JPH0465477U - - Google Patents
Info
- Publication number
- JPH0465477U JPH0465477U JP1990109263U JP10926390U JPH0465477U JP H0465477 U JPH0465477 U JP H0465477U JP 1990109263 U JP1990109263 U JP 1990109263U JP 10926390 U JP10926390 U JP 10926390U JP H0465477 U JPH0465477 U JP H0465477U
- Authority
- JP
- Japan
- Prior art keywords
- surface mount
- solder
- adhesive
- view
- sopic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/011—Apparatus therefor
- H10W72/0113—Apparatus for manufacturing die-attach connectors
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990109263U JPH0465477U (enFirst) | 1990-10-16 | 1990-10-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990109263U JPH0465477U (enFirst) | 1990-10-16 | 1990-10-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0465477U true JPH0465477U (enFirst) | 1992-06-08 |
Family
ID=31856435
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990109263U Pending JPH0465477U (enFirst) | 1990-10-16 | 1990-10-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0465477U (enFirst) |
-
1990
- 1990-10-16 JP JP1990109263U patent/JPH0465477U/ja active Pending