JPH046771A - Heat seal connector for connecting electric circuit and connecting method thereof - Google Patents
Heat seal connector for connecting electric circuit and connecting method thereofInfo
- Publication number
- JPH046771A JPH046771A JP2106542A JP10654290A JPH046771A JP H046771 A JPH046771 A JP H046771A JP 2106542 A JP2106542 A JP 2106542A JP 10654290 A JP10654290 A JP 10654290A JP H046771 A JPH046771 A JP H046771A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- adhesive
- resist film
- seal connector
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title description 4
- 239000000853 adhesive Substances 0.000 claims abstract description 38
- 239000002184 metal Substances 0.000 claims abstract description 20
- 229910052751 metal Inorganic materials 0.000 claims abstract description 20
- 239000000463 material Substances 0.000 claims abstract description 9
- 239000010408 film Substances 0.000 claims description 26
- 229920001187 thermosetting polymer Polymers 0.000 claims description 7
- 239000010409 thin film Substances 0.000 claims description 6
- 239000011888 foil Substances 0.000 claims description 5
- 239000010410 layer Substances 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- 239000012790 adhesive layer Substances 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 239000002344 surface layer Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 abstract description 30
- 238000013508 migration Methods 0.000 description 6
- 230000005012 migration Effects 0.000 description 6
- 230000007797 corrosion Effects 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 5
- 239000010931 gold Substances 0.000 description 4
- 238000009833 condensation Methods 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
- 229920002799 BoPET Polymers 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920003051 synthetic elastomer Polymers 0.000 description 2
- 239000005061 synthetic rubber Substances 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- 101100008047 Caenorhabditis elegans cut-3 gene Proteins 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- YACLQRRMGMJLJV-UHFFFAOYSA-N chloroprene Chemical compound ClC(=C)C=C YACLQRRMGMJLJV-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000006078 metal deactivator Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、ＬＣＤ、ＥＬ、プラズマデイスプレィなどの
表示体の接続端子、その駆動部分を搭載した回路基板、
あるいは各種電気回路の基板間の接続に用いられるヒー
トシールコネクターおよびその接続方法に関するもので
ある。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to connection terminals of display bodies such as LCD, EL, and plasma displays, circuit boards on which driving parts thereof are mounted,
The present invention also relates to a heat seal connector used for connecting boards of various electric circuits and a method for connecting the same.
一般に、ヒートシールコネクターは、ＬＣＤＥＬ、ＬＥ
Ｄ、ＥＣＤ、プラズマデイスプレィなどの表示器とＰＣ
Ｂ、ＦＰＣとの接続、あるいはＰＣＢとＦＰＣ，ＰＣＢ
間、ＦＰＣ間の接続に用いられているが、近年デイスプ
レィの大型化、カラー化、細密化また電子機器の小型化
、細密化に伴って回路数が増加し、接続パターンのピッ
チは０．３．０．２．０．１ｍと小さくなり、接続部材
の低抵抗化が求められるようになってきた。Generally, heat seal connectors are LCDEL, LE
Display devices such as D, ECD, plasma display, and PC
B. Connection with FPC, or PCB and FPC, PCB
However, in recent years, the number of circuits has increased as displays have become larger, more colored, and more detailed, and electronic devices have become smaller and more detailed, and the pitch of the connection pattern has become 0.3. .0.2.0.1m, and lower resistance of connecting members is now required.
従来では、コネクターの導電部に金属を用いるようにな
り、これを異方導電性接着剤で接続していたが、更に低
い抵抗値で接続するために導電部を露出させ、接続パタ
ーンに直接接触させるとともに、導電部間に設けられた
接着剤により保持する構造をとってきた９
〔発明が解決しようとする課題〕
しかしながら、従来のように導電部ａを露出させたヒー
トシールコネクターｂを用いた場合、第４図に示すよう
にヒートシール部分からレジスト膜Ｃにかけてのわずか
な部分に導電部の露出した部分、即ち隙間ｄが回路基板
ｅ上に残ってしまう。Conventionally, metal was used for the conductive part of the connector, which was connected with an anisotropic conductive adhesive, but in order to connect with an even lower resistance value, the conductive part was exposed and brought into direct contact with the connection pattern. At the same time, a structure has been adopted in which the conductive parts are held together by an adhesive provided between the conductive parts9. In this case, as shown in FIG. 4, an exposed portion of the conductive portion, that is, a gap d, remains on the circuit board e in a small area from the heat-sealed portion to the resist film C.
