JPH0465477U - - Google Patents
Info
- Publication number
- JPH0465477U JPH0465477U JP10926390U JP10926390U JPH0465477U JP H0465477 U JPH0465477 U JP H0465477U JP 10926390 U JP10926390 U JP 10926390U JP 10926390 U JP10926390 U JP 10926390U JP H0465477 U JPH0465477 U JP H0465477U
- Authority
- JP
- Japan
- Prior art keywords
- surface mount
- solder
- adhesive
- view
- sopic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims 2
- 230000008018 melting Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10926390U JPH0465477U (cs) | 1990-10-16 | 1990-10-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10926390U JPH0465477U (cs) | 1990-10-16 | 1990-10-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0465477U true JPH0465477U (cs) | 1992-06-08 |
Family
ID=31856435
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10926390U Pending JPH0465477U (cs) | 1990-10-16 | 1990-10-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0465477U (cs) |
-
1990
- 1990-10-16 JP JP10926390U patent/JPH0465477U/ja active Pending