JPH0469192A - Profile cutting method for film and the like sticked to disk body - Google Patents

Abstract

PURPOSE:To reduce the frequency of the cutter exchange with the life of the cutter being made longer, by moving the cutter with its reciprocating automatically in the direction crossed with the turning round direction, while the cutter is turned around along the outer periphery of a disk body. CONSTITUTION:A cam follower 11 fitted to a rotating shaft 3 freely rotatably via a fitting ring 10 is rotated with its mounting on the cam face 12a of the cam plate 12 which is provided around the rotating shaft 3. The rotating shaft 3 is thus moved vertically along the undulation of the cam face 12a and accordingly a cutter C fitted to the rotating shaft 3 is moved (lifted) in the direction crossed with the turning round direction, namely the vertical direction(an arrow mark g - h direction). At this time, the cutter C is lifted so that its part brought into contact with a film A and wafer B is moved with its reciprocation between effective cutting edge widths (d). The local wear of the cutter C is therefore restrained, because the place cutting the film A actually and the part brought into contact with the outer periphery of the wafer B, in the cutting edge D of the cutter C, are changed during the cutting of the film A.

Description

Detailed Description of the Invention (Industrial Field of Application) The profile cutting method of the present invention cuts a tape attached to a wafer to follow the outer shape of the wafer, for example, in a post-processing process in the manufacturing process of semiconductor wafers. This paper relates to a method for cutting the paper.

(Prior art) After manufacturing a semiconductor wafer, a protective film is applied to one or both sides of the wafer using a tape application device generally called a tape mounter in order to protect the wafer from damage. .

Normally, this pasted film is larger than the outer diameter of the wafer, so-called oversize, so it is necessary to cut the film to follow the outer shape of the wafer for purposes such as centering the wafer.

Therefore, conventionally, cutting was carried out using a tracing cutting device as shown in FIG. This cutting device lowers the blade C in the direction of the arrow Z in the figure to cut into the film A, and then moves the blade C in the direction of the arrow y in the figure along the outer periphery of the wafer B to which the film A is attached. After the cutting tool C has completed the cutting by moving around the wafer B, the cutting tool C is raised in the direction of the arrow X in the figure.

(Problem to be Solved by the Invention) However, in the conventional copy cutting device, as shown in FIG. As shown in FIG. 8, only a certain part j of the cutting edge of the knife C always cuts the film A, and that part j becomes difficult to cut. Further, since the side surface of the cutter C at the same location J contacts the wafer B through the film A, only that portion is locally worn. For this reason, there was a problem in that the life of the blade was short and the blade had to be replaced frequently.

In order to use the knife for a long period of time, it is possible to shift the cutting point J and the contact part K, but in order to do so, the installation position of the knife C must be adjusted, which is a troublesome work. .

(Objective of the Invention) An object of the present invention is to provide a profiling cutting method that prolongs the life of the blade, reduces the frequency of blade replacement, and eliminates the trouble of adjusting the position of the blade.

(Means for Solving the Problem) As shown in FIGS. 1 to 3, the profile cutting method of the present invention moves a cutter C around the outer circumference of a disc body B, such as a wafer, to which a film A is attached. In the copy cutting method of cutting the film A into the shape of the disk body B, while the blade C rotates along the outer periphery of the disk body B, the blade C is cut in a direction intersecting the circumferential direction. It is characterized by automatic reciprocal movement.

(Function) In the profile cutting method of the present invention, the blade C is lowered in the direction of the arrow a in FIG. Move it along the outer periphery of B in the direction of the arrow in the figure. In the present invention, at this time, the cutter C is also moved in a direction crossing the circumferential direction, that is, in the arrow gh direction (vertical direction) in the figure, so the cutter C is actually moved as shown by the arrow C in the figure. move. Therefore, the part of the cutting edge of the same knife C that actually cuts the film A and the part that contacts the outer periphery of the wafer B are different from the part that actually cuts the film A.
changes during cutting, so local wear of the blade C is suppressed.