その結果、結露等により電解腐食やマイグレーションが
起こりやすくなり、電気回路の信鯨性を著しく低下させ
てしまい問題であった。As a result, electrolytic corrosion and migration are likely to occur due to dew condensation, etc., which significantly reduces the reliability of the electric circuit, which is a problem.
本発明は、このような従来の問題点を解決したヒートシ
ールコネクターを用いた電気回路の接続構造、および有
効な接続方法を提供することを目的としたものである。It is an object of the present invention to provide an electrical circuit connection structure using a heat seal connector and an effective connection method that solves these conventional problems.
Ｃ課題を解決するための手段〕
本発明は、電気回路パターンの接続部分において、導電
部分が金属線、導電ペースト、金ｒＸ箔。Means for Solving Problem C] The present invention provides a method in which a conductive part in a connection part of an electric circuit pattern is a metal wire, a conductive paste, or a gold rX foil.
金属薄膜層のいずれか、またはその組合せよりなり、電
気回路との接続部分で導電部分が露出しており、接続部
分以外の部分にレジスト膜を設けたヒートシールコネク
ターを用いて電気回路を接続する際に、該レジスト膜の
少なくとも接続部分に近接する部分が熱接着性を有して
おり、電気回路とヒートシール接続する際、レジスト膜
の一部もヒートシールすることにより導電部分を被覆し
、接続部分の露出を無くしたことを特徴としている。Connect the electrical circuit using a heat-seal connector that consists of one of the metal thin film layers or a combination thereof, the conductive part is exposed at the connection part with the electrical circuit, and a resist film is provided on the part other than the connection part. In this case, at least a portion of the resist film close to the connection portion has thermal adhesive properties, and when making a heat seal connection to an electric circuit, a part of the resist film is also heat sealed to cover the conductive portion, It is characterized by the fact that the connection part is not exposed.
本発明のレジスト膜を設けたヒートシールコネクターを
用いて電気回路を接続するのに、電気絶縁性基材にある
電気回路パターン上のレジスト膜を回路基板上に合わせ
て圧着しつつ熱を加えて接続すると、この接続部分では
結露などによる水の１続部分への浸入を防ぐことができ
て、電解腐食。To connect an electric circuit using the heat seal connector provided with the resist film of the present invention, the resist film on the electric circuit pattern on the electrically insulating base material is pressed onto the circuit board while applying heat. When connected, this connection part can prevent water from entering into the connected part due to condensation and electrolytic corrosion.
マイグレーションの発生の危険を抑え、より信幀性の高
い電気回路の接続構造となる。This reduces the risk of migration and provides a more reliable electrical circuit connection structure.
本発明を第１〜２図例で説明すると、電気絶縁性基材と
なる基材フィルム２上に導電性パターン４を熱接着性接
着剤３と共に備え、非熱接着性レジスト膜７で重合被覆
したもので、その一端に形成した接続部分に熱接着性部
となる熱接着性レジスト膜５を重合積層してヒートシー
ルコネクター１を構成しである。即ち、ヒートシールコ
ネクター１としては、低抵抗化をはかるため導電部には
導電性金属を使用し、接続部分はこの導電パターン４が
露出し、間には熱接着性接着剤３が設けられており、ヒ
ートシールにより接続できるようになっている。To explain the present invention using examples in FIGS. 1 and 2, a conductive pattern 4 is provided on a base film 2 serving as an electrically insulating base material together with a heat adhesive 3, and is polymerized and coated with a non-thermal adhesive resist film 7. The heat-seal connector 1 is constructed by superimposing and laminating a heat-adhesive resist film 5, which becomes a heat-adhesive part, on a connecting portion formed at one end. That is, in the heat-seal connector 1, a conductive metal is used for the conductive part in order to reduce the resistance, and the conductive pattern 4 is exposed at the connection part, and the heat-adhesive adhesive 3 is provided in between. It can be connected by heat sealing.
