in stable products. It is possible to measure the
第１図は本考案の一実施例要部正断面図、第２
図は第１図の基本マスク要部平面図、第３図は第
１図の重ねマスク平面図である。
１……基本マスク、１ａ……銅板、１ｂ，１ｃ
……ニツケル層、２……基本マスクの印刷透孔、
３……基本マスクの切欠部、４……重ねマスク、
５……重ねマスクの印刷透孔。
Figure 1 is a front sectional view of the main part of one embodiment of the present invention, Figure 2
This figure is a plan view of the main part of the basic mask shown in FIG. 1, and FIG. 3 is a plan view of the overlapping mask shown in FIG. 1. 1...Basic mask, 1a...Copper plate, 1b, 1c
...Nickel layer, 2...Printed holes in basic mask,
3... Notch part of basic mask, 4... Layered mask,
5... Printing holes in the overlapping mask.
Claims (1)
ーン印刷基板に印刷透孔を形成したスクリーン印
刷メタルマスクに於て、印刷半田膜厚を厚くする
基本マスクの印刷透孔部を上部ニツケル層又は上
部ニツケル層と中間銅板層を切欠し、該切欠部に
切欠部の深さより厚く基本マスク切欠部印刷透孔
と同じパターンの印刷透孔を形成した重ねマスク
を嵌合固定した半田印刷膜厚制御用スクリーン印
刷メタルマスク。 In a screen-printed metal mask in which printed holes are formed on a three-layer screen-printed board with nickel layers formed on both sides of a copper plate, the printed holes of the basic mask that increase the thickness of the printed solder film are printed on the upper nickel layer or the upper nickel layer. A solder printing film thickness control screen in which a stacked mask is formed by cutting out a layer and an intermediate copper plate layer, and forming printing holes in the cutout portion that are thicker than the depth of the cutout portion and have the same pattern as the printing holes in the basic mask cutout portion. printed metal mask.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986200092U JPH046940Y2 (en) | 1986-12-27 | 1986-12-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986200092U JPH046940Y2 (en) | 1986-12-27 | 1986-12-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63106663U JPS63106663U (en) | 1988-07-09 |
| JPH046940Y2 true JPH046940Y2 (en) | 1992-02-25 |
Family
ID=31162283
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986200092U Expired JPH046940Y2 (en) | 1986-12-27 | 1986-12-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH046940Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5956579A (en) * | 1982-09-24 | 1984-04-02 | Fujitsu Ltd | Compound metal mask |
-
1986
- 1986-12-27 JP JP1986200092U patent/JPH046940Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5956579A (en) * | 1982-09-24 | 1984-04-02 | Fujitsu Ltd | Compound metal mask |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63106663U (en) | 1988-07-09 |
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