(Example) FIG. 1 shows an example of an apparatus for implementing the profile cutting method of the present invention.

This copy cutting device rotates a motor 2 attached to a substrate 1, and a belt 6, which is attached to a pulley 4 of the motor 2 and a pulley 5 of a rotating shaft 3, rotates a motor 2 attached to the substrate 1. When the shaft 3 is rotated, the cutter C, which is fixed to the plate 7 at the lower end of the rotary shaft 3, is attached to the wafer B.
The film A is cut by being rotated in the direction of the arrow f in FIG. 1 along the outer shape of the film A.

In this profile cutting device, when the rotating shaft 3 rotates,
As shown in FIG. 1, a cam follower 11, which is rotatably attached to the rotating shaft 3 via a ring lO, is connected to a cam face 12 of a cam m12 provided around the rotating shaft 3.
It is rotated on top of a. As a result, the rotating shaft 3 moves up and down along the undulations of the cam surface 12a, and accordingly, the cutter C attached to the rotating shaft 3 moves in a direction intersecting the circumferential direction, that is, in the vertical direction (arrow gh direction). At this time, the blade C is lifted so that the portion that contacts the film A and the wafer B moves back and forth between the effective cutting edge width d shown in FIG. In addition, when the cutting/contact point of the blade C makes one reciprocation of the effective cutting edge width d while the blade C makes one revolution, the shape of the cam surface 12a is adjusted so that the lift amount 2 is the effective cutting width as shown in FIG. The blade width may be set to d, and the amplitude period T may be set to 21 (360 degrees). Further, when the effective cutting edge width d is to be reciprocated twice during one revolution of the blade C, the shape of the cam surface 12a may be made as shown in FIG. 5, and the amplitude period may be set to π (180 degrees).

In addition to lifting the cam follower 11, the motor 2
Since the substrate l is also lifted, a guide arm 8 is attached to the substrate l to guide it.

In the illustrated device, a combination of the cam plate 12 and the cam follower 11 is used as a mechanism for lifting the rotating shaft 3 and the cutter C, but the mechanism for moving the cutter C may be other than these, for example, the sixth As shown in the figure, the board 1 on which the motor 2 and rotating shaft 3 are attached is attached to the rod 2 of the cylinder 20.
It may be lifted by the expansion and contraction of 1.

(Effect of the invention) The profile cutting method of the present invention has the following effects.

■As the cutter C moves in the circumferential direction, it also moves in the direction intersecting the circumferential direction within the effective cutting edge width d of the same cutter C, so
The part where film A is cut and the part that contacts the outer periphery of wafer B are always misaligned. For this reason, local wear of the blade C is reduced, and the entire blade C wears out almost uniformly.
The life of the knife C is extended.

(2) Since the cutter C automatically moves up and down, there is no need to replace the cutter C or adjust the position of the cutter C.

[Brief explanation of the drawing]

Fig. 1 is a partially sectional front view showing an example of a device implementing the profiling cutting method of the present invention, Fig. 2 is an explanatory diagram of the effective cutting edge width of the blade, and Fig. 3 is an explanation of the cutting operation by the same cutting method. Figure, 4th
Figure 5 shows the cam plate 12 used in the cutting device shown in Figure 1.
FIG. 6 is a partial cross-sectional front view showing the advantages of a device implementing the copy cutting method of the present invention, FIG. 7 is an explanatory diagram of cutting operation by a conventional copy cutting device, and FIG. 8 is an explanatory diagram of wear of the blade of the cutting device. A is a film B is a disk such as a wafer C is a cutter

Claims (1)

[Claims] In a copy cutting method in which a blade C is moved around the outer periphery of a disk body B such as a wafer to which a film A is attached to cut the film A into the shape of the disk body B, the blade C
Copy cutting of a film, etc. affixed to a disc body, characterized in that while the blade C revolves along the outer periphery of the disc body B, the same blade C is automatically reciprocated in a direction intersecting the circumferential direction. Method.