本発明のヒートシールコネクターに用いられる基材は、
電気絶縁性のものならば使用可能であるが、ヒートシー
ルする際の熱伝導性、耐熱性を考慮するとＰＥＴ又はＰ
Ｉの１０〜２００μｍのフィルム、望ましくは２Ｏ−１
００μｍのフィルムを用いることが好ましい。The base material used in the heat seal connector of the present invention is
If it is electrically insulating, it can be used, but considering the thermal conductivity and heat resistance when heat sealing, PET or P
A 10-200 μm film of I, preferably 2O-1
It is preferable to use a 00 μm film.
この場合、前記導電部に用いられる金属の形態としては
、導電性金属線、導電ペースト、金属箔金属薄膜があげ
られ、金属線としてはＣｕ、 ＳＯ５，リン青銅、黄銅
、ベリリウム銅、Ｎ１等や、これらの金属線に＾Ｕ、八
ｇへ Ｐｄ等をメツキしたもの等が例示されるが、金属
線の強度、成形性の点からＮｉ、真鍮、リン青銅製のも
のが良く、接続抵抗を考膓すると、Ａｕにより被覆され
ていることが更に好ましい。導電ペーストとしてはＡｇ
ペースト、 Ａｕペースト、 Ａｇ−Ｃペースト等が例
示されるが、価格、抵抗値の点からＡｇペーストを用い
ることが好ましく、耐マイグレーション性を考慮すると
、へｇ−ｃペーストとし、その配合比は抵抗の点から八
ｇを５０重量％以上とすることが最も良い。また、Ａｇ
ペーストの露出を極力抑えるために、Ａｇペーストの上
にＣペーストをのせたものとすることも効果的である。In this case, the form of the metal used for the conductive part includes a conductive metal wire, a conductive paste, a metal foil metal thin film, and examples of the metal wire include Cu, SO5, phosphor bronze, brass, beryllium copper, N1, etc. Examples include those plated with Pd, etc. on these metal wires, but from the viewpoint of strength and formability of the metal wires, those made of Ni, brass, or phosphor bronze are better, and the connection resistance is lower. Upon consideration, it is more preferable that the material be coated with Au. Ag as a conductive paste
Paste, Au paste, Ag-C paste, etc. are exemplified, but it is preferable to use Ag paste from the point of view of price and resistance value. Considering migration resistance, use Heg-C paste, and the blending ratio is as high as the resistance. From this point of view, it is best to make 8g 50% by weight or more. Also, Ag
In order to minimize exposure of the paste, it is also effective to place C paste on top of Ag paste.
また、金属箔としてはＣｕＴ３． Ａ１％ｉ、 Ｃｒ箔
等やこれらにＡｕ、 Ｓｎ、ハンダ＋ Ｎｉ等のメツキ
を施したものが、さらに金属薄膜としては前記導電体に
設けられたメツキ層や、カーボンペーストにより形成さ
れた導電体上へのメツキ、スパッタリングや蒸着による
＾Ｕ薄膜やＩＴＯ薄膜等が例示される。Moreover, as a metal foil, CuT3. A1%i, Cr foil, etc., or those plated with Au, Sn, solder + Ni, etc., and metal thin films such as plating layers provided on the conductor or conductors formed with carbon paste. Examples include ^U thin film and ITO thin film formed by plating, sputtering, or vapor deposition.
