JPH0468551U - - Google Patents

Info

Publication number

JPH0468551U

JPH0468551U JP11154690U JP11154690U JPH0468551U JP H0468551 U JPH0468551 U JP H0468551U JP 11154690 U JP11154690 U JP 11154690U JP 11154690 U JP11154690 U JP 11154690U JP H0468551 U JPH0468551 U JP H0468551U

Authority

JP

Japan

Prior art keywords

lead frame

semiconductor chip

bonded

semiconductor device

bond part

Prior art date

1990-10-24

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000004065 semiconductor Substances 0.000 claims description 7
• 229910052802 copper Inorganic materials 0.000 claims description 2
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
• 229910000881 Cu alloy Inorganic materials 0.000 claims 1
• 239000010949 copper Substances 0.000 claims 1
• 229910052737 gold Inorganic materials 0.000 description 1
• 238000007747 plating Methods 0.000 description 1

Cited By (1)