JPH0466287A - Manufacture of electrical circuit device - Google Patents

Abstract

PURPOSE:To prevent a semiconductor device connected with a conductor from breaking by state electricity and to prolong its life by cutting a film and the conductor formed on it through laser beam. CONSTITUTION:The film 13 is made, for example, of polyimide or glass epoxy resin, etc., and flexible and a conductor 21 plated with Au or Su is formed on one of its surfaces, and a large scale integrated circuit 22 is connected electri cally with this conductor 21. In this way, an electrical circuit device 19 having a TAB structure stretches long and slenderly in the longitudinal direction of the film 13. The large scale integrated circuit 22 is welded to many conductors 21 formed on the film 13 and connected electrically. The film 13 and the conduc tor 21 are cut by the laser beam 17 at the same time to obtain plural electrical circuits.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention is applicable to, for example, T A B (Tape Auto
The present invention relates to a method of manufacturing an electric circuit device having a mated bonding (bonding) structure.

Conventional technology A typical prior art example is shown in FIG.

A conductor 2 is formed on the elongated film 1, and a large-scale integrated circuit (abbreviated as LSI) 3 fixed to the film 1 is electrically connected to the conductor 2.
A large number of electric circuit devices 4 having the B structure are formed in the longitudinal direction of the film 1 (left-right direction in FIG. 12). In order to separate each electric circuit device 4 and manufacture individual electric circuit devices 4, each electric circuit having a TAB structure is manufactured using a fixed mold 5 and another mold 6. Device 4 is punched out. The mold 5.6 is made of metal.

FIG. 13 is a simplified side view of the prior art shown in FIG. 12. The film 1 is wound by a reel 7.8, and the film 1 is moved along the arrow 9, and the mold 6 is driven by the drive device 10 to punch out the film 1 and the conductor 2, thereby forming a product. An electric circuit device 4 having a TAB structure can be obtained.

Problems to be Solved by the Invention In such prior art, when punching the electric circuit device 4 using the molds 5 and 6, the mold 6 comes into contact with the conductor 2, especially in FIG. The scale integrated circuit 3 is likely to be destroyed.

In order to solve this problem, devises have been made to prevent the film 1 from being charged, but it is not possible to completely prevent the destruction of the large-scale integrated circuit 3.

Another problem with this prior art is that it is cumbersome to maintain. There is a lifespan for the number of punches of the molds 5 and 6, and that is,
It is about 100,000 to 1 million times, so for example 1 to 1 million times.
It needs to be replaced every three months. These molds 5 and 6 must be replaced when the electric circuit device 4 is of a different model and has a different size. Particularly in a factory with many product models, the molds 5 and 6 must be replaced and There is a problem in that the frequency of preparatory work for this is high and the work efficiency is reduced.

SUMMARY OF THE INVENTION An object of the present invention is to provide a method for manufacturing an electric circuit device that prevents the adverse effects of static electricity on the electric circuit device, is easy to maintain, and can be manufactured into a desired shape. That's true.

Means for Solving the Problems The present invention is characterized in that a conductor is formed on a long and thin film, a semiconductor element is connected to the conductor, and the film and the conductor are cut using a laser beam. This is a method of manufacturing an electric circuit device.

According to the present invention, a semiconductor element is connected to a conductor formed on a long and thin film, and since the film and the conductor are cut using a laser beam, the semiconductor element is not damaged by static electricity. You can prevent it from being destroyed. Moreover, since the laser beam is used to cut as described above, maintenance is extremely easy and can be carried out over a long period of time without any failure.
The film and conductor can be cut into desired shapes.

Embodiment FIG. 1 is a simplified side view of an embodiment of the present invention.
FIG. 2 is a front view of the manufacturing apparatus showing its specific configuration. A longitudinal film 13 with a TAB structure is visible, wound onto a reel 14.15, moved in the direction of the arrow A and cut by a laser beam 17 from a laser source 16, which cuts an electrical circuit with a TAB structure. A device 18 is obtained. The film 13 is supported below by a support member 18.

The main body 37 of this manufacturing apparatus is provided with a reel 38 for winding up an electrically insulating spacer that is wound over the tape 13 supplied from the reel 14. The tape 13 is guided by rollers 39 and 40, and a suitable tension is obtained by a step arm 41, and the film 13 shown in FIG. 6 mentioned above is wound onto the reel 15. Laser source 1
Reference numeral 6 indicates a positioning hole 23, 24 (see FIG. 5 described later) for cutting the film 13 stretched in a horizontal plane by an X-Y table 36, which meshes with a feed wheel 42, which is a sprocket wheel, and cuts the film 13 stretched in a horizontal plane. 13 can be positioned with high precision. With the film 13 thus stopped, the electric circuit device 19 is cut using the laser beam 17.