なお、前記ヒートシールコネクター１にある接続部分の
導電部間に設けられる熱接着性接着剤には一般に公知の
ものを用いることができ、熱可塑性、熱硬化性、あるい
は熱可塑性と熱硬化性樹脂のブレンドがあげられる。更
に詳しく例示すると、熱硬化性接着剤としてはポリアミ
ド系、ポリエステル系、アイオノマー系、ＥＶＡ、ＥＡ
Ａ、ＥＭＡ、ＥＥＡなどのポリオレフィン系、各種合成
ゴム系のもの、さらにはこれらの変性物、複合物があげ
られる。熱硬化性接着剤としてはエポキシ樹脂系、ウレ
タン系、アクリル系、シリコーン系クロロプレン系、ニ
トリル系などの合成ゴム類、もしくはこれらの混合物が
例示されるが、スプリングバックによる導通不良の防止
という点から、熱硬化性とすることが良く、反応速度の
点から一液加熱硬化型エポキシ樹脂を含んだものとする
のが良い。これらには、いずれの場合も硬化剤、加硫荊
、制御削、劣化防止剤、耐熱添加剤、熱伝導向上剤、粘
着付与剤、軟化剤１着色剤などが適宜添加されてもよい
し、信顧性向上の点から不純物イオンはなるべく無い方
がよく、金属不活性剤の添加等も考えられる。It should be noted that generally known thermal adhesives can be used as the thermal adhesive provided between the conductive parts of the connection part in the heat seal connector 1, such as thermoplastic, thermosetting, or thermoplastic and thermosetting resin. A blend of To give more detailed examples, examples of thermosetting adhesives include polyamide, polyester, ionomer, EVA, and EA.
Examples include polyolefins such as A, EMA, and EEA, various synthetic rubbers, and modified products and composites thereof. Examples of thermosetting adhesives include synthetic rubbers such as epoxy resin, urethane, acrylic, silicone, chloroprene, and nitrile, or mixtures thereof, but from the viewpoint of preventing conduction failure due to springback. It is preferable to use a thermosetting resin, and from the viewpoint of reaction rate, it is preferable to use a one-component heat-curable epoxy resin. In any case, a curing agent, a vulcanizing agent, a control material, a deterioration inhibitor, a heat-resistant additive, a thermal conductivity improver, a tackifier, a softener, a coloring agent, etc. may be added as appropriate. From the viewpoint of improving reliability, it is better to have as few impurity ions as possible, and adding a metal deactivator may also be considered.
また、このヒートシールコネクターｌの非熱接着性レジ
スト膜７の少なくとも接続部分に近接する部分は、熱接
着性を有していなければならないが、ここに用いられる
熱接着性材料は、接続部の導電部間に設けられる接着剤
で例示したものと同様なものを例示することができる。Furthermore, at least the portion of the non-thermally adhesive resist film 7 of this heat-seal connector l that is close to the connecting portion must have thermal adhesive properties, and the thermally adhesive material used here must be suitable for the connecting portion. The same adhesives as those exemplified above can be used as the adhesive provided between the conductive parts.
また、これら２箇所の接着剤は同種のものでも、また異
種のものでもよいが、隙間を完全に無くすという点から
相溶性の良いものを選択することが好ましい。Further, the adhesives at these two locations may be of the same type or different types, but it is preferable to select adhesives with good compatibility from the viewpoint of completely eliminating gaps.
このようなヒートシールコネクター１を用いて回路基板
８での電気回路を接続するのであるが、接続の際、導通
に関与する接続部分より幅広のヒートシールヘッドによ
り熱圧着することや、二度熱圧着すること等により、本
発明の導電部分の露出を無くした電気回路の接続ＩＩ造
が得られる。Such a heat-seal connector 1 is used to connect an electric circuit on the circuit board 8, but when making the connection, it is necessary to thermocompress with a heat-seal head that is wider than the connection part involved in continuity, or to heat it twice. By crimping or the like, it is possible to obtain the electrical circuit connection structure of the present invention in which the conductive portion is not exposed.
第３図の具体例では、導電部として導電性金属線６を用
いた例で非熱接着性レジスト膜７の一端に連続して熱接
着性レジスト膜５を備えて該金属線６を露出させた接続
部分を形成したのである。In the specific example shown in FIG. 3, a conductive metal wire 6 is used as the conductive part, and a heat-adhesive resist film 5 is continuously provided at one end of a non-thermally adhesive resist film 7 to expose the metal wire 6. In this way, a connecting part was formed.
実施例−１
２５μｍのＰＥＴフィルム上にＡｇペーストにて０．４
ｆｉピンチのパターンを形成し、その間に接着剤層を設
け、この接着剤と同し材料でレジスト膜を形成した。こ
のヒートシールコネクターを設けてレジストの部分を断
続的に加圧を繰り返して回路基板とヒートシール接続し
た。Example-1 0.4% Ag paste on 25μm PET film
A fi pinch pattern was formed, an adhesive layer was provided between them, and a resist film was formed using the same material as the adhesive. This heat-seal connector was provided and the resist portion was repeatedly pressurized intermittently to heat-seal connect it to the circuit board.
