JPH0464830B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention was developed for use in an abrasive tape device used for chamfering floppy disk heads. However, the present invention can be widely used in polishing tape devices used for other purposes.

Structure of conventional example and its problems Patent application No. 1983-224345 (filed on December 20, 1988) filed by the present applicant describes a case in which an abrasive tape device is used for chamfering a floppy disk head. There is prior art. Although this prior art does not specifically mention the method of using the abrasive tape, the following method is actually adopted.
In this method, as shown in FIG.
The abrasive tape is moved in one direction over its entire length to perform the abrasive operation, and when it reaches the end, the abrasive tape a
By unwinding the tape and feeding the polishing tape a or the workpiece one pitch in the lateral direction, moving the polishing tape a in the circumferential direction again over the entire length to perform the polishing operation, and repeating this process, The polishing locus shown in FIG. 7P is formed on the polishing tape a. Polishing tape a used for precision polishing such as chamfering of floppy disk heads is expensive, but according to the above method of use, as shown by the polishing trajectory P, the entire surface of polishing tape a can be used effectively, resulting in cost savings. advantageous to

However, the above-mentioned prior art has the following problems.

1 To unscrew the polishing tape a, use the polishing tape a
It is necessary to cover the entire length of the shaft, which takes a long time and is inefficient.

2. Abrasive grains and abrasive powder generated during polishing are wound into the winding portion on the wrapping roll each time the polishing tape a reciprocates, thereby staining the next effective polishing surface and adversely affecting the next polishing operation.

3 At the final stage, when almost all of the effective polishing surface of polishing tape a has been used, a large amount of abrasive grains and polishing powder generated so far adhere to the next effective polishing surface, resulting in the polishing work in the final stage The machining accuracy becomes very poor.

OBJECT OF THE INVENTION The present invention aims to solve the problems of the prior art described above.

Structure of the Invention The present invention focuses on the fact that the problems of the prior art described above are caused by reciprocating the abrasive tape over its entire length, and in order to solve this problem, the abrasive tape is divided in the length direction. The device is characterized in that it is used by reciprocating each divided portion.

That is, in order to achieve the above object, the present invention divides an abrasive tape in the length direction into each predetermined stroke, and in the polishing operation using each divided portion, the abrasive tape is reciprocated within the range of the stroke, and the abrasive tape and the workpiece are By giving a relative lateral feed between the tape and the object, a polishing trajectory consisting of multiple parallel lines is drawn across the entire width of the polishing tape, and when the polishing work of a certain divided portion is completed. , the polishing tape is transferred by one stroke and then the polishing operation is performed using the next divided portion.

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be specifically explained below by taking as an example a method of using a polishing tape in a polishing tape device used for chamfering a floppy disk head.

FIG. 2 shows the floppy disk head A, in which the outer edge 2 of the surface 1 to be processed requires highly accurate curved surface polishing.

The floppy disk head (hereinafter referred to as the workpiece) A is subjected to a curved surface polishing process by a polishing tape device B shown in FIG. The polishing tape 3 of this device B is wound around a rotating drum 4, and both ends are wound around wrapping rolls 5 and 6, respectively. When one of the wrapping rolls 5 is rotationally driven by a motor (not shown) connected thereto, the polishing tape 3 travels in the polishing direction shown by the arrow in FIG. 3 and is held by the workpiece holding device C. The processed workpiece A is polished. At this time, the other wrapping roll 6 is driven with an appropriate braking force applied thereto.

The workpiece A is polished while the polishing tape 3 travels a predetermined distance L (FIG. 1) in the polishing direction. When the polishing work of the workpiece A is completed, the polishing tape device B is lowered (the workpiece holding device C may be raised), and the workpiece A is removed from the polishing surface 7 of the polishing tape 3.
Move further away. During this time, the other wrapping roll 6
is rotationally driven by a motor (not shown) connected thereto, and the polishing tape 3 is wound back the predetermined distance L in the direction opposite to the arrow shown in FIG. The wrapping roll 5 that is driven at this time
As described above, an appropriate braking force is applied to the brake.

During unwinding of the abrasive tape 3, the movable table 8 supporting the rotary drum 4 and both wrapping rolls 5, 6 is traversely fed by the feed threaded rod 9, and is moved laterally at a predetermined pitch h (Fig. 1). Moving.

Further, while the polishing tape 3 is being unwound, the workpiece A of the workpiece holding device C is replaced.