FIG. 3 is a sectional view showing the state of the electric circuit device 19 when it is cut. The film 13 is made of, for example, polyimide or glass epoxy resin, is visible, has a conductor 21 plated with Au or Su on its surface, and the large-scale integrated circuit 22 is electrically connected to the conductor 21. connected.

In this way, one electric circuit device having the TAB structure extends in a long and narrow direction in the longitudinal direction of the film 13 (in the left-right direction of Figure 1 and Figure 3 (21). Figure 4 is a plan view of one electric circuit device. Large scale The integrated circuit 22 is welded and electrically connected to a large number of conductors 21 formed on the film 13.

FIG. 5 is a plan view of the film 13. This film 1
Large scale integrated circuits 22 are provided on 3 at intervals along its length and connected to conductors 21 as described above.

Positioning holes 2324 for the sprocket foil are formed on both sides of the film 13, and the film 13 and the conductor 2324 are aligned using the laser beam 17 at the position indicated by the imaginary line 25.
1 are cut at the same time, and as shown in FIG. 6, through holes 26 are formed and a plurality of electrical circuit devices 19 are obtained.

A specific configuration of the laser source 16 is shown in FIG. The laser light from the AC-driven semiconductor laser element 27 is repeatedly reflected between the front mirror 28 and the rear mirror 29, and is amplified. The laser light is focused from the autocollimator 30 through the lens 31, and then passes through the mirror 32 that changes direction. , the film 13 is irradiated with the laser light 17.

FIG. 8 is a block diagram showing the electrical configuration of the manufacturing apparatus. A processing circuit 33 realized by a microcomputer or the like is inputted with the shape 25 to be cut of the film 13 (see FIG. 5 described above) from a key human power means 34 and stored in a memory 35. 16 drives the laser source 16 in a horizontal plane, thus moving the laser beam 17 in the horizontal plane.

Referring to FIG. 9, the processing circuit 33 performs step a during operation.
1 to step a2, the route 25 to be cut stored in the memory 35 is read out, and the X-Y table 36 is read out.
is moved in step a3 to simultaneously cut the film 13 and the conductor 21 with the laser beam 17, thereby manufacturing the electric circuit device 19.

FIG. 10 is a plan view of a film 13 according to another embodiment of the present invention. This film 43 is stored in the memory 3 of the processing circuit 33.
5 is cut in advance using the laser beam 17 according to the shape shown by the imaginary line 44, and therefore the 11th
A through hole 45 corresponding to the shape 44 is formed as shown in the figure, and each electric circuit device 46 is obtained. The rest of the configuration is similar to the configuration of the previous embodiment.

The present invention can be implemented not only for manufacturing an electric circuit device having a TAB structure, but also for manufacturing an electric circuit device having other configurations. Other semiconductor elements may be used instead of the large-scale semiconductor integrated circuit 22.

Effects of the Invention As described above, according to the present invention, a laser beam is used to cut the film and the conductor formed thereon, so that the semiconductor element connected to the conductor is not destroyed by static electricity. It also has a long service life, is easy to maintain, and can cut the film and conductor into desired shapes at the same time. Even in factories with many product models, work efficiency can be improved.

[Brief explanation of the drawing]

FIG. 1 is a side view of an embodiment of the present invention, FIG. 2 is a front view of the embodiment, and FIG. 3 is an enlarged sectional view of the film 13.
FIG. 4 is a plan view of the electric circuit device 19, FIG. 5 is a plan view of the film 13, FIG. 6 is a plan view showing the state in which the electric circuit device 19 is cut from the film 13, and FIG. 7 is a plan view of the electric circuit device 19. A block diagram of the generation source 16, FIG. 8 is a block diagram showing the electrical configuration of an embodiment of the present invention, FIG. 9 is a flowchart for explaining the operation of the processing circuit 33 shown in FIG. 8, and FIG. 11 is a plan view showing a state in which the film 13 shown in FIG. 10 is cut to produce an electric circuit device 46, and FIG. 12 is a plan view of a film 13 according to another embodiment of the present invention. Cross-sectional view of the technology, FIG. 13 is a simplified front view of the prior art. 13... Film, 16... Laser light generation source, 17
...Laser light, 19.46...Electric circuit device, 21.
・Conductor, 22...Large scale integrated circuit, 33...Processing circuit, 34...Key manual means, 35...Memory, 36
...XY Child Table Agent Patent Attorney Number of Strokes Kei Part □19 Figure Figure F1 Figure Figure Figure

Claims (1)

[Claims] An electric circuit device characterized in that a conductor is formed on an elongated film, a semiconductor element is connected to the conductor, and the film and the conductor are cut using a laser beam. Production method.