この場合、隣接する電極間に５０Ｖの電圧を印加し、６
０℃９５％Ｒ）ｌ中に１０００時間放置したが、電解腐
食、マイグレーションの発生は認められなかった。また
、剥離強度を測定したところ、平均１５００■／ｃｓと
かなり高い値を得た。In this case, a voltage of 50V is applied between adjacent electrodes,
Although it was left for 1000 hours in 0°C 95% R), no electrolytic corrosion or migration was observed. Furthermore, when the peel strength was measured, a fairly high value of 1500 .mu./cs was obtained on average.
実施例−２
２５μｍのＰＥＴフィルム上に熱硬化性接着剤を形成し
、この上に約８０μｍピッチで線径２０μｍのＮｉの＾
Ｕメツキ線を約２７３が埋まるように配設した。この上
に、接続部分に近接する部分には熱接着性レジスト膜を
、またそれ以外の部分には非熱接着性レジスト膜を形成
した。Example-2 A thermosetting adhesive was formed on a 25 μm PET film, and Ni wire with a wire diameter of 20 μm was placed on top of it at a pitch of about 80 μm.
The U-metsuki line was arranged so that approximately 273 spaces were filled. On top of this, a heat-adhesive resist film was formed on a portion close to the connection portion, and a non-thermal-adhesive resist film was formed on the other portions.
このヒートシールコネクターを用いて、０．３鶴ピツチ
の回路基板どうしを熱接着性を有するレジスト層とを同
時にヒートノールするようにして接続した。実施例１と
同様に隣接する電極間に５０Ｖの電圧を印加し、６０℃
９５％ＲＨ中に１０００時間放置したが、電食、マイグ
レーションによるリークは発生しなかった。また、剥離
強度を測定したところ、平均１．３ｋｇ／ａｍとかなり
高い値が得られた。Using this heat seal connector, circuit boards of 0.3 square pitch were connected to each other by simultaneously heat sealing the resist layer having thermal adhesive properties. As in Example 1, a voltage of 50V was applied between adjacent electrodes, and the temperature was increased to 60°C.
Although it was left in 95% RH for 1000 hours, no electrical corrosion or leakage due to migration occurred. Furthermore, when the peel strength was measured, a fairly high value of 1.3 kg/am on average was obtained.
本発明は、電気回路パターンがヒートシール接続部分で
露出しており、少なくとも該接続部分に近接する部分の
レジスト膜が熱接着性部を備えていることにより、従来
の欠点を排除し、ヒートシールコネクターを用いた電気
回路の接続を信頼性ある形態とすることが可能であり、
長期間にわたり強度的にも安全に維持でき、しかも導電
部分の露出をなくし劣化防止に役立ち、熱伝導も大幅に
向上できるし、結露による電解腐蝕もないと共にマイグ
レーションによるリーク発生もなく、安全な接続状態を
長期にわたって行いうるほか、更に熱接着性レジスト膜
は充分な厚みをとることができるので剥離強度の向上と
いう効果も得られるなどの効果がある。The present invention eliminates the drawbacks of the conventional method by eliminating the conventional drawbacks by exposing the electrical circuit pattern at the heat-sealed connection part, and at least the part of the resist film near the connection part having a heat-adhesive part. It is possible to connect electrical circuits using connectors in a reliable manner,
It can maintain strength and safety over a long period of time, eliminates the exposure of conductive parts, helps prevent deterioration, greatly improves heat conduction, and has no electrolytic corrosion due to condensation and no leakage due to migration, making it a safe connection. In addition to being able to maintain the condition for a long period of time, the heat-adhesive resist film can also have a sufficient thickness, which has the effect of improving peel strength.