Next, the polishing tape device B rises, and the polishing tape 3
A polishing operation similar to that described above is performed with the workpiece A pressed against the polishing surface 7 of the workpiece A. From now on, polishing tape 3
The polishing operation by winding back with horizontal feeding and running the polishing tape 3 in the polishing direction is repeated, and as shown in FIG. A polishing trajectory P, which is a parallel line, is drawn across the entire width in the width direction.
In FIG. 1, the trajectory during unwinding is also shown by a broken line.

When the polishing work of the divided portion for the stroke L is completed, the polishing tape 3 is transferred by one stroke L, and the same polishing work as described above is performed on the next divided portion.

In this embodiment, in order to perform a high-precision curved surface polishing process as shown in FIG. 2 on the outer edge 2 of the surface 1 to be processed of the workpiece A, the workpiece A is shown in FIGS. 4 and 5. Rotation Q, oscillation R, and pressing motion S are applied to the polishing surface 7. 10 is a spring that urges the workpiece A toward the polishing surface 7.

Therefore, when viewed in detail, the polishing locus P on the polishing tape 3 is formed in a spiral manner, as shown in FIG. 6. Therefore, as shown in FIG. 6, if the polishing tape 3 is used so that the adjacent polishing trajectories P are slightly shifted in the running direction of the polishing tape 3,
Even if the horizontal feed pitch h is made smaller, the area of the crossing portion can be minimized and the effective usable area of the polishing tape 3 can be increased, which is preferable.

As shown in the above embodiment, the present invention provides an abrasive tape 3
is divided in the length direction into every predetermined stroke L, and in the polishing work using each divided portion, the polishing tape 3 is reciprocated within the range of the stroke L, and a relative lateral movement is performed between the polishing tape 3 and the workpiece A. By giving , a polishing locus P consisting of a plurality of parallel lines is drawn across the entire width of the polishing tape 3 in the width direction, and when the polishing work of a certain divided portion is completed, the polishing tape is moved in one stroke. Although the present invention is characterized in that the polishing operation is carried out by the next divided portion after being transferred by L, it can be configured in various ways other than those shown in the above embodiment.

For example, in the above embodiment, the lateral movement is applied to the polishing tape device B side, but the lateral movement may be applied to the workpiece holding device C side. Moreover, in the above embodiment,
Although the polishing work is performed only when the polishing tape 3 travels in one direction, it can be configured so that the polishing work can be performed in both directions of reciprocating motion. Further, in the above embodiment, the polishing trajectory P coincides with the running direction of the polishing tape 3, but the polishing trajectory P may be made to run diagonally by applying a continuous lateral movement to the workpiece holding device C side. . Furthermore, the present invention can also be applied to a method of using a polishing tape in a general polishing tape device B in which only a pressing motion S is applied to a workpiece A.

Effects of the Invention Since the present invention has the above-mentioned configuration, it is possible to effectively utilize the entire surface of the abrasive tape as in the prior art, which is advantageous in terms of cost, and the time for unwinding can be significantly shortened, resulting in efficient polishing work. can proceed.

Furthermore, in the present invention, the divided parts of the polishing tape are sequentially used for each predetermined stroke, and the polishing work is always performed with the divided part having a new polishing surface. Therefore, the adverse effects caused by abrasive grains and abrasive powder seen in the prior art are avoided. can be eliminated, and machining accuracy can be improved.

[Brief explanation of the drawing]

Fig. 1 is a developed view of an abrasive tape showing the principle of the present invention, Fig. 2 is a perspective view showing an example of a workpiece, and Fig. 3 is a developed view of an abrasive tape showing the principle of the present invention.
The figure is a side view showing an example of the apparatus used in the method of the present invention, FIG. 4 is a side view showing the principle of one example of the polishing method, FIG. 5 is a front view thereof, and FIG.
An enlarged view showing an example, and FIG. 7 is a developed view of the polishing tape showing the polishing trajectory in the prior art. 3... Polishing tape, A... Workpiece, L... Stroke, P... Polishing trajectory.

Claims (1)

[Claims] 1. The polishing tape is divided into lengthwise sections for each predetermined stroke, and in polishing work using each divided portion, the polishing tape is run within the stroke range, and then the polishing tape is rewound by the length of the travel, and the polishing tape is By sequentially repeating the steps of moving the abrasive tape a predetermined pitch in the width direction relative to the workpiece and again running the abrasive tape for one stroke, the entire width of the abrasive tape in the width direction is A polishing locus is drawn as a plurality of parallel lines across the tape, and when the polishing work for a certain divided portion is completed, the polishing tape is transferred one stroke in the length direction of the tape, and the next divided portion is moved. A method of using an abrasive tape in an abrasive tape device, characterized in that the abrasive tape is transferred to an abrasive work by