第１図は本発明に用いられるヒートシールコネクターの
一部の斜視図、第２図は使用状態の接続構造の縦断面図
、第３回は他の実施例の一部の斜視図、第４図は従来の
接続構造を示す縦断面図である。
■・・・ヒートシールコネクター、２・・・基材フィル
ム、３・・・熱接着性接着剤、４・・・導電パターン、
５・・・熱接着性レジスト膜、６・・・金属線、７・・
・非熱接着性レジスト膜、８・・・回路基板。Fig. 1 is a perspective view of a part of the heat seal connector used in the present invention, Fig. 2 is a vertical sectional view of the connection structure in use, Part 3 is a perspective view of part of another embodiment, and Fig. 4 is a perspective view of a part of the heat seal connector used in the present invention. The figure is a longitudinal sectional view showing a conventional connection structure. ■ Heat seal connector, 2 Base film, 3 Heat adhesive, 4 Conductive pattern,
5... Heat adhesive resist film, 6... Metal wire, 7...
- Non-thermal adhesive resist film, 8... circuit board.
Claims (4)
ト、金属箔、金属薄膜層のいずれか、またはその組合せ
から電気回路パターンが形成され、レジスト膜で被覆さ
れたコネクターであって、該電気回路パターンがヒート
シール接続部分で露出しており、少なくとも該接続部分
に近接する部分のレジスト膜が熱接着性部を備えている
ことを特徴とする電気回路接続用ヒートシールコネクタ
ー。(1) A connector in which an electrical circuit pattern is formed on an electrically insulating base material from any one of a conductive metal wire, a conductive paste, a metal foil, a metal thin film layer, or a combination thereof, and is covered with a resist film. A heat-seal connector for connecting an electric circuit, wherein the electric circuit pattern is exposed at a heat-seal connection portion, and at least a portion of the resist film close to the connection portion includes a heat-adhesive portion.
が、下層がＡｇ含有ペーストで表層がカーボンペースト
である請求項１記載のヒートシールコネクター。(2) The heat-seal connector according to claim 1, wherein the conductive paste used for the conductive circuit pattern has a lower layer of an Ag-containing paste and a surface layer of a carbon paste.
含む熱硬化成分を含んだ接着剤層である請求項１または
２記載のヒートシールコネクター。(3) The heat-seal connector according to claim 1 or 2, wherein the heat-adhesive portion of the resist film is an adhesive layer containing a thermosetting component containing an epoxy resin.
て、ヒートシールコネクターでヒートシール接続するに
際し、該接続部分に近接する熱接着性レジスト膜を同時
に熱圧着することを特徴とするヒートシールコネクター
を用いた電気回路の接続方法。(4) A heat-seal connector is used, which is characterized in that when heat-sealing a heat-seal connection with a heat-seal connector at a heat-seal connection portion of an electric circuit pattern, a heat-adhesive resist film adjacent to the connection portion is simultaneously thermocompressed. How to connect electrical circuits.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2106542A JPH0695463B2 (en) | 1990-04-24 | 1990-04-24 | Heat seal connector for electric circuit connection and its connection method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2106542A JPH0695463B2 (en) | 1990-04-24 | 1990-04-24 | Heat seal connector for electric circuit connection and its connection method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH046771A true JPH046771A (en) | 1992-01-10 |
| JPH0695463B2 JPH0695463B2 (en) | 1994-11-24 |
Family
ID=14436262
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2106542A Expired - Fee Related JPH0695463B2 (en) | 1990-04-24 | 1990-04-24 | Heat seal connector for electric circuit connection and its connection method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0695463B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06181074A (en) * | 1992-03-04 | 1994-06-28 | Shin Etsu Polymer Co Ltd | Thermally adhesive flexible connecting member |
| JP2005011312A (en) * | 2003-05-29 | 2005-01-13 | Matsushita Electric Ind Co Ltd | Transparent touch panel |
-
1990
- 1990-04-24 JP JP2106542A patent/JPH0695463B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06181074A (en) * | 1992-03-04 | 1994-06-28 | Shin Etsu Polymer Co Ltd | Thermally adhesive flexible connecting member |
| JP2005011312A (en) * | 2003-05-29 | 2005-01-13 | Matsushita Electric Ind Co Ltd | Transparent touch panel |
| JP4622249B2 (en) * | 2003-05-29 | 2011-02-02 | パナソニック株式会社 | Transparent touch panel |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0695463B2 (en) | 1994-11-24 |
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